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    Method for encapsulating electronic conductors
    51.
    发明授权
    Method for encapsulating electronic conductors 失效
    封装电子导体的方法

    公开(公告)号：US5510153A

    公开(公告)日：1996-04-23

    申请号：US102178

    申请日：1993-08-04

    Applicant: Peter F. Lilienthal, II ,  Ivan Pawlenko ,  Ching-Ping Wong

    Inventor： Peter F. Lilienthal, II ,  Ivan Pawlenko ,  Ching-Ping Wong

    IPC: B05D3/02 ,  H01R13/52 ,  B05D7/20 ,  H01B7/02

    CPC classification number: B05D3/029 ,  H01R13/5216 ,  Y10S439/936

    Abstract: Glass particles (14) are mixed within an uncured silicone resin (13). The fluid uncured resin is placed in a portion of a terminal block (11) and cured to form a gel (13') by subjecting it to microwaves in a microwave oven (22). Conductors (25, 26) to be interconnected are next inserted into the cured silicone gel and interconnected. The cured gel containing the glass particles thereafter constitutes a dependable insulator for the conductors, particularly the portions of the conductors that are interconnected.

    Abstract translation: 玻璃颗粒（14）在未固化的硅树脂（13）内混合。 将流体未固化的树脂放置在端子块（11）的一部分中并通过在微波炉（22）中将其经受微波来固化以形成凝胶（13'）。 待互连的导体（25,26）接着插入固化的硅氧烷凝胶中并相互连接。 含有玻璃颗粒的固化凝胶构成导体的可靠绝缘体，特别是互连的导体部分。

    Apparatus for fixturing modules
    52.
    发明授权
    Apparatus for fixturing modules 失效
    用于固定模块的装置

    公开(公告)号：US5470217A

    公开(公告)日：1995-11-28

    申请号：US332310

    申请日：1994-10-31

    Applicant: Peter F. Lilienthal, II ,  Ivan Pawlenko ,  Ching-Ping Wong

    Inventor： Peter F. Lilienthal, II ,  Ivan Pawlenko ,  Ching-Ping Wong

    IPC: B29C33/00 ,  B29C39/06 ,  B29C39/10

    CPC classification number: B29C39/06 ,  B29C33/0016 ,  B29C33/0038 ,  B29C39/10 ,  B29K2105/0061 ,  Y10S425/044 ,  Y10S439/936

    Abstract: A module, such as a terminal block (10), configured of a body (12) having an open end (20) and at least one window (24) spaced from the open end, is fixtured and sealed by way of a channel (28) comprised of a pair of parallel, spaced-apart, generally elastic walls (30,32) jointed by a bottom member (34). The walls (30,32) and the bottom member (34) run longitudinally a distance at least as long as the width of the terminal block (10) to allow the block to be received between, and to be held by, the walls. At least one protrusion extends out from a separate one of the walls (30,32) and the base member (34) for receipt in the window (24) in the terminal block to seal the same.

    Abstract translation: 诸如端子块（10）的模块由具有开口端（20）的主体（12）和与开口端间隔开的至少一个窗口（24）构成，通过通道（...）固定和密封 28）包括由底部构件（34）连接的一对平行的，间隔开的，大致弹性的壁（30,32）。 壁（30,32）和底部构件（34）纵向延伸至少与端子块（10）的宽度一样长的距离，以允许块被容纳在壁之间并由壁保持。 至少一个突出部从单独的一个壁（30,32）和基部构件（34）中伸出，以便接收在端子块中的窗口（24）中以将其密封。

    Encapsulation techniques which include forming a thin glass layer onto a polymer layer
    53.
    发明授权
    Encapsulation techniques which include forming a thin glass layer onto a polymer layer 失效
    包封技术包括在聚合物层上形成薄玻璃层

    公开(公告)号：US5439849A

    公开(公告)日：1995-08-08

    申请号：US191378

    申请日：1994-02-02

    Applicant: Richard McBride ,  Ching-Ping Wong

    Inventor： Richard McBride ,  Ching-Ping Wong

    IPC: H01L23/29 ,  H01L23/31 ,  H01L21/56

    CPC classification number: H01L23/291 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2924/0002 ,  H01L2924/12044

    Abstract: An encapsulant comprised of alternate layers of polymer and glass gives enhanced protection to semiconductor integrated circuit devices, which is much more effective than either glass or polymer encapsulations by themselves. In one embodiment, a semiconductor device (11) is covered by a polymer layer (13), the polymer layer being covered by a glass layer (14), and the glass layer being covered by a second polymer layer (15). The glass is preferably deposited by a plasma enhanced chemical vapor deposition apparatus (17 of FIG. 2 ).

