Abstract:
A semiconductor device includes an AlGaN film formed on a GaN film on a substrate, a gate electrode formed on the AlGaN film, and source and drain electrodes formed on either side of the gate electrode on the AlGaN film. An n-type InxGayAl1-x-yN film is interposed between the source and drain electrodes and the AlGaN film. Alternatively, the semiconductor device includes an n-type InxGayAl1-x-yN film formed on a GaN film on a substrate, a gate electrode formed on the InxGayAl1-x-yN film, and source and drain electrodes formed on either side of the gate electrode on the InxGayAl1-x-yN film.
Abstract translation:半导体器件包括形成在基板上的GaN膜上的AlGaN膜,形成在AlGaN膜上的栅电极,以及形成在AlGaN膜上的栅电极的两侧的源极和漏极。 在源电极和漏电极和AlGaN膜之间插入n型In x Ga y Al 1-x-y N膜。 或者,半导体器件包括形成在衬底上的GaN膜上的n型In x Ga y Al 1-x-y N膜,形成在In x Ga y Al 1-x-y N膜上的栅电极,以及形成在栅极两侧的源极和漏极 InxGayAl1-x-yN膜上的电极。
Abstract:
A non-aqueous secondary battery having an electrode group comprising a portion of exposed metal foil electrically connected to the positive electrode collector and covering the entire outer surface of the electrode group. Separator material is sandwiched between the foil and the negative electrode, which is positioned outwardly of the positive electrode, and separator material is also positioned between the foil covering of the electrode group and a negative polarity cell container. The positioning of the metal foil is such that if the battery is crushed, the separator material on the outermost side of the metal foil or between the metal foil and the negative electrode is broken first, so that the metal foil short-circuits with the inner wall of the cell container or the negative electrode, respectively.
Abstract:
A lateral bipolar transistor includes: a substrate; a first insulative region formed on the substrate; a first semiconductor region of a first conductivity type selectively formed on the first insulative region; a second insulative region formed so as to substantially cover the first semiconductor region; and a second semiconductor region of a second conductivity type different from the first conductivity type, a second semiconductor region being selectively formed, wherein: the second insulative region has a first opening which reaches a surface of the first semiconductor region, and the first semiconductor region has a second opening which reaches the underlying first insulative region, the second opening being provided in a position corresponding to the first opening of the second insulative region; the second semiconductor region is formed so as to fill the first opening and the second opening, thereby functioning as a base region; a lower portion of the second semiconductor region which at least fills the second opening is formed by lateral growth from a face of the first semiconductor region defining a side wall of the second opening; and the first semiconductor region includes an emitter region and a collector region formed therein.
Abstract:
A negative electrode is characterized by its composite particles constructed in such a manner that at least part of the surrounding surface of nuclear particles containing at least one of tin, silicon and zinc as a constituent element, is coated with a solid solution or an inter-metallic compound, which is composed of, the element included in the nuclear particles, and at least one other element except the elements included in the nuclear particles selected from a group comprising group 2 elements, transition elements, group 12 elements, group 13 elements and group 14 elements except carbon of the Periodic Table. The present invention is characterized that the lithium content of the nuclear particles of the composite particles is 40-95 atomic percent of the theoretical limit of lithium content of each constituent element of the nuclear particles. Further, the batteries are first charged at a constant current and upon reaching the predetermined voltage, are charged at a constant voltage. The current density during charging are set at not more than 5 mA/cm2 as a in the area where the positive and negative electrodes face each other.
Abstract:
A lateral bipolar transistor includes: a substrate; a first insulative region formed on the substrate; a first semiconductor region of a first conductivity type selectively formed on the first insulative region; a second insulative region formed so as to substantially cover the first semiconductor region; and a second semiconductor region of a second conductivity type different from the first conductivity type, a second semiconductor region being selectively formed, wherein: the second insulative region has a first opening which reaches a surface of the first semiconductor region, and the first semiconductor region has a second opening which reaches the underlying first insulative region, the second opening being provided in a position corresponding to the first opening of the second insulative region; the second semiconductor region is formed so as to fill the first opening and the second opening, thereby functioning as a bass region; a lower portion of the second semiconductor region which at least fills the second opening is formed by lateral growth from a face of the first semiconductor region defining a side wall of the second opening; and the first semiconductor region includes an emitter region and a collector region formed therein.
Abstract:
A polypropylene resin composition having excellent rigidity, impact resistance and formability (moldability) and thus useful for the interior parts of automobile, includes (A) a crystalline E/P block copolymer containing a fraction Ac soluble in p-xylene at room temperature and having an ethylene content of 18 to 22%; (B) a crystalline E/P block copolymer containing a fraction Bc soluble in p-xylene at room temperature and having an ethylene content of 27 to 40% and (C) talc particles having an average size of 3 to 5 .mu.m and largest size less than 20 .mu.m, in which composition, (a) the p-xylene-soluble fractions Ac and Bc are in contents As and Bs based on the total weight of the copolymers (A) and (B) and satisfying As+Bs=7 to 17% by weight and As/(A +Bs)=0.1 to 0.6; (b) an isotactic pentad fraction of propylene in each of copolymers (A) and (B) is 96% or more, and the mixture of the copolymers (A) and (B) has a MFR of 20 to 35 g/10 min at 230.degree. C. under 2160 g load; and (c) the copolymers (A) and (B) are in a total weight content of 50 to 95% and talc (C) is in a weight content of 5 to 50%.
Abstract:
In fabricating an MFIC by mounting a semiconductor chip on a substrate having a microstrip line by MBB bonding, a benzocyclobutene (BCB) film is used as a dielectric film of the microstrip line. By providing a means for preventing the deformation, peeling, and cracking of the BCB film during the fabrication process, the thickness of the dielectric film is held substantially equal even after flip-chip mounting, which reduces impedance fluctuations.
Abstract:
There is provided a process for reacting water and olefin such as ethylene or propylene under mild conditions in the presence of a polyorganosiloxane contaminating sulfonic acid groups to produce alcohol corresponding to the olefin with high yield and selectivity.
Abstract:
A semiconductor device includes a microstrip wiring board. The microstrip wiring board includes a substrate having a main surface, a ground conductor extending on the main surface of the substrate, a dielectric film extending on the ground conductor, and a metal wiring line extending on the dielectric film. A semiconductor chip is connected to the microstrip wiring board via a bump.
Abstract:
A base layer interposed between an n-type GaAs collector layer and an n-type AlGaAs emitter layer is composed of a p-type InAlGaAs. From a collector/base interface to an emitter/base interface, an InAs composition of the base layer is decreased and a concentration of carbon as a p-type impurity thereof is increased so as to obtain a built-in internal field intensity in the base layer by a cooperative effect of the graded-bandgap and the impurity concentration gradient, thus reducing a base transit time of electrons. The base layer is fabricated according to MOMBE using TMG as a gallium source, controlling the InAs composition, so that a desired carbon concentration gradient is automatically formed. Thereby, a high performance, heterojunction bipolar transistor with an increased built-in internal field intensity in the base layer is obtained.