公开(公告)号：US20100320622A1

公开(公告)日：2010-12-23

申请号：US12820546

申请日：2010-06-22

Applicant: Yoshihiro Machida

Inventor： Yoshihiro Machida

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L23/5389 ,  H01L23/49822 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05144 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In an electronic component built-in wiring substrate, an electronic component is mounted on a first wiring substrate. A second wiring substrate is stacked on the first wiring substrate and is connected electrically to the first wiring substrate by connection terminals. The second wiring substrate has an opening portion of a size larger than a planar area of the electronic component. An underfill resin is filled in a first space between the first wiring substrate and the electronic component, and has a raised portion which is raised along an outer peripheral side surface of the electronic component, seals a clearance between an inner peripheral edge of the opening portion and an outer peripheral edge of the electronic component and supports the second wiring substrate. A sealing resin is filled in a second space between the first and second wiring substrates.

Abstract translation: 在电子部件内置布线基板中，电子部件安装在第一布线基板上。 第二布线基板堆叠在第一布线基板上，并通过连接端子与第一布线基板电连接。 第二布线基板具有比电子部件的平面面积大的开口部。 底部填充树脂填充在第一布线基板和电子部件之间的第一空间中，并且具有沿着电子部件的外周侧表面升高的凸起部分，密封开口部分的内周边缘之间的间隙 和电子部件的外周边缘，并且支撑第二布线基板。 密封树脂填充在第一和第二布线基板之间的第二空间中。

公开(公告)号：US07829378B2

公开(公告)日：2010-11-09

申请号：US12044397

申请日：2008-03-07

Applicant: Yoshihiro Machida

Inventor： Yoshihiro Machida

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/6835 ,  H01L21/4853 ,  H01L24/11 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/0231 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014

Abstract: A method includes a step of forming a bump 104 having a projection 104B on an electrode pad 103 provided on a semiconductor chip 101, a step of exposing a part of the projection 104B to an upper surface of an insulating layer 105 formed on the semiconductor chip 101, a step of forming a conductive layer 107A on the upper surface of the insulating layer 105 and an exposed part of a tip portion 104D, a step of removing a protruded portion of the conductive layer 107A which is opposed to the tip portion 104D by means of a grinding roll 112, thereby exposing the projection from the conductive layer 107A, and a step of forming a conductive layer 108A through electrolytic plating using the conductive layer 107A as a feeding layer and patterning the conductive layer 108A.

Abstract translation: 一种方法包括在设置在半导体芯片101上的电极焊盘103上形成具有突起104B的突起104的步骤，将突起104B的一部分暴露于形成在半导体芯片上的绝缘层105的上表面的步骤 如图101所示，在绝缘层105的上表面上形成导电层107A和尖端部分104D的露出部分的步骤，除去与尖端部分104D相对的导电层107A的突出部分的步骤 研磨辊112的装置，从而使导电层107A暴露，以及通过使用导电层107A作为馈电层的电解电镀形成导电层108A并图案化导电层108A的步骤。

公开(公告)号：US20100182435A1

公开(公告)日：2010-07-22

申请号：US12622802

申请日：2009-11-20

Applicant: Yoshihiro Machida ,  Kouji Kamogawa ,  Kazunori Iwabuchi

Inventor： Yoshihiro Machida ,  Kouji Kamogawa ,  Kazunori Iwabuchi

IPC: H04N5/225

CPC classification number: H04L67/06 ,  G06F17/30781 ,  H04N7/17318 ,  H04N21/2743 ,  H04N21/4312 ,  H04N21/4314 ,  H04N21/4828 ,  H04N21/84

Abstract: Video information, which is photographed with using a GPS built-in video camera, is inputted into a video information server. A video information correspondence table is produced, which associated photographing time of the video information inputted, data address of the video information photographed, and photographing position, and is memorized. According to a request from a display apparatus, the memorized video information correspondence table is searched, and thereby obtaining the video information having the information of time and position designated.

Abstract translation: 使用GPS内置摄像机拍摄的视频信息被输入到视频信息服务器。 产生视频信息对应表，其中记录输入的视频信息的拍摄时间，拍摄的视频信息的数据地址和拍摄位置，并且被记忆。 根据来自显示装置的请求，搜索存储的视频信息对应表，从而获得具有指定的时间和位置的信息的视频信息。

公开(公告)号：US20100095316A1

公开(公告)日：2010-04-15

申请号：US12421005

申请日：2009-04-09

Applicant: Kazunori IWABUCHI ,  Kouji Kamogawa ,  Yoshihiro Machida

Inventor： Kazunori IWABUCHI ,  Kouji Kamogawa ,  Yoshihiro Machida

IPC: H04N7/16 ,  H04N7/173

CPC classification number: H04N21/2543 ,  H04N7/17318 ,  H04N7/17327 ,  H04N21/2225 ,  H04N21/2541 ,  H04N21/2747 ,  H04N21/47202 ,  H04N21/6125

Abstract: A content transmission server and client and method which may implement the viewing of contents by concentrating all the contents into the storage/delivery-performing server, and performing the television broadcast, and which may make unnecessary the video-recording at user's own whereabouts, and may prevent the unauthorized copy and leakage-out onto an unauthorized network by making the on-server video-recording always available in a manner of the on-server right purchasing.

