公开(公告)号：US08463089B2

公开(公告)日：2013-06-11

申请号：US13318638

申请日：2010-05-19

Applicant: Norio Okada

Inventor： Norio Okada

IPC: G02B6/12

Abstract: A temperature control module and a support block are mounted on a metal stem. A dielectric substrate is mounted on a side surface of the support block. A support block is mounted on a cooling surface of the temperature control module. A dielectric substrate is mounted on a side surface of the support block. A semiconductor optical modulation element is mounted on the dielectric substrate. A lead pin and a signal line are connected through a bonding wire. The signal line and a signal conductor are connected through a bonding wire. The signal conductor and the semiconductor optical modulation element are connected through a bonding wire.

公开(公告)号：USD622245S1

公开(公告)日：2010-08-24

申请号：US29346744

申请日：2009-11-05

Applicant: Norio Okada ,  Jong-Seong Lee ,  Yusuru Masuda

Designer： Norio Okada ,  Jong-Seong Lee ,  Yusuru Masuda

公开(公告)号：US07301244B2

公开(公告)日：2007-11-27

申请号：US11153619

申请日：2005-06-16

Applicant: Yutaka Tsutsui ,  Norio Okada

Inventor： Yutaka Tsutsui ,  Norio Okada

IPC: H01L23/48

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L2224/02166 ,  H01L2224/05082 ,  H01L2224/05093 ,  H01L2224/05095 ,  H01L2224/05096 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/04941 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: A semiconductor device should have a structure that allows locating electronic components in a region under a bonding pad. The semiconductor device includes a bonding pad constituting the external connection terminal; a region under the bonding pad including at least two copper layers and a connection via plug, under said bonding pad, disposed so as to connect copper layers that form a pair out of the at least two copper layers; a seal ring constituted of an annular conductor, disposed so as to surround the region under the bonding pad, and to connect a lower one of the copper layers that form said pair to copper layer to form a pair with the lower copper layer; and an interconnect connected to the bonding pad outside the seal ring.

Abstract translation: 半导体器件应当具有允许将电子部件定位在焊盘下方的区域中的结构。 半导体器件包括构成外部连接端子的接合焊盘; 在所述接合焊盘下方具有包括至少两个铜层和至少两个铜层的接合焊盘下方的区域，所述接合焊盘设置成将形成所述至少两个铜层的铜层连接; 由环状导体构成的密封环，其设置为围绕接合焊盘下方的区域，并且将形成所述一对的铜层的下部一个铜层与铜层连接，与下部铜层形成一对; 以及连接到密封环外的接合焊盘的互连。

公开(公告)号：USD542286S1

公开(公告)日：2007-05-08

申请号：US29222940

申请日：2005-02-04

Applicant: Satoru Taniyama ,  Norio Okada ,  Yoshito Ishikawa

Designer： Satoru Taniyama ,  Norio Okada ,  Yoshito Ishikawa

公开(公告)号：USD539277S1

公开(公告)日：2007-03-27

申请号：US29222939

申请日：2005-02-04

Applicant: Norio Okada ,  Satoru Taniyama ,  Yoshito Ishikawa

Designer： Norio Okada ,  Satoru Taniyama ,  Yoshito Ishikawa

公开(公告)号：USD520980S1

公开(公告)日：2006-05-16

申请号：US29224251

申请日：2005-02-25

Applicant: Satoru Taniyama ,  Norio Okada ,  Yoshito Ishikawa

Designer： Satoru Taniyama ,  Norio Okada ,  Yoshito Ishikawa

公开(公告)号：US06268279B1

公开(公告)日：2001-07-31

申请号：US09320466

申请日：1999-05-27

Applicant: Norio Okada

Inventor： Norio Okada

IPC: H01L214763

CPC classification number: H01L21/76829 ,  H01L21/7681

Abstract: A first interlayer insulating film and an etching stopper film are sequentially formed on a semiconductor substrate with a surface area on which first wiring is formed. The etching stopper film is patterned so as to correspond to a pattern of via hole formed on the first interlayer insulating film and a pattern of forming a second wiring. A second interlayer insulating film is formed on the etching stopped film for forming the second wiring, a wiring trench is formed by etching the second interlayer insulating film. Continuously, the via hole is formed by etching the first interlayer insulating film while having the etching stopper film as a photomask. Conductive materials are laid in the via hole and the wiring trench so that the second wiring connected to the first wiring is formed.

