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    Nuclear radiation particle power converter
    51.
    发明授权
    Nuclear radiation particle power converter 有权

    公开(公告)号：US11881325B2

    公开(公告)日：2024-01-23

    申请号：US17073712

    申请日：2020-10-19

    Applicant: Medtronic, Inc.

    Inventor： Andreas Fenner ,  David A. Ruben ,  Anna J. Malin ,  Paul F. Gerrish ,  Bruce C. Fleischhauer ,  Larry E. Tyler

    IPC: G21H1/02 ,  G21C19/07 ,  G21H1/04 ,  G21H1/06

    CPC classification number: G21H1/02 ,  G21C19/07 ,  G21H1/04 ,  G21H1/06 ,  Y10T29/49117

    Abstract: Various embodiments of a nuclear radiation particle power converter and method of forming such power converter are disclosed. In one or more embodiments, the power converter can include first and second electrodes, a three-dimensional current collector disposed between the first and second electrodes and electrically coupled to the first electrode, and a charge carrier separator disposed on at least a portion of a surface of the three-dimensional current collector. The power converter can also include a hole conductor layer disposed on at least a portion of the charge carrier separator and electrically coupled to the second electrode, and nuclear radiation-emitting material disposed such that at least one nuclear radiation particle emitted by the nuclear radiation-emitting material is incident upon the charge carrier separator.

    Hermetic conductive feedthroughs for a semiconductor wafer
    53.
    发明授权
    Hermetic conductive feedthroughs for a semiconductor wafer 有权

    公开(公告)号：US11485670B2

    公开(公告)日：2022-11-01

    申请号：US16673572

    申请日：2019-11-04

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben ,  Michael S. Sandlin

    IPC: C03B23/20 ,  H05K5/00 ,  A61N1/375 ,  H01L23/057 ,  H01L23/10 ,  B81C1/00

    Abstract: A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

    Feedthrough assemblies and methods of forming same
    54.
    发明授权
    Feedthrough assemblies and methods of forming same 有权

    公开(公告)号：US10535596B2

    公开(公告)日：2020-01-14

    申请号：US15850061

    申请日：2017-12-21

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben ,  Michael S. Sandlin

    IPC: H01L23/498 ,  A61N1/375 ,  H01L21/48

    Abstract: Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.

    Sealed package and method of forming same
    55.
    发明授权
    Sealed package and method of forming same 有权

    公开(公告)号：US10420509B2

    公开(公告)日：2019-09-24

    申请号：US16158801

    申请日：2018-10-12

    Applicant: Medtronic, Inc.

    Inventor： David A. Ruben ,  Craig L. Schmidt

    IPC: H05K5/06 ,  H05K5/02 ,  A61B5/00 ,  A61B5/0245 ,  A61N1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40 ,  H05K5/03 ,  A61N1/375 ,  A61N1/372

    Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.

    Nuclear radiation particle power converter
    56.
    发明授权
    Nuclear radiation particle power converter 有权

    公开(公告)号：US10096393B2

    公开(公告)日：2018-10-09

    申请号：US14666890

    申请日：2015-03-24

    Applicant: Medtronic, Inc.

    Inventor： Andreas Fenner ,  David A. Ruben ,  Anna J. Malin ,  Paul F. Gerrish ,  Bruce C. Fleischhauer ,  Larry E. Tyler

    IPC: G21H1/02 ,  G21H1/06 ,  G21C19/07 ,  G21H1/04

    Abstract: Various embodiments of a nuclear radiation particle power converter and method of forming such power converter are disclosed. In one or more embodiments, the power converter can include first and second electrodes, a three-dimensional current collector disposed between the first and second electrodes and electrically coupled to the first electrode, and a charge carrier separator disposed on at least a portion of a surface of the three-dimensional current collector. The power converter can also include a hole conductor layer disposed on at least a portion of the charge carrier separator and electrically coupled to the second electrode, and nuclear radiation-emitting material disposed such that at least one nuclear radiation particle emitted by the nuclear radiation-emitting material is incident upon the charge carrier separator.

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