Abstract translation: 一种内容传输服务器和客户端和方法，其可以通过将所有内容集中到存储/传送执行服务器中并且执行电视广播来实现内容的观看，并且可能使用户自己的下落不必要的视频记录，以及 可以通过使服务器上的视频录制始终以服务器正确的购买方式可用，从而防止未经授权的复制和泄露到未经授权的网络。

公开(公告)号：US07615408B2

公开(公告)日：2009-11-10

申请号：US12212171

申请日：2008-09-17

Applicant: Yoshihiro Machida

Inventor： Yoshihiro Machida

IPC: H01L21/00

CPC classification number: H01L23/544 ,  G03F9/7076 ,  G03F9/7084 ,  H01L21/6835 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2221/68359 ,  H01L2223/54453 ,  H01L2223/5448 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/013

Abstract: An internal connecting terminal 12 is formed on electrode pads 23 of a plurality of semiconductor chips 11 formed on a semiconductor substrate 35, and there is formed a resin member 13 having a resin member body 13-1 and a protruded portion 13-2 and covering the semiconductor chips 11 on which the internal connecting terminal 12 is formed, a metal layer 39 is formed on the resin member body 13-1 and the protruded portion 13-2 is used as an alignment mark to form a resist film 48 covering the metal layer 39 in a part corresponding to a region in which a wiring pattern 14 is formed and to then carry out etching over the metal layer 39 by using the resist layer 48 as a mask, thereby forming the wiring pattern 14 which is electrically connected to the internal connecting terminal 12.

Abstract translation: 内部连接端子12形成在形成在半导体基板35上的多个半导体芯片11的电极焊盘23上，形成树脂部件13，该树脂部件13具有树脂部件主体13-1和突出部13-2， 在其上形成有内部连接端子12的半导体芯片11，在树脂构件主体13-1上形成金属层39，并且将突出部13-2用作对准标记，以形成覆盖金属的抗蚀剂膜48 层39的一部分对应于其中形成布线图案14的区域，然后通过使用抗蚀剂层48作为掩模在金属层39上进行蚀刻，从而形成电连接到金属层39的布线图案14 内部连接端子12。

公开(公告)号：US20080089048A1

公开(公告)日：2008-04-17

申请号：US11907179

申请日：2007-10-10

Applicant: Takaharu Yamano ,  Yoshihiro Machida

Inventor： Takaharu Yamano ,  Yoshihiro Machida

IPC: H05K7/02 ,  H01L21/56

CPC classification number: H05K1/186 ,  H01L23/5384 ,  H01L23/5389 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15313 ,  H01L2924/3511 ,  H05K3/4644 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2203/0733 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A substrate with built-in electronic components includes a substrate on which a first conductive pattern is formed; an electronic component mounted on the substrate; an insulting layer which is formed by stacking a plurality of resin layers including indifferent additive ratios an additive material for adjusting hardness; a second conductive pattern formed on the insulating layer; and a conductive post for connecting the first conductive pattern to the second conductive pattern.

Abstract translation: 具有内置电子部件的基板包括其上形成有第一导电图案的基板; 安装在所述基板上的电子部件; 绝缘层，其通过堆叠包括无差异添加剂比例的多个树脂层形成，用于调节硬度的添加剂材料; 形成在所述绝缘层上的第二导电图案; 以及用于将第一导电图案连接到第二导电图案的导电柱。

公开(公告)号：US20070218589A1

公开(公告)日：2007-09-20

申请号：US11724265

申请日：2007-03-15

Applicant: Yoshihiro Machida

Inventor： Yoshihiro Machida

IPC: H01L21/46

CPC classification number: H05K3/4614 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/0195 ,  H05K2201/055 ,  H05K2201/09536 ,  H05K2203/061

Abstract: A first multilayer wiring structural body 16 and a second multilayer wiring structural body 56 are simultaneously formed on both surfaces 101A, 101B of a substrate 101 and thereafter the portion of a structural body 120 corresponding to a third region C1 is folded so as to oppose a second structural body 22 to a second structural body 62 and the first multilayer wiring structural body 16 is electrically connected to the second multilayer wiring structural body 56.

