公开(公告)号：US20220016854A1

公开(公告)日：2022-01-20

申请号：US17258958

申请日：2019-06-24

Applicant: Corning Incorporated

Inventor： Heather Bossard Decker ,  Shandon Dee Hart ,  Yanfei Li ,  Joseph Edward McCarthy ,  David John McEnroe ,  Mark Alejandro Quesada

IPC: B29C70/20 ,  C03C13/00 ,  C03C3/19

Abstract: A composite has repeating domains of an inorganic glass and a polymer, such that the inorganic glass and the polymer each have a glass transition temperature (Tg) or softening temperature of less than 450° C., and at least 50% of the inorganic glass domains have a length of less than 30 μm as measured along at least one cross-sectional dimension.

公开(公告)号：US20200369566A1

公开(公告)日：2020-11-26

申请号：US16877859

申请日：2020-05-19

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: C03C27/08 ,  G02B6/10 ,  C03B37/15

Abstract: Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.

公开(公告)号：US10545293B2

公开(公告)日：2020-01-28

申请号：US16410903

申请日：2019-05-13

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov ,  Douglas Llewellyn Butler ,  James Scott Sutherland

IPC: G02B6/38 ,  G02B6/36 ,  G02B6/02 ,  G02B6/30 ,  G02B6/42

Abstract: Assemblies, optical connectors, and methods for bonding optical fibers to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate includes directing a laser beam into the optical fiber disposed on a surface of the substrate, wherein the optical fiber has a curved surface and the curved surface of the optical fiber focuses the laser beam to a diameter that is smaller than a diameter of the laser beam as it enters the optical fiber. The method further includes melting, using the laser beam, a material of the substrate at a bond area between the optical fiber and the surface of the substrate such that the optical fiber is bonded to the surface of the substrate.

公开(公告)号：US10422961B2

公开(公告)日：2019-09-24

申请号：US16157844

申请日：2018-10-11

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: G02B6/38 ,  G02B6/36 ,  G02B6/30 ,  G02B6/42

Abstract: Assemblies, optical connectors, and methods for forming fiber arrays using laser bonded optical fibers are disclosed. In one embodiment, a method of forming a fiber array includes placing an optical fiber on a surface of a substrate, directing a laser beam into the optical fiber disposed on the surface of the substrate, melting, using the laser beam, a material of the substrate to create a first laser bond zone between the optical fiber and the surface of the substrate, applying an adhesive to the optical fiber and the substrate to create an adhesive bond zone between the optical fiber and the surface of the substrate, and cutting the optical fiber and the substrate to create a first section of the fiber array and a second section of the fiber array. The first section of the fiber array includes a first portion of the optical fiber, a first portion of the substrate, a first portion of the adhesive bond zone, and the first laser bond zone, and the second section of the fiber array includes a second portion of the optical fiber, a second portion of the substrate, and a second portion of the adhesive bond zone.

公开(公告)号：US20190218142A1

公开(公告)日：2019-07-18

申请号：US16179377

申请日：2018-11-02

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Yousef Kayed Qaroush ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov ,  Leo Young Zheng

IPC: C03C23/00 ,  C03C3/14 ,  C03C3/247 ,  C03C17/02 ,  C03C17/06 ,  C03C17/23 ,  C03C27/04 ,  C03C15/00 ,  C03C27/10 ,  C03C27/06 ,  C03C3/16 ,  C01G19/02 ,  C03C3/23 ,  H01L51/52

CPC classification number: C03C23/0025 ,  C01G19/02 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C15/00 ,  C03C17/02 ,  C03C17/06 ,  C03C17/23 ,  C03C27/044 ,  C03C27/06 ,  C03C27/10 ,  H01L51/5246

Abstract: An apparatus including a first substrate, a second substrate, an inorganic film provided between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, a laser welded zone formed between the first and second substrate by the inorganic film, where the laser welded zone has a heat affected zone (HAZ), where the HAZ is defined as a region in which σHAZ is at least 1 MPa higher than average stress in the first substrate and the second substrate, wherein σHAZ is compressive stress in the HAZ, and wherein the laser welded zone is characterized by its σinterface laser weld>σHAZ, wherein σinterface laser weld is peak value of compressive stress in the laser welded zone.

