中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

69 records (took 0.021 seconds)

    Low impedance oxide resistant grounded capacitor for an AIMD
    51.
    发明授权
    Low impedance oxide resistant grounded capacitor for an AIMD 有权
    用于AIMD的低阻抗氧化物接地电容器

    公开(公告)号：US09108066B2

    公开(公告)日：2015-08-18

    申请号：US14202653

    申请日：2014-03-10

    Applicant: Greatbatch Ltd.

    Inventor： Jason Woods ,  Richard L. Brendel ,  Robert A. Stevenson ,  Christopher M. Williams ,  Robert Naugler ,  Christine A. Frysz

    IPC: A61N1/00 ,  A61N1/375 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/00 ,  H01G4/35 ,  H01G2/02 ,  H01G4/228 ,  H03H7/01

    CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085

    Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an insulator hermetically sealed to a conductive ferrule or housing. A conductor is hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule or housing between a body fluid side and a device side. A feedthrough capacitor is disposed on the device side. A first low impedance electrical connection is between a first end metallization of the capacitor and the conductor. A second low impedance electrical connection is between a second end metallization of the capacitor and the ferrule or housing. The second low impedance electrical connection includes an oxide-resistant metal addition attached directly to the ferrule or housing and an electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

    Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括密封到导电套圈或壳体的绝缘体。 导体被气密地密封并且通过绝缘体以非导电关系设置在导体套管或壳体之间，在体液侧和器件侧之间。 馈通电容器设置在器件侧。 第一低阻抗电连接在电容器的第一端金属化和导体之间。 第二低阻抗电连接在电容器的第二端金属化和套圈或壳体之间。 第二低阻抗电连接包括直接连接到套圈或壳体的耐氧化金属添加剂和将第二端金属化物电和物理直接耦合到耐氧化金属添加物的电连接。

    EMI Filtered Co-Connected Hermetic Feedthrough, Feedthrough Capacitor and Leadwire Assembly for an Active Implantable Medical Device
    53.
    发明申请
    EMI Filtered Co-Connected Hermetic Feedthrough, Feedthrough Capacitor and Leadwire Assembly for an Active Implantable Medical Device 有权
    电磁干扰过滤联合密封馈通，馈通电容器和有源可植入医疗设备的导线组件

    公开(公告)号：US20140036409A1

    公开(公告)日：2014-02-06

    申请号：US13743276

    申请日：2013-01-16

    Applicant: GREATBATCH LTD.

    Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

    IPC: H01G4/35

    CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

    Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

    Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。

    EMI FILTERS UTILIZING COUNTER-BORED CAPACITORS TO FACILITATE SOLDER RE-FLOW
    54.
    发明申请
    EMI FILTERS UTILIZING COUNTER-BORED CAPACITORS TO FACILITATE SOLDER RE-FLOW 有权
    电磁过滤器利用计数器电容器来帮助焊接机回流

    公开(公告)号：US20130286537A1

    公开(公告)日：2013-10-31

    申请号：US13926255

    申请日：2013-06-25

    Applicant: Greatbatch Ltd.

    Inventor： Richard L. Brendel ,  Jason Woods ,  Jose Luis Lorente-Adame ,  Robert A. Stevenson ,  John E. Roberts ,  Buehl E. Truex

    IPC: H01G4/35

    CPC classification number: H01G4/35 ,  A61N1/3754 ,  H01G4/228 ,  H01G4/40 ,  H01G5/00 ,  H01G5/01 ,  H01G5/011 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002

    Abstract: An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive.

    Abstract translation: 描述了包括至少一个导电端子引脚，馈通电容器和与通过电容器的通道相关联的反向孔的EMI滤波端子组件。 优选地，其上侧具有相对钻孔或反钻孔的穿通电容器首先被结合到密封绝缘体。 电容器中的反钻孔或反孔钻孔为电容器和端子销或引线之间的机电连接提供了更大的体积，允许机器人分配例如热固性导电粘合剂。

    ECA Oxide-Resistant Connection To A Hermetic Seal Ferrule For An Active Implantable Medical Device
    58.
    发明申请
    ECA Oxide-Resistant Connection To A Hermetic Seal Ferrule For An Active Implantable Medical Device 有权

    公开(公告)号：US20210283404A1

    公开(公告)日：2021-09-16

    申请号：US17181542

    申请日：2021-02-22

    Applicant: Greatbatch Ltd.

    Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Jason Woods

    IPC: A61N1/375 ,  H01G4/224 ,  H01G4/35 ,  H01G2/10 ,  H01G2/12 ,  H01G4/228 ,  H01G13/00 ,  H01B19/04 ,  H01B17/62

    Abstract: A hermetically sealed feedthrough assembly for an active implantable medical device having an oxide-resistant electrical attachment for connection to an EMI filter, an EMI filter circuit board, an AIMD circuit board, or AIMD electronics. The oxide-resistant electrical attachment, including an oxide-resistant sputter layer 165 is disposed on the device side surface of the hermetic seal ferrule over which an ECA stripe is provided. The ECA stripe may comprise one of a thermal-setting electrically conductive adhesive, an electrically conductive polymer, an electrically conductive epoxy, an electrically conductive silicone, an electrically conductive polyimides, or an electrically conductive polyimide, such as those manufactured by Ablestick Corporation. The oxide-free electrical attachment between the ECA stripe and the filter or AIMD circuits may comprise one of gold, platinum, palladium, silver, iridium, rhenium, rhodium, tantalum, tungsten, niobium, zirconium, vanadium, and combinations or alloys thereof.

Patent Agency Ranking