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    Light Guide, Lighting Device and Image Reading Device
    41.
    发明申请
    Light Guide, Lighting Device and Image Reading Device 失效
    导光板，照明装置和图像读取装置

    公开(公告)号：US20090003016A1

    公开(公告)日：2009-01-01

    申请号：US12087549

    申请日：2006-12-27

    Applicant: Takeshi Ishimaru ,  Takashi Kishimoto ,  Hidemitsu Takeuchi ,  Tomihisa Saito ,  Hideki Azuma ,  Takahiro Hashimoto

    Inventor： Takeshi Ishimaru ,  Takashi Kishimoto ,  Hidemitsu Takeuchi ,  Tomihisa Saito ,  Hideki Azuma ,  Takahiro Hashimoto

    IPC: G03B27/54 ,  F21V8/00

    CPC classification number: G02B6/0055 ,  G03B27/54 ,  H04N1/02815 ,  H04N1/02835 ,  H04N1/0289 ,  H04N2201/02487 ,  H04N2201/02493

    Abstract: To provide a rod-like light guide and a line lighting device including the rod-like light guide, both of which are easy to include in an image reading device, a contact-type image sensor and an image reading device. For instance, a protruding portion having a flat or curved surface is formed by grinding an end face of a rod-like light guide in a longitudinal direction while leaving at least 80% of the surface area of the end face, and a reflective surface is formed by bonding a heat transfer film to the protruding portion. Thus, even if a portion of the protrusion portion melts when performing thermal processing on the heat transfer film, the portion will not jut out beyond a cross-sectional area of the rod-like light guide, and the rod-like light guide can be easily contained in a case.

    Abstract translation: 为了提供一种杆状光导和包括棒状光导的线照明装置，两者都易于包括在图像读取装置中，接触型图像传感器和图像读取装置中。 例如，具有平坦或弯曲表面的突出部分通过在纵向方向上研磨棒状导光体的端面而形成，同时留下端面的至少80％的表面积，反射表面为 通过将热转印膜粘合到突出部分而形成。 因此，即使当在传热膜上进行热处理时，突出部分的一部分熔化，该部分也不会突出超过棒状导光体的横截面积，棒状光导可以 容易包含在案件中。

    Method for manufacturing sensor frame for image sensor
    42.
    发明授权
    Method for manufacturing sensor frame for image sensor 有权
    图像传感器传感器框架的制造方法

    公开(公告)号：US07177056B2

    公开(公告)日：2007-02-13

    申请号：US10159125

    申请日：2002-06-03

    Applicant: Toshio Matsumoto

    Inventor： Toshio Matsumoto

    IPC: H04N1/04

    CPC classification number: H04N1/0318 ,  H04N2201/02487 ,  H04N2201/03112 ,  H04N2201/03141 ,  H04N2201/03145

    Abstract: A sensor frame for an image sensor is manufactured in the step of forming a sensor frame for an image sensor by extrusion molding so that a frame support portion for supporting the frame is formed above a lens array holding portion, and the step of removing the thus-formed sensor frame support portion by machining while leaving parts of the support portion located at the longitudinally corresponding to the upper ends of the lens array holding portion. Accordingly, machined surfaces subjected to the machining exist outside the hollow space where the sensor ICs are located.

    Abstract translation: 在通过挤压成型形成用于图像传感器的传感器框架的步骤中制造用于图像传感器的传感器框架，从而在透镜阵列保持部分上方形成用于支撑框架的框架支撑部分，并且移除由此 形成的传感器框架支撑部分，同时留下位于与透镜阵列保持部分的上端纵向对应的支撑部分的部分。 因此，进行加工的加工表面存在于传感器IC所在的中空空间的外部。

    Illuminant module and method of manufacturing the same
    43.
    发明申请
    Illuminant module and method of manufacturing the same 审中-公开
    照明模块及其制造方法

    公开(公告)号：US20040160776A1

    公开(公告)日：2004-08-19

    申请号：US10368921

    申请日：2003-02-18

    Inventor： Po-Hua Fang ,  Shu-Ya Chiang

    IPC: F21S002/00

    CPC classification number: H04N1/02875 ,  H04N1/02815 ,  H04N1/02895 ,  H04N2201/02487

    Abstract: A manufacturing method for illuminant module is provided. The illuminant module, which is used to be installed in an image retrieving device, includes an illuminant, a transparent protective layer and a reflecting plated layer. The transparent protective layer envelops at least a part of the tube of the illuminant and protects the structure of the illuminant from being damaged by collision or compression caused by external forces. The reflecting plated layer, which, being installed in the transparent protective layer but situated at one side of the tube of the illuminant, is used to reflect a part of the light generated by the illuminant and direct the light to be emitted outwardly in the same direction, so that illumination efficiency and illuminant accuracy can be enhanced.

