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    Direct acting vertical thermal actuator
    51.
    发明申请
    Direct acting vertical thermal actuator 审中-公开
    直动式垂直导热器

    公开(公告)号：US20020195674A1

    公开(公告)日：2002-12-26

    申请号：US10217714

    申请日：2002-08-13

    Applicant: 3M Innovative Properties Company

    Inventor： Billy L. Weaver ,  Douglas P. Goetz ,  Kathy L. Hagen ,  Mike E. Hamerly ,  Robert G. Smith ,  Silva K. Theiss

    IPC: H01L029/82

    CPC classification number: G02B6/358 ,  B81B3/0024 ,  B81B3/0037 ,  B81B2201/031 ,  B81B2201/045 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/053 ,  B82Y15/00 ,  G02B6/352 ,  G02B6/3576 ,  H01G5/18 ,  H01H1/0036 ,  H01H61/04 ,  H01H2061/006 ,  H01H2061/008

    Abstract: A micrometer sized, single-stage, vertical thermal actuator capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. A member mechanically and electrically couples the free ends of the hot and cold arms such that the member moves away from the substrate when current is applied to at least the hot arm. The hot arm can optionally include a grounding tab to minimize thermal expansion of the cold arm.

    Abstract translation: 微米尺寸的单级垂直热致动器，其能够将微米尺寸的光学器件重复并快速地移动离开衬底的表面。 垂直热致动器构造在基板的表面上。 至少一个热臂具有锚固在表面上的第一端和位于表面上方的自由端。 冷臂具有锚固在表面上的第一端和自由端。 冷臂相对于表面位于热臂上方。 机构和电气耦合热臂和冷臂的自由端，使得当电流施加到至少热臂时，构件远离基板移动。 热臂可以可选地包括接地片，以最小化冷臂的热膨胀。

    Multi-directional thermal actuator
    52.
    发明授权
    Multi-directional thermal actuator 失效
    多向导热器

    公开(公告)号：US06438954B1

    公开(公告)日：2002-08-27

    申请号：US09845188

    申请日：2001-04-27

    Applicant: Douglas P. Goetz ,  Mike E. Hamerly ,  Daniel B. Pendergrass ,  Robert G. Smith ,  Silva K. Theiss ,  Billy L. Weaver

    Inventor： Douglas P. Goetz ,  Mike E. Hamerly ,  Daniel B. Pendergrass ,  Robert G. Smith ,  Silva K. Theiss ,  Billy L. Weaver

    IPC: F01B2910

    CPC classification number: B81B3/0021 ,  B81B2201/031 ,  B81B2203/0307 ,  B81B2203/051 ,  B81B2203/053 ,  H01G5/18 ,  H01G5/40 ,  H01H2061/008

    Abstract: A micrometer sized multi-directional thermal actuator capable of repeatable and rapid displacement in a substantially horizontal direction, a substantially vertical direction, and/or a combination thereof. The multi-directional thermal actuator constructed on a surface of a substrate includes three or more beams each cantilevered from one or more anchors at a first end to extend generally parallel to the surface of the substrate. A member mechanically and electrically couples the distal ends of the beams. Application of current to a circuit comprising combinations of any two or more of the beams displaces the member in one of three or more non-parallel radial directions, respectively.

    Abstract translation: 一种千分尺尺寸的多方向热致动器，其能够在基本上水平的方向，基本上垂直的方向上重复和快速地移动，和/或它们的组合。 构造在基板的表面上的多向热致动器包括三个或更多个梁，每个梁在第一端处从一个或多个锚固件悬臂延伸，以大致平行于基板的表面延伸。 机械和电气耦合梁的远端的部件。 将电流施加到包括任何两个或更多个光束的组合的电路中，分别使构件在三个或更多个非平行的径向方向之一中移位。

    Microelectromechanical valves including single crystalline material components
    53.
    发明授权
    Microelectromechanical valves including single crystalline material components 有权
    微电机阀包括单晶材料组分

    公开(公告)号：US06386507B2

    公开(公告)日：2002-05-14

    申请号：US09802260

    申请日：2001-03-08

    Applicant: Vijayakumar R. Dhuler ,  Mark David Walters

    Inventor： Vijayakumar R. Dhuler ,  Mark David Walters

    IPC: F16K3100

    CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

    Abstract: A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein the associated components are actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such, the valve may include at least one valve plate that is controllably brought into engagement with at least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which the valve plate sealingly engages the valve opening and an open position in which the valve plate is at least partly disengaged from and does not seal the valve opening.

    Abstract translation: 提供了一种微电子机械（MEMS）装置，其包括微电子基板和热致动的微致动器以及设置在基板上并由单晶材料形成为单一结构的相关部件，其中相关部​​件由热致动器由微致动器致动 。 例如，MEMS器件可以是阀。 因此，阀可以包括至少一个阀板，该阀板通过选择性地致动微致动器而可控制地与微电子衬底中的至少一个阀开口接合。 虽然MEMS器件可以包括各种微致动器，微致动器有利地包括设置在基板上的一对间隔开的支撑件和在其间延伸的至少一个拱形梁。 通过加热微致动器的至少一个拱形梁，拱形梁将进一步拱起，使得微致动器在关闭位置之间移动，在该关闭位置中阀板密封地接合阀开口和打开位置，在该位置阀板至少部分地 与阀开口脱离并不密封。

    Microelectromechanical valves including single crystalline material components
    55.
    发明申请
    Microelectromechanical valves including single crystalline material components 有权
    微电机阀包括单晶材料组分

    公开(公告)号：US20010017358A1

    公开(公告)日：2001-08-30

    申请号：US09802260

    申请日：2001-03-08

    Inventor： Vijayakumar R. Dhuler ,  Mark David Walters

    IPC: F16K031/02

    CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

    Abstract: A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein the associated components are actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such, the valve may include at least one valve plate that is controllably brought into engagement with at least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which the valve plate sealingly engages the valve opening and an open position in which the valve plate is at least partly disengaged from and does not seal the valve opening. The microactuator may further include metallization traces on distal portions of the arched beams to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch for maintaining the valve plate in a desired position without requiring continuous energy input to the microactuator. An advantageous method for fabricating a MEMS valve having unitary structure single crystalline components is also provided.

