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    Semiconductor device and method for determining fuse state
    52.
    发明授权
    Semiconductor device and method for determining fuse state 有权
    用于确定熔丝状态的半导体器件和方法

    公开(公告)号：US07679871B2

    公开(公告)日：2010-03-16

    申请号：US11806553

    申请日：2007-06-01

    Applicant: Norio Okada ,  Takehiro Ueda

    Inventor： Norio Okada ,  Takehiro Ueda

    IPC: H01L29/00

    CPC classification number: G11C17/18 ,  H01L23/5256 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor device includes a semiconductor substrate, a fuse which comprises a conductive material and is formed on a semiconductor substrate, a contacting target conductor region which is placed around the fuse on the semiconductor substrate and formed so as to make electrical contact with the fuse through the conductive material constituting the fuse when a process for cutting the fuse is carried out, and a determination unit which detects whether or not the fuse is electrically disconnected, and detects whether or not the contacting target conductor region and the fuse are electrically connected, and determines that the fuse is in a cut state when electrical disconnection of said fuse is detected or electrical connection between said contacting target conductor region and said fuse is detected.

    Abstract translation: 半导体器件包括半导体衬底，包括导电材料并形成在半导体衬底上的熔丝，接触目标导体区域，其被布置在半导体衬底上的保险丝周围并且形成为与保险丝电接触 当执行用于切割熔丝的处理时构成熔丝的导电材料，以及检测熔丝是否断电的判断单元，并检测接触目标导体区域和熔丝是否电连接，以及 当检测到所述保险丝的断电或检测到所述接触目标导体区域和所述保险丝之间的电连接时，确定所述保险丝处于切断状态。

    KEYPAD AND SLIDE TYPE MOBILE TERMINAL HAVING THE SAME
    53.
    发明申请
    KEYPAD AND SLIDE TYPE MOBILE TERMINAL HAVING THE SAME 失效
    键盘和滑盖类型移动终端

    公开(公告)号：US20090170576A1

    公开(公告)日：2009-07-02

    申请号：US12343649

    申请日：2008-12-24

    Applicant: Keiichi MINAMIDE ,  Norio Okada ,  Hideki Hayashi ,  Jong Seong Lee

    Inventor： Keiichi MINAMIDE ,  Norio Okada ,  Hideki Hayashi ,  Jong Seong Lee

    IPC: H04M1/00 ,  H03M11/00

    CPC classification number: H04M1/0237 ,  H04M1/23

    Abstract: A keypad and a slide type mobile terminal having the same are provided. The slide type mobile terminal includes a first main body; a keypad having an upper surface part and a lower surface part, and a second main body coupled to the first plate positioned at one end of the upper surface part of the keypad and slidably connected to the first main body. The upper surface part has a plurality of parallel first plates that form an upper surface of the keypad, and the first plates positioned at each end of the upper surface part each have a downward facing first latch disposed at one side thereof and the remaining first plates each have a downward facing first latch disposed at two sides thereof. The lower surface part has a plurality of parallel second plates that form a lower surface of the keypad, and each second plate has an upward facing second latch disposed at two sides thereof. One second latch of each second plate contacts an adjacent first latch.

    Abstract translation: 提供了具有它们的键盘和滑盖式移动终端。 滑盖式移动终端包括：第一主体; 具有上表面部分和下表面部分的键盘，以及联接到位于键盘的上表面部分的一端处的第一板的第二主体，并可滑动地连接到第一主体。 上表面部分具有形成小键盘的上表面的多个平行的第一板，并且位于上表面部分的每个端部的第一板各自具有设置在其一侧的向下的第一闩锁，而其余的第一板 每个具有设置在其两侧的向下的第一闩锁。 下表面部分具有形成小键盘的下表面的多个平行的第二板，并且每个第二板具有设置在其两侧的向上的第二闩锁。 每个第二板的一个第二闩锁接触相邻的第一闩锁。

