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    Integrating 3D printing into multi-process fabrication schemes
    52.
    发明授权
    Integrating 3D printing into multi-process fabrication schemes 有权

    公开(公告)号：US11241839B2

    公开(公告)日：2022-02-08

    申请号：US16289213

    申请日：2019-02-28

    Applicant: Applied Materials, Inc.

    Inventor： William H. McClintock ,  Rajeev Bajaj ,  Jason G. Fung ,  Daniel Redfield

    IPC: B29C64/00 ,  B29C64/393 ,  G01B9/02 ,  G06F9/30 ,  B33Y50/02

    Abstract: Embodiments disclosed herein provide methods of forming bond pad redistribution layers (RDLs) in a fan-out wafer level packaging (FOWLP) scheme using an additive manufacturing process. In one embodiment, a method of forming a redistribution layer includes positioning a carrier substrate on a manufacturing support of an additive manufacturing system, the carrier substrate including a plurality of singulated devices, detecting one or more fiducial features corresponding to each of the plurality of singulated devices, determining actual positions of each of the plurality of singulated devices relative to one or more components of the additive manufacturing system, generating printing instructions for forming a patterned dielectric layer based on the actual positions of each of the plurality of singulated devices, and forming the patterned dielectric layer using the printing instructions.

    Fabrication of polishing pad by additive manufacturing onto mold
    53.
    发明授权
    Fabrication of polishing pad by additive manufacturing onto mold 有权

    公开(公告)号：US10967482B2

    公开(公告)日：2021-04-06

    申请号：US15922813

    申请日：2018-03-15

    Applicant: Applied Materials, Inc.

    Inventor： Daniel Redfield

    IPC: B29C64/245 ,  B33Y10/00 ,  B29C64/112 ,  B24B53/017 ,  B33Y80/00 ,  B29C64/209 ,  B29C64/393 ,  B29C64/129 ,  B24B57/02

    Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes dispensing a first plurality of first layers from a first plurality of successive layers by, for each respective first layer of the first plurality of first layers, ejecting droplets of polishing layer precursor into gaps between projections from a support to form the respective first layer, and curing the respective first layer before depositing a subsequent first layer, and dispensing a second plurality of layers from the first plurality of successive layers over the first plurality of layers by, for each respective second layer of the second plurality of layers, ejecting droplets of the polishing layer precursor to form the respective second layer, each respective second layer spanning the projections and the gaps, and curing the respective second layer before depositing a subsequent second layer, and removing the polishing layer from the support.

    Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
    57.
    发明授权
    Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process 有权

    公开(公告)号：US10391605B2

    公开(公告)日：2019-08-27

    申请号：US15287665

    申请日：2016-10-06

    Applicant: Applied Materials, Inc.

    Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Daniel Redfield ,  Rajeev Bajaj ,  Mahendra C. Orilall ,  Hou T. Ng ,  Jason G. Fung ,  Mayu Yamamura

    IPC: B24B37/24

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

    Fabrication of Polishing Pad by Additive Manufacturing Onto Mold
    59.
    发明申请
    Fabrication of Polishing Pad by Additive Manufacturing Onto Mold 审中-公开

    公开(公告)号：US20180339397A1

    公开(公告)日：2018-11-29

    申请号：US15922813

    申请日：2018-03-15

    Applicant: Applied Materials, Inc.

    Inventor： Daniel Redfield

    IPC: B24B53/017 ,  B24B57/02 ,  B29C64/112 ,  B29C64/129 ,  B29C64/209 ,  B29C64/393

    Abstract: A method of fabricating a polishing pad using an additive manufacturing system includes dispensing a first plurality of first layers from a first plurality of successive layers by, for each respective first layer of the first plurality of first layers, ejecting droplets of polishing layer precursor into gaps between projections from a support to form the respective first layer, and curing the respective first layer before depositing a subsequent first layer, and dispensing a second plurality of layers from the first plurality of successive layers over the first plurality of layers by, for each respective second layer of the second plurality of layers, ejecting droplets of the polishing layer precursor to form the respective second layer, each respective second layer spanning the projections and the gaps, and curing the respective second layer before depositing a subsequent second layer, and removing the polishing layer from the support.

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