SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST

    公开(公告)号:US20180098426A1

    公开(公告)日:2018-04-05

    申请号:US15723086

    申请日:2017-10-02

    Abstract: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

    High availability management techniques for cluster resources

    公开(公告)号:US09817721B1

    公开(公告)日:2017-11-14

    申请号:US14552376

    申请日:2014-11-24

    Inventor: Chris Youngworth

    CPC classification number: G06F11/1412 G06F11/3006 G06F11/3409

    Abstract: The present disclosure describes methods and system configurations for failover of cluster computing system resources, for a cluster computing system including a plurality of cluster nodes. In some examples, operations are performed to monitor an abstracted resource and reconfigure the abstracted resource, to enable fail-over processing for component members of the abstracted resource. In further examples, a hierarchy of resource dependencies is defined to enable enhanced fail-over processing for the failure of abstracted resources that cause the failure of services within the cluster computing system that are dependent upon the abstracted resources.

    Methods of segmented through hole formation using dual diameter through hole edge trimming

    公开(公告)号:US09661758B2

    公开(公告)日:2017-05-23

    申请号:US14463588

    申请日:2014-08-19

    Abstract: Cost effective and efficient methods to maximize printed circuit board (PCB) utilization with minimized signal degradation are provided. The methods include electrically isolating a segmented via structure by controlling the formation of a conductive material within a plated via structure by utilizing different diameter drills within a via structure for trimming the conductive material at the via shoulder (i.e., the rim of a drilled two diameter hole boundary). The trimmed portion may be voided in the via structure for allowing electrically isolated plated through-hole (PTH) segments. One or more areas of trimmed rims within the via structure are used to form multiple stair like diameter holes to create one or more voids in the via structure. As a result, the formation of conductive material within the via structure may be limited to those areas necessary for the transmission of electrical signals.

    CABLE MANAGEMENT ASSEMBLY FOR RACK MOUNTED EQUIPMENT
    59.
    发明申请
    CABLE MANAGEMENT ASSEMBLY FOR RACK MOUNTED EQUIPMENT 有权
    机架安装设备电缆管理总成

    公开(公告)号:US20170034944A1

    公开(公告)日:2017-02-02

    申请号:US15224537

    申请日:2016-07-30

    Inventor: Paul Orin Amdahl

    CPC classification number: H05K7/1491

    Abstract: A cable management assembly for managing cabling of equipment is provided. The cable management assembly may be utilized to manage the movement of cables attached to the enclosures when the enclosures are pulled into and out of the front of a structure during servicing. The cable management assembly may comprise one or more detachable cable support members that form a helix having a first attachment end and a second attachment end. The first attachment end may be attached to an enclosure and the second attachment end may be attached to a rear back plate assembly. The detachable cable support members include a plurality of flat segments having a generally elongated planar configuration or a curved configuration. A combination of planar and curved segments may be secured together forming a loop. A plurality of loops may be secured together forming the assembly.

    Abstract translation: 提供了一种用于管理设备布线的电缆管理组件。 电缆管理组件可以用于在维修期间当将外壳拉入和离开结构的前部时,管理连接到外壳的电缆的移动。 电缆管理组件可以包括一个或多个可拆卸电缆支撑构件,其形成具有第一附接端和第二附接端的螺旋。 第一附接端可以附接到外壳,并且第二附接端可以附接到后背板组件。 可拆卸电缆支撑构件包括具有大致细长的平面构造或弯曲构造的多个平坦段。 平面和弯曲部分的组合可以固定在一起形成环。 多个环可以固定在一起形成组件。

    SYSTEM AND METHOD FOR A DRUG DELIVERY AND BIOSENSOR PATCH
    60.
    发明申请
    SYSTEM AND METHOD FOR A DRUG DELIVERY AND BIOSENSOR PATCH 有权
    用于药物递送和生物传感器贴片的系统和方法

    公开(公告)号:US20170014572A1

    公开(公告)日:2017-01-19

    申请号:US15276760

    申请日:2016-09-26

    Abstract: An integrated drug delivery and biosensor (IDDB) system is implemented on a patch or arm band. The drug delivery system includes needles adapted to pierce the skin and direct injection of a predetermined dosage of medication through the needles into the epidermis of the skin of a patient. The integrated biosensor monitors absorption of the medication into the epidermis of the skin of the patient and may also monitor concentration of the medication or other relevant substances in arterial blood flow of the patient. The integrated biosensor may also monitor a patient's vitals in response to the medication. The integrated biosensor may then alter dosage or frequency of administration of dosages or even halt a dosage of medication in response to the patient's vitals or absorption of the medication.

    Abstract translation: 在贴片或手臂带上实施综合药物递送和生物传感器(IDDB)系统。 药物递送系统包括适于刺穿皮肤并且将预定剂量的药物通过针直接注射到患者皮肤的表皮中的针。 集成的生物传感器监测药物对患者皮肤的表皮的吸收,还可以监测患者动脉血流中药物或其他相关物质的浓度。 集成的生物传感器还可以响应于药物监测患者的生命体征。 然后,集成的生物传感器可以改变施用剂量的剂量或频率,或者甚至响应于患者的生命体征或药物的吸收而停止一定剂量的药物。

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