    Abstract translation: 提供了一种微电子机械（MEMS）装置，其包括微电子基板和热致动的微致动器以及设置在基板上并由单晶材料形成为单一结构的相关部件，其中相关部​​件由热致动器由微致动器致动 。 例如，MEMS器件可以是阀。 因此，阀可以包括至少一个阀板，该阀板通过选择性地致动微致动器而可控制地与微电子衬底中的至少一个阀开口接合。 虽然MEMS器件可以包括各种微致动器，微致动器有利地包括设置在基板上的一对间隔开的支撑件和在其间延伸的至少一个拱形梁。 通过加热微致动器的至少一个拱形梁，拱形梁将进一步拱起，使得微致动器在关闭位置之间移动，在该关闭位置中阀板密封地接合阀开口和打开位置，在该位置阀板至少部分地 与阀开口脱离并不密封。 微致动器还可以包括在拱形梁的远侧部分上的金属化迹线，以将拱形梁的热致动区域约束到其中间部分。 阀还可以包括用于将阀板保持在期望位置的闩锁，而不需要连续的能量输入到微致动器。 还提供了一种用于制造具有单一结构单晶组件的MEMS阀的有利方法。

    In-plane MEMS thermal actuator and associated fabrication methods
    56.
    发明授权
    In-plane MEMS thermal actuator and associated fabrication methods 有权
    平面MEMS热致动器

    公开(公告)号：US06211598B1

    公开(公告)日：2001-04-03

    申请号：US09395068

    申请日：1999-09-13

    Applicant: Vijayakumar R. Dhuler ,  Edward Hill ,  Allen Cowen

    Inventor： Vijayakumar R. Dhuler ,  Edward Hill ,  Allen Cowen

    IPC: H02N1000

    CPC classification number: F16K99/0001 ,  B81B3/0024 ,  B81B2201/031 ,  F03G7/06 ,  F15C5/00 ,  F16K99/0007 ,  F16K99/0036 ,  F16K99/0042 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H1/0036 ,  H01H37/32 ,  H01H2037/008 ,  Y10S310/06

    Abstract: A MEMS thermal actuator device is provided that is capable of providing linear displacement in a plane generally parallel to the surface of a substrate. Additionally, the MEMS thermal actuator may provide for a self-contained heating mechanism that allows for the thermal actuator to be actuated using lower power consumption and lower operating temperatures. The MEMS thermal actuator includes a microelectronic substrate having a first surface and at least one anchor structure affixed to the first surface. A composite beam extends from the anchor(s) and overlies the first surface of the substrate. The composite beam is adapted for thermal actuation, such that it will controllably deflect along a predetermined path that extends substantially parallel to the first surface of the microelectronic substrate.

    Abstract translation: 提供了一种MEMS热致动器装置，其能够在大致平行于衬底的表面的平面中提供线性位移。 此外，MEMS热致动器可以提供独立的加热机构，其允许使用较低的功率消耗和较低的工作温度来致动热致动器。 MEMS热致动器包括具有固定到第一表面的第一表面和至少一个锚定结构的微电子衬底。 复合梁从锚固体延伸并且覆盖在基底的第一表面上。 组合梁适于热致动，使得其可沿着基本上平行于微电子衬底的第一表面延伸的预定路径可控地偏转。

    Integrated circuit packages having stress-relieving features
    58.
    发明授权
    Integrated circuit packages having stress-relieving features 有权

    公开(公告)号：US12091310B2

    公开(公告)日：2024-09-17

    申请号：US17331762

    申请日：2021-05-27

    Applicant: TallannQuest LLC

    Inventor： David A. Grant ,  Abhijeet Ghoshal

    IPC: B81B3/00 ,  B81C1/00 ,  H02N10/00

    CPC classification number: B81B3/0072 ,  B81C1/00666 ,  H02N10/00 ,  B81B2201/031 ,  B81B2207/07 ,  H01L2224/0235

    Abstract: Expansion compensating structures are formed in redistribution layers of a wafer-level chip-scale integrated circuit package (WLCSP) or other IC package having a low-expansion substrate. The structures include micromechanical actuators designed and oriented to move solder bumps attached to them in the same direction and distance as a function of temperature as do pads to which they may be connected on a higher-expansion substrate such as a printed circuit board. Expansion compensated IC packages incorporating these expansion compensating structures are provided, as well as expansion compensated assemblies containing one or more of these IC packages. Methods of fabricating expansion compensated IC packages requiring minimal changes to existing commercial WLCSP fabrication processes are also provided. These devices and methods will result in assemblies having improved board-level reliability during thermal cycling, and allow the use of larger IC die sizes in WLCSP technology.

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