Position Measuring Apparatus, Position Measuring Method, Lithographic Apparatus and Device Manufacturing Method
    51.
    发明申请
    Position Measuring Apparatus, Position Measuring Method, Lithographic Apparatus and Device Manufacturing Method 有权
    位置测量装置,位置测量方法,平版印刷设备和装置制造方法

    公开(公告)号:US20150261097A1

    公开(公告)日:2015-09-17

    申请号:US14418373

    申请日:2013-07-16

    CPC classification number: G03F7/70141 G03F9/7026 G03F9/7034

    Abstract: An apparatus for measuring positions of marks on a substrate, includes an illumination arrangement for supplying radiation with a predetermined illumination profile across a pupil of the apparatus, an objective lens for forming a spot of radiation on a mark using radiation supplied by said illumination arrangement, a radiation processing element for processing radiation that is diffracted by the mark, a first detection arrangement for detecting variations in an intensity of radiation output by the radiation processing element and for calculating therefrom a position of the mark, an optical arrangement, a second detection arrangement, wherein the optical arrangement serves to direct diffracted radiation to the second detection arrangement, and wherein the second detection arrangement is configured to detect size and/or position variations in the radiation and to calculate therefrom a defocus and/or local tilt of the mark.

    Abstract translation: 一种用于测量基板上的标记位置的装置,包括:用于向装置的瞳孔提供具有预定照明轮廓的辐射的照明装置;用于使用由所述照明装置提供的辐射在标记上形成辐射点的物镜; 用于处理由标记衍射的辐射的辐射处理元件;第一检测装置,用于检测由辐射处理元件输出的辐射强度的变化,并从其计算标记的位置,光学装置,第二检测装置 ,其中所述光学装置用于将衍射辐射引导到所述第二检测装置,并且其中所述第二检测装置被配置为检测所述辐射中的尺寸和/或位置变化并由其计算所述标记的散焦和/或所述局部倾斜。

    Diffraction based overlay metrology tool and method of diffraction based overlay metrology
    53.
    发明授权
    Diffraction based overlay metrology tool and method of diffraction based overlay metrology 有权
    基于衍射的覆盖计量工具和基于衍射的覆盖计量方法

    公开(公告)号:US08670118B2

    公开(公告)日:2014-03-11

    申请号:US13676562

    申请日:2012-11-14

    CPC classification number: G01N21/95607 G03F7/7015 G03F7/70633

    Abstract: Systems, methods, and apparatus are provided for determining overlay of a pattern on a substrate with a mask pattern defined in a resist layer on top of the pattern on the substrate. A first grating is provided under a second grating, each having substantially identical pitch to the other, together forming a composite grating. A first illumination beam is provided under an angle of incidence along a first horizontal direction. The intensity of a diffracted beam from the composite grating is measured. A second illumination beam is provided under the angle of incidence along a second horizontal direction. The second horizontal direction is opposite to the first horizontal direction. The intensity of the diffracted beam from the composite grating is measured. The difference between the diffracted beam from the first illumination beam and the diffracted beam from the second illumination beam, linearly scaled, results in the overlay error.

    Abstract translation: 提供了系统,方法和装置,用于确定衬底上的图案的覆盖层,其中掩模图案限定在衬底上图案顶部上的抗蚀剂层中。 第一光栅设置在第二光栅下方,每个具有与另一光栅基本相同的间距,一起形成复合光栅。 沿着第一水平方向以入射角设置第一照明光束。 测量来自复合光栅的衍射光束的强度。 沿着第二水平方向的入射角设置第二照明光束。 第二水平方向与第一水平方向相反。 测量来自复合光栅的衍射光束的强度。 来自第一照明光束的衍射光束与来自第二照明光束的衍射光束之间的差异线性缩放导致重叠误差。

    Metrology method and apparatus and computer program

    公开(公告)号:US12189305B2

    公开(公告)日:2025-01-07

    申请号:US18004555

    申请日:2021-05-27

    Abstract: Disclosed is a method of improving a measurement of a parameter of interest. The method comprises obtaining metrology data comprising a plurality of measured values of the parameter of interest, relating to one or more targets on a substrate, each measured value relating to a different measurement combination of a target of said one or more targets and a measurement condition used to measure that target and asymmetry metric data relating to asymmetry for said one or more targets. A respective relationship is determined for each of said measurement combinations relating a true value for the parameter of interest to the asymmetry metric data, based on an assumption that there is a common true value for the parameter of interest over said measurement combinations. These relationships are used to improve a measurement of the parameter of interest.

    Phase modulators in alignment to decrease mark size

    公开(公告)号:US11803130B2

    公开(公告)日:2023-10-31

    申请号:US17633884

    申请日:2020-08-05

    CPC classification number: G03F9/7049 G03F9/7069 G03F9/7088

    Abstract: An alignment apparatus includes an illumination system configured to direct one or more illumination beams towards an alignment target and receive the diffracted beams from the alignment target. The alignment apparatus also includes a self-referencing Interferometer configured to generate two diffraction sub-beams, wherein the two diffraction sub-beams are orthogonally polarized, rotated 180 degrees with respect to each other around an alignment axis, and spatially overlapped. The alignment apparatus further includes a beam analyzer configured to generate interference between the overlapped components of the diffraction sub-beams and produce two orthogonally polarized optical branches, and a detection system configured to determine a position of the alignment target based on light intensity measurement of the optical branches, wherein the measured light intensity is temporally modulated by a phase modulator.

    Metrology method, computer product and system

    公开(公告)号:US11640116B2

    公开(公告)日:2023-05-02

    申请号:US16893619

    申请日:2020-06-05

    Abstract: A method including determining a type of structural asymmetry of the target from measured values of the target, and performing a simulation of optical measurement of the target to determine a value of an asymmetry parameter associated with the asymmetry type. A method including performing a simulation of optical measurement of a target to determine a value of an asymmetry parameter associated with a type of structural asymmetry of the target determined from measured values of the target, and analyzing a sensitivity of the asymmetry parameter to change in a target formation parameter associated with the target. A method including determining a structural asymmetry parameter of a target using a measured parameter of radiation diffracted by the target, and determining a property of a measurement beam of the target based on the structural asymmetry parameter that is least sensitive to change in a target formation parameter associated with the target.

    Diffraction based overlay metrology tool and method of diffraction based overlay metrology

    公开(公告)号:US11619595B2

    公开(公告)日:2023-04-04

    申请号:US16719075

    申请日:2019-12-18

    Abstract: Systems, methods, and apparatus are provided for determining overlay of a pattern on a substrate with a mask pattern defined in a resist layer on top of the pattern on the substrate. A first grating is provided under a second grating, each having substantially identical pitch to the other, together forming a composite grating. A first illumination beam is provided under an angle of incidence along a first horizontal direction. The intensity of a diffracted beam from the composite grating is measured. A second illumination beam is provided under the angle of incidence along a second horizontal direction. The second horizontal direction is opposite to the first horizontal direction. The intensity of the diffracted beam from the composite grating is measured. The difference between the diffracted beam from the first illumination beam and the diffracted beam from the second illumination beam, linearly scaled, results in the overlay error.

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