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    Smart bottle system and methods thereof
    52.
    发明授权
    Smart bottle system and methods thereof 有权

    公开(公告)号：US11458073B1

    公开(公告)日：2022-10-04

    申请号：US16856023

    申请日：2020-04-23

    Applicant: Achyut Kumar Dutta ,  Sudeep Hiroshi Dutta

    Inventor： Achyut Kumar Dutta ,  Sudeep Hiroshi Dutta

    IPC: A61J7/04 ,  G16H20/10 ,  A61J1/03 ,  B65D51/24

    Abstract: This invention relates to smart bottle system that informs the user through a display, the time and date that the contents are to be taken. More specifically, the smart bottle system provides an information to the user/patient, the time to take medication and inform the caregiver, physician, pharmacy personnel, or patient/users of missed doses, the profile, and/or the health condition of the patient/user. The bottle system may track the dosses remaining in the bottle, and inform the caregiver or patient/user, or pharmacy personnel the time to get a refill of the medication. The system can able to compute the profile and/or health condition of the users, based on the medication intake, and/or missed, or users image, and can communicate with the persons located remotely by sending/receiving information.

    Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
    53.
    发明授权
    Stackable optoelectronics chip-to-chip interconnects and method of manufacturing 有权

    公开(公告)号：US10254476B1

    公开(公告)日：2019-04-09

    申请号：US16033184

    申请日：2018-07-11

    Applicant: Achyut Kumar Dutta

    Inventor： Achyut Kumar Dutta

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/32 ,  H05K1/14 ,  H05K1/02 ,  H01L25/16 ,  H01S5/183 ,  H01S5/022 ,  H01L23/00

    Abstract: An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible with the PCB. The main advantages of this invention are to use the packaged chip for interconnection and the conventional PCB technology can be used for low speed electrical signal connection. Also, the part of the heat from the packaged chip can be transmitted to the PCB through the conductors, so that complex cooling system can be avoided.

    HIGH EFFICIENCY PHOTOVOLTAIC CELLS WITH SELF CONCENTRATING EFFECT
    54.
    发明申请
    HIGH EFFICIENCY PHOTOVOLTAIC CELLS WITH SELF CONCENTRATING EFFECT 审中-公开

    公开(公告)号：US20170236953A1

    公开(公告)日：2017-08-17

    申请号：US15474232

    申请日：2017-03-30

    Applicant: Achyut Kumar Dutta

    Inventor： Achyut Kumar Dutta

    IPC: H01L31/0236 ,  H01L31/054 ,  H01L31/0216

    CPC classification number: H01L31/02363 ,  H01L31/02168 ,  H01L31/0236 ,  H01L31/0296 ,  H01L31/0352 ,  H01L31/035281 ,  H01L31/03529 ,  H01L31/0547 ,  Y02E10/52

    Abstract: This invention relates to a novel structure of photovoltaic devices (e.g. photovoltaic cells also called as solar cells) are provided. The cells are based on the micro or nano scaled structures which could not only increase the surface area but also have the capability of self-concentrating the light incident onto the photonics devices. More specifically, the structures are based on 3D structure including quintic or quintic-like shaped micor-nanostructures. By using such structures reflection loss of the light from the cell is significantly reduced, increasing the absorption, which results in increasing the conversion efficiency of the solar cell, and reducing the usage of material while increasing the flexibility of the solar cell. The structures can be also used in other optical devices wherein the reflection loss and absorption are required to enhanced to significantly improve the device performances.

    Energy scavenging devices and manufacturing thereof
    56.
    发明授权
    Energy scavenging devices and manufacturing thereof 有权
    能量清除装置及其制造

    公开(公告)号：US08791358B1

    公开(公告)日：2014-07-29

    申请号：US12573091

    申请日：2009-10-02

    Applicant: Achyut Kumar Dutta ,  Robert Olah

    Inventor： Achyut Kumar Dutta ,  Robert Olah

    IPC: H01L31/058 ,  G05F1/67 ,  H02J7/35 ,  H01L31/02 ,  H01L31/12

    CPC classification number: H01L31/02021 ,  G05F1/67 ,  H01L31/02966 ,  H01L31/035281 ,  H01L31/068 ,  H01L31/0735 ,  H01L31/077 ,  H01L31/12 ,  H01L31/1832 ,  H01L31/1892 ,  H02J7/025 ,  H02J7/35 ,  H02J17/00 ,  H02J50/30 ,  H02S10/20 ,  Y02E10/544 ,  Y02E10/547 ,  Y02E10/58

    Abstract: This invention is related to energy scavenging device and in particular, to energy harvesting or scavenging from the environmental radiation covering from solar spectrum and thermal radiation. Energy harvesting device is an integrated device comprising the devices that capture the radiation and converted into electrons, and also energy management devices to manage the converted energy either to store, to operate the electronic devices, and/or recharge the batteries. The energy scavenging devices integrates several device capabilities such as energy conversion, management, and storing the energy, on a common platform. Herein a design of a device capable to scavenge or harvest the energy from environment radiation is disclosed. A primary objective of this invention is to provide a design of a scavenging device that harvests the energy from environment radiation, operates 24/7, thereby generate and store, manage the energy as required.