公开(公告)号：US20190047902A1

公开(公告)日：2019-02-14

申请号：US16085779

申请日：2017-03-16

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Nadja Teresia Lonnroth ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov ,  Mark Owen Weller

IPC: C03C4/08 ,  H01L51/52 ,  C03C27/06 ,  B29C65/16 ,  G02F1/161 ,  H01L33/56 ,  H01S5/022

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one bond between the first and second substrates. The inorganic film can comprise about 10-80 mol % B2O3, about 5-60 mol % Bi2O3, and about 0-70 mol % ZnO. Methods for sealing devices using such an inorganic film are also disclosed herein, as well as display and electronic components comprising such sealed devices.

公开(公告)号：US20180138446A1

公开(公告)日：2018-05-17

申请号：US15699337

申请日：2017-09-08

Applicant: CORNING INCORPORATED

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: H01L51/52 ,  B23K26/20 ,  C03C3/247 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C4/00 ,  C03C8/24 ,  C03B23/203 ,  C03C27/08 ,  C03C27/06 ,  C03C23/00 ,  C03C3/12 ,  H01L51/00 ,  B32B37/06

CPC classification number: H01L51/5246 ,  B23K26/206 ,  B32B7/04 ,  B32B17/06 ,  B32B37/06 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/20 ,  B32B2310/0825 ,  B32B2310/0831 ,  B32B2310/0843 ,  B32B2457/206 ,  C03B23/203 ,  C03C3/12 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/0071 ,  C03C8/24 ,  C03C23/0025 ,  C03C27/06 ,  C03C27/08 ,  C03C2204/00 ,  C03C2207/00 ,  C03C2218/32 ,  H01L51/0024 ,  H01L2251/301

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

公开(公告)号：US20170327419A1

公开(公告)日：2017-11-16

申请号：US15522198

申请日：2015-10-29

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Leonard Charles Dabich, II ,  David Alan Deneka ,  Jin Su Kim ,  Shari Elizabeth Koval ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: C03C23/00 ,  C03C3/14 ,  C03C3/16 ,  C03C27/10 ,  C01G19/02 ,  C03C3/247 ,  C03C3/23 ,  C03C15/00 ,  C03C27/04 ,  H01L51/52 ,  C03C17/06 ,  C03C17/23

CPC classification number: C03C23/0025 ,  C01G19/02 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C15/00 ,  C03C17/02 ,  C03C17/06 ,  C03C17/23 ,  C03C27/044 ,  C03C27/06 ,  C03C27/10 ,  H01L51/5246

Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σtensile stress location)/(σinterface laser weld)) 10 MPa or >1 MPa where σtensile stress location is the stress present in the first substrate and σinterface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

公开(公告)号：US09741963B2

公开(公告)日：2017-08-22

申请号：US15066704

申请日：2016-03-10

Applicant: Corning Incorporated

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: H01L21/00 ,  H01L51/52 ,  C03C3/12 ,  C03C23/00 ,  C03C27/06 ,  C03C27/08 ,  C03B23/203 ,  B23K26/20 ,  B32B37/06 ,  H01L51/00 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/00 ,  C03C8/24

CPC classification number: H01L51/5246 ,  B23K26/206 ,  B32B7/04 ,  B32B17/06 ,  B32B37/06 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/20 ,  B32B2310/0825 ,  B32B2310/0831 ,  B32B2310/0843 ,  B32B2457/206 ,  C03B23/203 ,  C03C3/12 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/0071 ,  C03C8/24 ,  C03C23/0025 ,  C03C27/06 ,  C03C27/08 ,  C03C2204/00 ,  C03C2207/00 ,  C03C2218/32 ,  H01L51/0024 ,  H01L2251/301

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

公开(公告)号：US09690033B2

公开(公告)日：2017-06-27

申请号：US15085235

申请日：2016-03-30

Applicant: CORNING INCORPORATED

Inventor： David Eugene Baker ,  Pamela Arlene Maurey ,  Daniel Aloysius Nolan ,  Mark Alejandro Quesada ,  Wageesha Senaratne

IPC: F21V8/00 ,  H01L51/52 ,  G02B5/02

CPC classification number: G02B6/0036 ,  G02B5/0221 ,  G02B6/0043 ,  G02B6/0065 ,  H01L51/5262 ,  H01L51/5268

Abstract: Disclosed herein are waveguides comprising at least one scattering surface, a periodicity ranging from about 0.5 μm to about 2 μm, and an RMS roughness ranging from about 20 nm to about 60 nm. Single-layer waveguides having a thickness ranging from about 1 μm to about 100 μm are disclosed herein as well as multi-layer waveguides comprising at least one high index layer and optionally at least one low index layer. Lighting and display devices and OLEDs comprising such waveguides are further disclosed herein as well as methods for making the waveguides.