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公开(公告)号:US10267855B2
公开(公告)日:2019-04-23
申请号:US15783365
申请日:2017-10-13
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel , Baher S. Haroun , Brian J. Lasher , Anjali Vij
IPC: G01R31/3177 , G01R31/3185 , G01R31/317
Abstract: IEEE 1149.1 Test Access Ports (TAPs) may be utilized at both IC and intellectual property core design levels. TAPs serve as serial communication ports for accessing a variety of embedded circuitry within ICs and cores including; IEEE 1149.1 boundary scan circuitry, built in test circuitry, internal scan circuitry, IEEE 1149.4 mixed signal test circuitry, IEEE P5001 in-circuit emulation circuitry, and IEEE P1532 in-system programming circuitry. Selectable access to TAPs within ICs is desirable since in many instances being able to access only the desired TAP(s) leads to improvements in the way testing, emulation, and programming may be performed within an IC. A TAP linking module is described that allows TAPs embedded within an IC to be selectively accessed using 1149.1 instruction scan operations.
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公开(公告)号:US10247779B2
公开(公告)日:2019-04-02
申请号:US15901398
申请日:2018-02-21
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3183 , G01R31/3185 , G06F11/273 , G01R31/3177 , G01R31/317
Abstract: The disclosure describes novel methods and apparatuses for accessing test compression architectures (TCA) in a device using either a parallel or serial access technique. The serial access technique may be controlled by a device tester or by a JTAG controller. Further the disclosure provides an approach to access the TCA of a device when the device exists in a daisy-chain arrangement with other devices, such as in a customer's system. Additional embodiments are also provided and described in the disclosure.
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公开(公告)号:US20190064267A1
公开(公告)日:2019-02-28
申请号:US16173699
申请日:2018-10-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/317 , G06F17/50 , G01R31/3185 , G01R31/3177
CPC classification number: G01R31/31723 , G01R31/31724 , G01R31/31725 , G01R31/31727 , G01R31/3177 , G01R31/318508 , G01R31/318536 , G06F17/5081
Abstract: In a first embodiment a TAP 318 of IEEE standard 1149.1 is allowed to commandeer control from a WSP 202 of IEEE standard P1500 such that the P1500 architecture, normally controlled by the WSP, is rendered controllable by the TAP. In a second embodiment (1) the TAP and WSP based architectures are merged together such that the sharing of the previously described architectural elements are possible, and (2) the TAP and WSP test interfaces are merged into a single optimized test interface that is operable to perform all operations of each separate test interface.
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公开(公告)号:US10215805B2
公开(公告)日:2019-02-26
申请号:US16037649
申请日:2018-07-17
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185
Abstract: The disclosure describes a novel method and apparatus for providing a shadow access port within a device. The shadow access port is accessed to perform operations in the device by reusing the TDI, TMS, TCK and TDO signals that are used to operate a test access port within the device. The presence and operation of the shadow access port is transparent to the presence and operation of the test access port. According to the disclosure, the shadow access port operates on the falling edge of the TCK signal while the test access port conventionally operates on the rising edge of the TCK signal.
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公开(公告)号:US10209304B2
公开(公告)日:2019-02-19
申请号:US15945414
申请日:2018-04-04
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185 , G01R31/317
Abstract: The disclosure describes novel methods and apparatuses for controlling a device's TCA circuit when the device exists in a JTAG daisy-chain arrangement with other devices. The methods and apparatuses allow the TCA test pattern set used during device manufacturing to be reused when the device is placed in a JTAG daisy-chain arrangement with other devices, such as in a customers system using the device. Additional embodiments are also provided and described in the disclosure.
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公开(公告)号:US10132864B2
公开(公告)日:2018-11-20
申请号:US15648750
申请日:2017-07-13
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/317 , G01R31/319 , G01R31/28 , G01R31/3177
Abstract: The present disclosure describes a novel method and apparatus for using a device's power and ground terminals as a test and/or debug interface for the device. According to the present disclosure, messages are modulated over DC voltages applied to the power terminals of a device to input test/debug messages to the device and output test/debug messages from the device. The present disclosure advantageously allows a device to be tested and/or debugged without the device having any shared or dedicated test or debug interface terminals.
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公开(公告)号:US10120023B2
公开(公告)日:2018-11-06
申请号:US15991581
申请日:2018-05-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/317 , G01R31/3185 , G01R31/3183 , G01R31/3177 , G01R31/28
Abstract: This disclosure describes die test architectures that can be implemented in a first, middle and last die of a die stack. The die test architectures are mainly the same, but for the exceptions mentioned in this disclosure.
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公开(公告)号:US10120022B2
公开(公告)日:2018-11-06
申请号:US15467517
申请日:2017-03-23
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/317 , G01R31/3185 , G01R31/3177
Abstract: The disclosure describes a novel method and apparatus for providing expected data, mask data, and control signals to scan test architectures within a device using the falling edge of a test/scan clock. The signals are provided on device leads that are also used to provide signals to scan test architectures using the rising edge of the test/scan clock. According to the disclosure, device test leads serve to input different test signals on the rising and falling edge of the test/scan clock which reduces the number of interconnects between a tester and the device under test.
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公开(公告)号:US20180308774A1
公开(公告)日:2018-10-25
申请号:US16019848
申请日:2018-06-27
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: H01L21/66 , H01L23/48 , G01R31/28 , H01L25/065 , G01R31/3185
CPC classification number: H01L22/34 , G01R31/2853 , G01R31/318513 , G01R31/318538 , H01L22/32 , H01L23/481 , H01L25/0657 , H01L2225/06513 , H01L2225/06544 , H01L2225/06596 , H01L2924/0002 , H01L2924/00
Abstract: The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of die. The testing is facilitated by test circuitry associated with each type of TSV. The test circuitry includes a scan cell adapted for testing TSVs.
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公开(公告)号:US20180292455A1
公开(公告)日:2018-10-11
申请号:US16003858
申请日:2018-06-08
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Lee D. Whetsel
IPC: G01R31/3177 , G01R31/3185
CPC classification number: G01R31/3177 , G01R31/318555 , G01R31/318563
Abstract: A device test architecture and interface is provided to enable efficient testing embedded cores within devices. The test architecture interfaces to standard IEEE 1500 core test wrappers and provides high test data bandwidth to the wrappers from an external tester. The test architecture includes compare circuits that allow for comparison of test response data to be performed within the device. The test architecture further includes a memory for storing the results of the test response comparisons. The test architecture includes a programmable test controller to allow for various test control operations by simply inputting an instruction to the programmable test controller from the external tester. The test architecture includes a selector circuit for selecting a core for testing. Additional features and embodiments of the device test architectures are also disclosed.
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