    Abstract translation: 提供了一种用于照明模块的制造方法。 用于安装在图像检索装置中的照明模块包括光源，透明保护层和反射镀层。 透明保护层包围发光体的管的至少一部分，并且保护光源的结构免受由外力引起的碰撞或压缩的损害。 安装在透明保护层中但位于发光体管的一侧的反射镀层用于反射由发光体产生的光的一部分并将其向外发射出来 方向，从而可以提高照明效率和光源精度。

    BUTTED SENSOR ARRAY WITH SUPPLEMENTAL CHIP IN ABUTMENT REGION
    46.
    发明申请
    BUTTED SENSOR ARRAY WITH SUPPLEMENTAL CHIP IN ABUTMENT REGION 失效
    传感器阵列与补充区域的补充芯片

    公开(公告)号：US20030043415A1

    公开(公告)日：2003-03-06

    申请号：US09320686

    申请日：1999-05-27

    Inventor： DOUGLAS E. PROCTOR

    IPC: H04N001/00

    CPC classification number: H01L27/14825 ,  H01L27/14868 ,  H04N1/03 ,  H04N1/1903 ,  H04N1/1933 ,  H04N1/1934 ,  H04N5/3692 ,  H04N2201/02487

    Abstract: The present invention relates to photosensitive chips for creating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. More specifically, the present invention relates to preferably providing a supplemental chip in each abutment region to enhance image quality.

    Abstract translation: 本发明涉及用于从原始图像产生电信号的感光芯片，例如在数字扫描仪，复印机，传真机或其他文件生成或再现装置中可以找到。 更具体地，本发明涉及优选地在每个邻接区域中提供补充芯片以增强图像质量。

    Solid state imaging device
    49.
    发明授权
    Solid state imaging device 失效
    固态成像装置

    公开(公告)号：US4987477A

    公开(公告)日：1991-01-22

    申请号：US430419

    申请日：1989-11-02

    Applicant: Masahiko Ikeno

    Inventor： Masahiko Ikeno

    IPC: H01L23/538 ,  H01L25/065 ,  H01L27/14 ,  H01L27/146 ,  H01L27/148 ,  H04N1/028 ,  H04N1/03 ,  H04N5/335 ,  H04N5/369 ,  H04N5/372

    CPC classification number: H04N1/1934 ,  H01L23/5385 ,  H01L25/0655 ,  H01L27/14825 ,  H04N1/03 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12043 ,  H01L2924/16152 ,  H01L2924/19107 ,  H04N2201/02487

    Abstract: A solid state imaging device has solid-state imaging-device chips each having a picture-element array and bonding pads, chip carriers each having long sides longer than the solid-state imaging-device chip and terminals electrically connected to corresponding bonding pads on the chip, a package board which carries the chip carriers, and external leads provided on the package board and electrically connected to the respective terminals of the chip carriers. In a method of assembling such a solid state imaging device, a plurality of solid-state imaging-device chips are mounted on respective chip carriers, and a plurality of imaging units are formed by electrically connecting the terminals of each chip carrier to the corresponding bonding pads. The imaging units are then arranged on the package board and the terminals of the imaging units are connected to the external leads, respectively. A test is conducted on the solid-state imaging-device chips of each imaging unit, and if a non-conforming chip is found, an imaging unit including the non-conforming chip is removed from the package board and a new imaging unit is secured to the package board in place of the removed chip.

    Abstract translation: 固态成像装置具有各自具有像素阵列和接合焊盘的固态成像器件芯片，每个芯片载体的长边长于固态成像器件芯片，并且端子电连接到固态成像器件芯片上的相应的焊盘 芯片，承载芯片载体的封装板，以及设置在封装板上并电连接到芯片载体的各个端子的外部引线。 在组装这种固态成像装置的方法中，将多个固态成像装置芯片安装在各个芯片载体上，并且通过将每个芯片载体的端子电连接到相应的键合而形成多个成像单元 垫 然后将成像单元布置在封装板上，并且成像单元的端子分别连接到外部引线。 对每个成像单元的固态成像器件芯片进行测试，并且如果发现不合格的芯片，则从封装板去除包括不合格芯片的成像单元，并且固定新的成像单元 到包装板代替去除的芯片。

    Method for determining aperture shape
    50.
    发明授权
    Method for determining aperture shape 失效
    确定孔径形状的方法

    公开(公告)号：US4959541A

    公开(公告)日：1990-09-25

    申请号：US389033

    申请日：1989-08-03

    Applicant: David W. Boyd

    Inventor： David W. Boyd

    IPC: G01J1/02 ,  G01J1/00 ,  G01J1/04 ,  G01J1/22 ,  G02B5/00 ,  H04N1/03

    CPC classification number: H04N1/00013 ,  G02B5/005 ,  H04N1/00031 ,  H04N1/00053 ,  H04N1/00082 ,  H04N1/03 ,  H04N2201/02487 ,  H04N2201/02493

    Abstract: A mathematical method for selecting the shape for an occluding aperture which is to be positioned at a predetermined aperture location in a light path extending between an illuminated line object and a linear photosensor array. Through use of the aperture selected according to the method, a light intensity measurement is obtained across the linear photosensor array which is uniformly proportional to the light intensity across the illuminated line object.

    Abstract translation: 一种数学方法，用于选择要被定位在在照明线对象和线性光电传感器阵列之间延伸的光路中的预定光圈位置的闭塞孔的形状。 通过使用根据该方法选择的孔径，在与光照线对象上的光强度成正比的线性光电传感器阵列上获得光强度测量。

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