Abstract translation: 第一层间绝缘膜和蚀刻阻挡膜依次形成在其上形成有第一布线的表面积的半导体基板上。 蚀刻停止膜被图案化以对应于形成在第一层间绝缘膜上的通孔的图案和形成第二布线的图案。 在用于形成第二布线的蚀刻停止膜上形成第二层间绝缘膜，通过蚀刻第二层间绝缘膜形成布线沟槽。 连续地，通过蚀刻第一层间绝缘膜同时具有蚀刻停止膜作为光掩模来形成通孔。 导电材料铺设在通孔和布线沟槽中，从而形成连接到第一布线的第二布线。

公开(公告)号：US08859946B2

公开(公告)日：2014-10-14

申请号：US13434925

申请日：2012-03-30

Applicant: Hiromitsu Itamoto ,  Norio Okada

Inventor： Hiromitsu Itamoto ,  Norio Okada

IPC: H03F3/08 ,  H04B10/69

CPC classification number: H04B10/691 ,  H04B10/693

Abstract: An optical detecting device includes a light-detecting element for outputting an electrical signal, a pre-amplifier for amplifying the electrical signal, a signal line connected to an output of the pre-amplifier, and a resistor and a capacitor connected in series between the signal line and GND.

Abstract translation: 光检测装置包括用于输出电信号的光检测元件，用于放大电信号的前置放大器，连接到前置放大器的输出的信号线以及串联连接在前置放大器之间的电阻器和电容器 信号线和GND。

公开(公告)号：US08547620B2

公开(公告)日：2013-10-01

申请号：US13090290

申请日：2011-04-20

Applicant: Norio Okada

Inventor： Norio Okada

IPC: G02B26/00 ,  G02F1/01

CPC classification number: G02F1/0121

Abstract: A light modulation device includes: an input terminal into which a modulation signal is input; a light modulation element including an anode connected to the input terminal and a cathode that is grounded; a matching resistor connected in parallel with the light modulation element; a matching capacitor connected to the light modulation element and connected in series to the matching resistor; and a protective resistor connected in parallel with the light modulation element, the matching resistor, and the matching capacitor.

Abstract translation: 光调制装置包括：输入端子，输入调制信号; 光调制元件，包括连接到输入端子的阳极和接地的阴极; 与光调制元件并联连接的匹配电阻器; 连接到光调制元件并与匹配电阻器串联连接的匹配电容器; 以及与光调制元件，匹配电阻器和匹配电容器并联连接的保护电阻器。

公开(公告)号：US08482091B2

公开(公告)日：2013-07-09

申请号：US12542961

申请日：2009-08-18

Applicant: Norio Okada ,  Masaharu Nakaji

Inventor： Norio Okada ,  Masaharu Nakaji

IPC: H01L31/0232

CPC classification number: H01L31/02005 ,  H01L31/022408 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: A light receiving element comprises: a photodiode including an optical waveguide, an end surface of the optical waveguide being a light receiving surface of the photodiode; a signal electrode and a bias electrode on a common surface of the photodiode, the signal electrode being connected to an anode of the photodiode, the bias electrode being connected to a cathode of the photodiode; an insulating film on the bias electrode; and a metal electrode on the insulating film.

Abstract translation: 光接收元件包括：包括光波导的光电二极管，光波导的端面是光电二极管的光接收表面; 在光电二极管的公共表面上的信号电极和偏置电极，信号电极连接到光电二极管的阳极，偏置电极连接到光电二极管的阴极; 偏置电极上的绝缘膜; 和绝缘膜上的金属电极。