    ELECTRONIC DEVICE
    54.
    发明申请
    ELECTRONIC DEVICE 审中-公开
    电子设备

    公开(公告)号：US20090016056A1

    公开(公告)日：2009-01-15

    申请号：US11814734

    申请日：2006-01-27

    Applicant: Shinichi Morikita ,  Tetsuya Kubo ,  Makoto Tamaru ,  Norio Okada

    Inventor： Shinichi Morikita ,  Tetsuya Kubo ,  Makoto Tamaru ,  Norio Okada

    IPC: F21V33/00

    CPC classification number: H04M1/0283 ,  H04M1/0214 ,  H04M1/22

    Abstract: Herein disclosed is an electronic device which can have, without deteriorating the effect of notification by light, an extended area to have electronic parts mounted thereon at the portion of the main body 20 covered with the accessory exterior panel 30, the extended area being extended in size compared with the conventional electronic device, the electronic device available for a cellular phone. The cellular phone 10 comprises a main body 20, an accessory exterior panel 30 detachably mounted on the main body 20, and four screws 50 for fixing the accessory exterior panel 30 to the main body 20. The main body 20 has LEDs and a light guide plate 22c irradiated by the LEDs. The light guide plate 22c is positioned to emit a light to the inner portion of the accessory exterior panel 30 through the side surface 30a of the accessory exterior panel 30.

    Abstract translation: 这里公开了一种电子设备，其能够在不损害光通知的效果的情况下，在主体20的被附件外板30覆盖的部分上安装有电子部件的扩展区域，延伸区域延伸到 与常规电子设备相比，该电子设备可用于蜂窝电话。 蜂窝电话10包括主体20，可拆卸地安装在主体20上的附件外部面板30和用于将附件外部面板30固定到主体20的四个螺钉50.主体20具有LED和导光体 由LED照射的板22c。 导光板22c被定位成通过辅助外板30的侧面30a向配件外板30的内部发光。

    SEMICONDUCTOR DEVICE
    55.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号：US20070262370A1

    公开(公告)日：2007-11-15

    申请号：US11745650

    申请日：2007-05-08

    Applicant: Norio Okada

    Inventor： Norio Okada

    IPC: H01L29/788

    CPC classification number: H01L21/022 ,  H01L21/02115 ,  H01L21/02164 ,  H01L21/3122 ,  H01L21/31612 ,  H01L21/78 ,  H01L22/34 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: In an interface between different interlayer insulating films formed of different insulating materials, a flaking-off of the film is easily created, as compared with an interface between interlayer insulating films formed of a same insulating material. A semiconductor device 1 includes a semiconductor substrate 10, an interlayer insulating film 20 (first interlayer insulating film), an interlayer insulating film 30 (second interlayer insulating film) and an interconnect structure 40. The interlayer insulating film 20 is provided on the semiconductor substrate 10. The interlayer insulating film 20 is formed of a first insulating material. The interlayer insulating film 30 is provided on the interlayer insulating film 20. The interlayer insulating film 30 is formed of a second insulating material. Here, the first and the second insulating materials are different insulating materials.The interconnect structure 40 is formed in the circumference region of the semiconductor device 1. The interconnect structure 40 is configured to include an electroconducting plug, and extends through the interface of the interlayer insulating film 20 and the interlayer insulating film 30.

    Abstract translation: 在由不同绝缘材料形成的不同层间绝缘膜之间的界面中，与由相同绝缘材料形成的层间绝缘膜之间的界面相比，容易产生剥离膜。 半导体器件1包括半导体衬底10，层间绝缘膜20（第一层间绝缘膜），层间绝缘膜30（第二层间绝缘膜）和互连结构40.层间绝缘膜20设置在半导体衬底上 层间绝缘膜20由第一绝缘材料形成。 层间绝缘膜30设置在层间绝缘膜20上。层间绝缘膜30由第二绝缘材料形成。 这里，第一和第二绝缘材料是不同的绝缘材料。 互连结构40形成在半导体器件1的周边区域中。互连结构40被配置为包括导电插塞，并延伸穿过层间绝缘膜20和层间绝缘膜30的界面。

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