Abstract translation: 在基板101的两面101A，101B上同时形成第一多层布线结构体16和第二多层布线结构体56，然后将与第三区域C 1对应的结构体120的部分折叠成 将第二结构体22与第二结构体62相对，第一多层布线结构体16与第二多层布线结构体56电连接。

公开(公告)号：US20060087045A1

公开(公告)日：2006-04-27

申请号：US11224821

申请日：2005-09-13

Applicant: Takaharu Yamano ,  Tadashi Arai ,  Yoshihiro Machida

Inventor： Takaharu Yamano ,  Tadashi Arai ,  Yoshihiro Machida

IPC: H01L23/28

CPC classification number: H01L23/293 ,  H01L21/568 ,  H01L23/29 ,  H01L23/31 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83191 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A disclosed substrate having a built-in semiconductor chip includes the built-in semiconductor chip, a resin member having the built-in semiconductor chip contained therein and external connection terminals. The resin member contains a resin and 60 to 90% by weight of spherical filler.

Abstract translation: 公开的具有内置半导体芯片的基板包括内置半导体芯片，其中包含有内置半导体芯片的树脂部件和外部连接端子。 树脂构件含有树脂和60〜90重量％的球形填料。

公开(公告)号：US4583838A

公开(公告)日：1986-04-22

申请号：US620115

申请日：1984-06-13

Applicant: Yoshihiro Machida ,  Isamu Itoi ,  Seigo Imai ,  Kozo Inui

Inventor： Yoshihiro Machida ,  Isamu Itoi ,  Seigo Imai ,  Kozo Inui

IPC: G03B27/04 ,  G03F7/20 ,  G03B27/06

CPC classification number: G03F7/20 ,  G03B27/04

Abstract: A printing apparatus including at least one pallet for accommodating an original film and a mask film, at least one pallet for accommodating a spent original film and spent mask film, at least one pallet for accommodating each one of the sizes of the sensitive sheets, a pair of guide rails provided among a pallet for temporarily storing the sensitive sheet, the pallets being movable between a waiting position and a drawn position right above the exposure section provided adjacent to the waiting position by engagement between a pair of guide members mounted on each pallet and the guide rails, a pallet shifting mechanism for the reciprocating movement of each pallet between the waiting position and the drawn position along with the guide rail, and a carrier having suckers mounted on a movable plate thereof and for the reciprocating movement between the waiting position and the drawn position as well as for the vertical movement between a path for the reciprocating movement and an upper side of the exposure section.

Abstract translation: 一种打印装置，包括至少一个用于容纳原始胶片的托盘和掩模膜，至少一个托盘，用于容纳废弃的原始胶片和废弃的掩模膜;至少一个托盘，用于容纳敏感片材的每一个尺寸; 一对导轨设置在用于临时存放敏感片材的托盘之间，该托盘可以在安装在每个托盘上的一对引导构件之间的接合处通过接合在等待位置附近的等待位置和绘制位置之间移动。 和导轨，用于每个托盘在等待位置和拉出位置之间与导轨一起往复运动的托盘移动机构，以及托架，其具有安装在其可移动板上的吸盘，并且用于在等待位置 以及拉伸位置以及用于往复运动的路径和上侧之间的垂直运动 ide的曝光部分。

公开(公告)号：US4437759A

公开(公告)日：1984-03-20

申请号：US418379

申请日：1982-09-15

Applicant: Hidekatu Mizukami ,  Yoshihiro Machida

Inventor： Hidekatu Mizukami ,  Yoshihiro Machida

IPC: G03B27/04 ,  G03B27/20

CPC classification number: G03B27/04

Abstract: A contact printer in which, when a spring roller is rolled over a transparent plate on which an original plate and a photosensitive material are laid one on another, a flexible airtight sheet wound round the spring roller is extended to cover the transparent plate. The distance between the transparent plate and the spring roller is gradually reduced as the spring roller is rolled rearwards, so that the distance between the transparent plate and the point of contact of the airtight sheet to its own rolled part wound round the spring roller is maintained substantially to a fixed value, thereby contacting the original plate and the photosensitive material onto the transparent plate tightly. A squeeze roller may be provided for squeezing air from a space between the transparent plate and the airtight sheet by rolling thereon. A lower step on which the spring roller and the squeeze roller may be held when the printer is not used, can be formed in the front top end of a frame body.

Abstract translation: 一种接触式打印机，其中，当弹簧辊在其上放置原版和感光材料的透明板上滚动时，将缠绕在弹簧辊上的柔性气密片延伸以覆盖透明板。 当弹簧辊向后滚动时，透明板和弹簧辊之间的距离逐渐减小，从而保持透明板与卷绕在弹簧辊上的自身卷绕部分的气密接触点之间的距离 基本上达到固定值，从而将原始板和感光材料紧密接触到透明板上。 可以提供挤压辊，用于通过滚动在透明板和气密片之间的空间中挤压空气。 当不使用打印机时可以保持弹簧辊和挤压辊的下部台阶可以形成在框体的前上端。