公开(公告)号：US10998136B2

公开(公告)日：2021-05-04

申请号：US15618201

申请日：2017-06-09

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: H01G4/33 ,  H01G4/005 ,  H01G4/10 ,  H01G4/012

Abstract: Provided is a three-dimensional (3D) capacitor including conductors formed at a high density inside holes of an anodic oxide film, and a first electrode layer and a second electrode layer electrically connected to the conductors. Thus, a high capacitance relative to a size of the 3D capacitor may be easily achieved.

公开(公告)号：US10889009B2

公开(公告)日：2021-01-12

申请号：US16551566

申请日：2019-08-26

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: B25J15/06 ,  B25J7/00 ,  H01L33/00

Abstract: The present invention relates to a transfer head gripping and transferring micro LEDs from a first substrate to a second substrate. More particularly, the present invention relates to a transfer head gripping and transferring micro LEDs in a batch manner without any error even when there is a height difference of the micro LEDs.

公开(公告)号：US20180100842A1

公开(公告)日：2018-04-12

申请号：US15718570

申请日：2017-09-28

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N33/00 ,  G01N27/14

CPC classification number: G01N33/0027 ,  G01N27/128 ,  G01N27/14 ,  G01N33/0014

Abstract: A micro sensor package having a low thermal conductivity includes: a substrate on which a metal pattern is formed; a sensing chip disposed on the substrate; a cover covering the sensing chip and formed with a hole for supplying gas to the sensing chip; and a filter covering the hole, wherein the sensing chip comprises a sensor platform having a plurality of first pores formed along the up-down direction, and a sensor electrode formed on an upper portion or a lower portion of the sensor platform and electrically connected to the metal pattern.

公开(公告)号：US20170167025A1

公开(公告)日：2017-06-15

申请号：US15369042

申请日：2016-12-05

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: C23C16/455 ,  C25D11/24

CPC classification number: C23C16/45565 ,  B01D67/003 ,  B01D67/0062 ,  B01D67/0065 ,  B01D69/06 ,  B01D71/022 ,  B01D71/025 ,  B01D2325/02 ,  C23C16/4404 ,  C25D11/04 ,  C25D11/24 ,  H01J37/3244

Abstract: A fluid permeable anodic oxide film includes a plurality of regularly-disposed pores formed by anodizing metal and a plurality of permeation holes having an inner width larger than an inner width of the pores and extending through the fluid permeable anodic oxide film. Also provided is a fluid permeable body which makes use of the fluid permeable anodic oxide film.

公开(公告)号：US20160084787A1

公开(公告)日：2016-03-24

申请号：US14864184

申请日：2015-09-24

Applicant: Point Engineering Co., Ltd.

Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

IPC: G01N27/12 ,  H05B3/28 ,  H05B3/03

CPC classification number: H05B3/03 ,  G01N27/12 ,  H05B3/262 ,  H05B2203/014 ,  H05B2203/017

Abstract: A micro heater and a micro sensor is capable of providing a heater having a small thermal capacity by forming an air gap which surrounds the heater wire, and forming the heater wire on a porous substrate.

Abstract translation: 微加热器和微型传感器能够通过形成围绕加热丝的气隙来形成具有小热容量的加热器，并且在多孔基底上形成加热丝。