    Abstract translation: 由聚合物和玻璃的交替层组成的密封剂对半导体集成电路器件提供了增强的保护，其比玻璃或聚合物封装本身更有效。 在一个实施例中，半导体器件（11）由聚合物层（13）覆盖，聚合物层被玻璃层（14）覆盖，玻璃层被第二聚合物层（15）覆盖。 玻璃优选通过等离子体增强化学气相沉积装置（图2的17）沉积。

    Electrical condition monitoring method for polymers
    56.
    发明授权
    Electrical condition monitoring method for polymers 失效
    聚合物电气状态监测方法

    公开(公告)号：US07663381B2

    公开(公告)日：2010-02-16

    申请号：US12082161

    申请日：2008-04-09

    Applicant: Kenneth S. Watkins, Jr. ,  Shelby J. Morris ,  Daniel D. Masakowski ,  Ching Ping Wong ,  Shijian Luo

    Inventor： Kenneth S. Watkins, Jr. ,  Shelby J. Morris ,  Daniel D. Masakowski ,  Ching Ping Wong ,  Shijian Luo

    IPC: G01N27/20

    CPC classification number: G01R31/1227 ,  G01N17/00 ,  G01N27/041 ,  G01N33/445

    Abstract: An electrical condition monitoring method utilizes measurement of electrical resistivity of a conductive composite degradation sensor to monitor environmentally induced degradation of a polymeric product such as insulated wire and cable. The degradation sensor comprises a polymeric matrix and conductive filler. The polymeric matrix may be a polymer used in the product, or it may be a polymer with degradation properties similar to that of a polymer used in the product. The method comprises a means for communicating the resistivity to a measuring instrument and a means to correlate resistivity of the degradation sensor with environmentally induced degradation of the product.

    Abstract translation: 电气状况监测方法利用导电复合材料降解传感器的电阻率的测量来监测聚合物产品（例如绝缘电线和电缆）的环境诱导的降解。 降解传感器包括聚合物基质和导电填料。 聚合物基质可以是在产物中使用的聚合物，或者它可以是具有与产物中使用的聚合物相同的降解性质的聚合物。 该方法包括用于将电阻率传递到测量仪器的装置以及将降解传感器的电阻率与产品的环境诱导的降解相关联的手段。

    High dielectric constant nano-structure polymer-ceramic composite
    57.
    发明授权
    High dielectric constant nano-structure polymer-ceramic composite 失效
    高介电常数纳米结构聚合物陶瓷复合材料

    公开(公告)号：US06544651B2

    公开(公告)日：2003-04-08

    申请号：US09860856

    申请日：2001-05-18

    Applicant: Ching-Ping Wong ,  Yang Rao

    Inventor： Ching-Ping Wong ,  Yang Rao

    IPC: B32B2738

    CPC classification number: H01G4/206 ,  C08K3/24 ,  C08K5/0091 ,  C08K5/098 ,  C08K5/12 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/3011 ,  H05K1/162 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: The present invention is directed to polymer-ceramic composites having high dielectric constants formed using polymers containing a metal acetylacetonate (acacs) curing catalyst. In particular, it has been discovered that 5 weight percent Co(III) acac can increase the dielectric constant of DER661 epoxy by about 60%. The high dielectric polymers are combined with fillers, preferably ceramic fillers, to form two phase composites having high dielectric constants. Composites having about 30 to about 90% volume ceramic loading and a high dielectric base polymer, preferably epoxy, have been discovered to have a dielectric constants greater than about 60. Composites having dielectric constants greater than about 74 to about 150 are also disclosed. Also disclosed are embedded capacitors with capacitance densities of at least 25 nF/cm2, preferably at least 35 nF/cm2, most preferably 50 nF/cm2. Methods to increase the dielectric constant of the two phase composites having high dielectric constants are also provided.