    Abstract translation: 本发明涉及能量清除装置，特别涉及从太阳光谱和热辐射的环境辐射覆盖的能量收集或清除。 能量收集装置是包括捕获辐射并转换成电子的装置的集成装置，以及能量管理装置，用于管理转换的能量以存储，操作电子装置和/或对电池再充电。 能源清除装置将能量转换，管理和存储能量等多种设备功能集成在通用平台上。 本文中公开了能够从环境辐射中清除或收获能量的装置的设计。 本发明的主要目的是提供一种从环境辐射中收集能量的扫气装置的设计，每天24小时运行，从而根据需要生产和储存，管理能量。

    Multicolor photodiode array and method of manufacturing
    58.
    发明授权
    Multicolor photodiode array and method of manufacturing 有权
    多色光电二极管阵列及其制造方法

    公开(公告)号：US08174059B2

    公开(公告)日：2012-05-08

    申请号：US12420036

    申请日：2009-04-07

    Applicant: Achyut Kumar Dutta

    Inventor： Achyut Kumar Dutta

    IPC: H01L25/16

    CPC classification number: H01L31/109 ,  H01L27/14634 ,  H01L27/1464 ,  H01L27/14645 ,  H01L2224/4847

    Abstract: Novel structures of the photodetector having broad spectral ranges detection capability are provided. The photodetector offers high quantum efficiency>95% over wide spectral ranges, high frequency response>10 GHz (@3 dB). The photodiode array of N×N (or M×N) elements is also provided. The array also offers wide spectral detection ranges ultraviolet to 2500 nm with high quantum efficiency>95% and high frequency response of >10 GHz, cross-talk of

    Abstract translation: 提供具有宽光谱范围检测能力的光电检测器的新型结构。 光电探测器在宽光谱范围，高频响应> 10 GHz（@ 3dB）的情况下提供高达95％的高量子效率。 还提供了N×N（或M×N）个元件的光电二极管阵列。 该阵列还提供宽光谱检测范围紫外到2500 nm，高量子效率> 95％，高频响应> 10 GHz，串扰<0.1％。 在阵列中，每个光电二极管是独立可寻址的，并且被制成顶照或者底照型检测器。 本发明中提供的光电二极管及其阵列可用于诸如电信，成像和感测应用的多种用途应用，包括监视，卫星跟踪，先进激光雷达系统等。该光电探测器的优点是它们是非冷却和性能 在宽范围的温度变化下不会降解。

    Broadband imaging device
    60.
    发明授权
    Broadband imaging device 有权
    宽带成像设备

    公开(公告)号：US08035184B1

    公开(公告)日：2011-10-11

    申请号：US12567724

    申请日：2009-09-25

    Applicant: Achyut Kumar Dutta ,  Robert Olah

    Inventor： Achyut Kumar Dutta ,  Robert Olah

    IPC: H01L27/146

    CPC classification number: H01L27/14634 ,  B82Y20/00 ,  H01L31/0352 ,  H01L31/035236 ,  H01L31/035281 ,  H01L31/18 ,  Y02E10/50

    Abstract: This invention relates to imaging device and its related transferring technologies to independent substrate able to attain significant broadband capability covering the wavelengths from ultra-violet (UV) to long-Infrared. More particularly, this invention is related to the broadband image sensor (along with its manufacturing technologies), which can detect the light wavelengths ranges from as low as UV to the wavelengths as high as 20 μm covering the most of the wavelengths using of the single monolithic image sensor on the single wafer. This invention is also related to the integrated circuit and the bonding technologies of the image sensor to standard integrated circuit for multicolor imaging, sensing, and advanced communication. Our innovative approach utilizes surface structure having more than micro-nano-scaled 3-dimensional (3-D) blocks which can provide broad spectral response. Utilizing multiple micro-nano scaled blocks help to increase the absorption spectra more than the material used as the absorption layer. In addition, utilizing the multiple nano-scaled 3-D blocks help to increase the absorption over the wavelength due to the multiple reflections and diffractions inside the 3-D structures. The absorption layers will be designed to achieve the required quantum efficiency and also required speed.

    Abstract translation: 本发明涉及成像装置及其相关的转移技术，可以实现覆盖从紫外（UV）到长红外的波长的显着宽带能力的独立基板。 更具体地说，本发明涉及宽带图像传感器（及其制造技术），其可以使用单个波长来检测覆盖大多数波长的高达20微米的低至UV的波长的光波长范围 单片图像传感器。 本发明还涉及图像传感器与用于多色成像，感测和高级通信的标准集成电路的集成电路和接合技术。 我们的创新方法利用具有超过微纳米级3维（3-D）块的表面结构，可提供广泛的光谱响应。 利用多个微纳米尺度的块有助于比用作吸收层的材料更多地增加吸收光谱。 此外，利用多个纳米尺度的3-D块有助于增加由于在3-D结构内部的多次反射和衍射而导致的波长上的吸收。 吸收层将被设计成实现所需的量子效率和所需的速度。

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