    Abstract translation: 本发明涉及使用含有金属乙酰丙酮（acacs）固化催化剂的聚合物形成的具有高介电常数的聚合物 - 陶瓷复合材料。 特别地，已经发现5重量％的Co（III）acac可以使DER661环氧树脂的介电常数提高约60％。 高介电聚合物与填料（优选陶瓷填料）组合以形成具有高介电常数的两相复合材料。 已经发现具有大约30至大约90体积的陶瓷负载和高电介质基础聚合物，优选环氧树脂的复合材料具有大于约60的介电常数。还公开了具有大于约74至约150的介电常数的复合材料。 还公开了具有至少25nF / cm 2，优选至少35nF / cm 2，最优选50nF / cm 2的电容密度的嵌入式电容器。 还提供了增加具有高介电常数的两相复合材料的介电常数的方法。

    Methods for encapsulating electronic devices
    59.
    发明授权
    Methods for encapsulating electronic devices 失效
    封装电子设备的方法

    公开(公告)号：US5348913A

    公开(公告)日：1994-09-20

    申请号：US102926

    申请日：1993-08-06

    Applicant: Richard McBride ,  Ching-Ping Wong

    Inventor： Richard McBride ,  Ching-Ping Wong

    IPC: H01L21/48 ,  H01L21/56 ,  H01L21/60

    CPC classification number: H01L21/56 ,  H01L21/4803 ,  H01L21/4807 ,  H01L2924/0002 ,  Y10S148/017 ,  Y10T29/49146

    Abstract: In a preferred embodiment of the invention, a substrate (11) is cleaned by immersing it in an organic solvent (17) and subjecting it to acoustic energy, immersing it in alcohol, immersing it in a surfactant, subjecting it to a cascading rinse in deionized water, baking it (FIG. 3 ), and thereafter subjecting it to ultraviolet light in an ozone ambient (FIG. 4). When the foregoing steps are followed, the contact angle is significantly reduced, and an encapsulant (14) that is thereafter applied provides more reliable protection to an encapsulated device (12) from outside contaminants.

    Abstract translation: 在本发明的一个优选实施方案中，通过将基材（11）浸入有机溶剂（17）中并对其进行声能，将其浸入酒精中，将其浸入表面活性剂中，使其进行级联漂洗 去离子水，烘烤（图3），然后在臭氧环境中对其进行紫外线（图4）。 当遵循上述步骤时，接触角显着降低，此后施加的密封剂（14）为外部污染物对封装装置（12）提供更可靠的保护。

    Method for encapsulating integrated circuit
    60.
    发明授权
    Method for encapsulating integrated circuit 失效
    密封电子设备的方法

    公开(公告)号：US5275841A

    公开(公告)日：1994-01-04

    申请号：US921654

    申请日：1992-07-30

    Applicant: Ching-Ping Wong

    Inventor： Ching-Ping Wong

    IPC: H01L23/29 ,  H01L23/31 ,  B05D5/12

    CPC classification number: H01L23/3142 ,  H01L23/296 ,  H01L23/3135 ,  H01L2924/0002

    Abstract: A silicone gel encapsulated integrated circuit (12) is placed in a container, the container being partially filled with a silicone elastomer (16) which is much more rugged than the gel. After the elastomer (16) hardens, it completely covers the gel encapsulation (14) and protects it and the integrated circuit device from the effects of rough handling. The gel, however, gives all of the protection from the external environment that it would in the absence of the elastomer encapsulation.

    Abstract translation: 将硅胶封装的集成电路（12）放置在容器中，容器部分地填充有比硅胶更坚固的硅氧烷弹性体（16）。 弹性体（16）硬化后，完全覆盖凝胶封装（14），并保护其和集成电路器件免受粗糙处理的影响。 然而，凝胶在没有弹性体封装的情况下给予外部环境的所有保护。

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