Abstract:
The present invention relates to an electret condenser microphone which comprises an exterior sidewall structure attached to a carrier. The exterior sidewall structure comprises a non-conductive base material carrying first and second electrical wiring patterns electrically connected to first and second electrical traces, respectively, of the carrier. A diaphragm holder, carrying a conductive microphone diaphragm is attached to the sidewall structure to establish electrical connection between a conductive microphone diaphragm and one of the first and second electrical wiring patterns of the sidewall structure. A conductive perforated backplate is arranged in spaced relationship to the conductive microphone diaphragm. The conductive perforated backplate is electrically connected to another one of the first and second wiring patterns of the sidewall structure. The sidewall structure may therefore be utilized to provide electrical connectivity from the conductive microphone diaphragm and from the backplate to a microphone preamplifier arranged on the carrier.
Abstract:
A shower assembly and system. The assembly may include a shower device including a device housing defining an inlet communicating with an inlet chamber, an outlet and a waterway communicating between the inlet chamber and the outlet, the device housing further defining a receptacle having a closed end and an open end, the inlet chamber being behind the closed end, the waterway extending along the receptacle from the closed end toward the open end; and a second device supportable in the receptacle. The outlet may define an outlet plane, and the second device may include a speaker with a speaker housing providing a speaker outlet, the speaker outlet being one of aligned with and positioned forwardly of the outlet plane when the speaker is supported in the receptacle. The assembly may further include a magnetic connecting structure operable to releasably connect the speaker and the shower device.
Abstract:
An acoustic assembly includes an upper housing and a lower housing. The lower housing is coupled to the upper housing forming an interior cavity there between. At least one acoustic component is disposed within the cavity. At least one metalized area is formed in the upper housing or the lower housing. The at least one metalized area is in contact with the at least one acoustic component and is configured and arranged to provide an electrical connection between the acoustic component in the cavity and a customer that is exterior to the assembly. The at least one metalized area directly adheres to the upper housing or lower housing.
Abstract:
Examples of speaker assemblies are described. A speaker assembly according to some embodiments may include a speaker enclosure with a first opening (e.g., a speaker opening) and a second opening (e.g. a bass reflex port), a speaker unit mounted to the enclosure at the first opening, and an acoustic damping mechanism mounted to the enclosure at the second opening. The acoustic damping mechanism may be a dual-layer mesh screen including a first mesh with a first acoustic resistance (AR) for providing acoustic damping, and a second mesh with a second AR lower than the first AR. The second mesh may be nearly acoustically transparent and may serve to increase the stiffness of the first mesh. The first mesh may be bonded to the second mesh, and the dual-layer mesh screen may be coupled to the bass reflex port for reducing noise associated with turbulence at the port.
Abstract:
A micro-electro-mechanical system (MEMS) microphone and a forming method therefore. The MEMS microphone comprises: a first substrate, the first substrate is provided with a first bonding face, the first substrate comprises an MEMS microphone component and a first conductive bonding structure arranged on the first bonding face, a second substrate, the second substrate is provided with a second bonding face, the second bonding substrate comprises a circuit and a second conductive bonding structure arranged on the second bonding face; the first substrate and the second substrate are oppositely fitted together via the first conductive bonding structure and the second conductive bonding structure. Embodiments of the present invention have a simple packaging technique and a compact size; the MEMS microphone packaging structure formed has a great performance on signal-to-noise ratio, and a great anti-interference capability
Abstract:
The present disclosure discloses a loudspeaker box, including a foam, a loudspeaker and a box having an opening of the box. The loudspeaker is internally placed inside the box through the opening of the box, an outer surface of the loudspeaker is aligned to an edge of the opening of the box, a gap is set between the loudspeaker and the opening of the box, and a bottom portion of the loudspeaker abuts against the bottom portion of the box; and the foam is annularly covered on the gap between the loudspeaker and the opening of the box, such that the integral thickness of the loudspeaker box is reduced.
Abstract:
A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.
Abstract:
The present invention relates to a loudspeaker assembly and a method of assembling a loudspeaker assembly. In one or more embodiments, the invention comprises forming a front baffle comprising a first driver mounting portion, an intermediate portion, and an edge mounting portion. A first driver is installed in the first driver mounting portion proximate to a first driver aperture. A rear baffle is formed from a second material, which, in one or more embodiments, is less stiff than the first material from which the front baffle is formed. The rear baffle comprises a top portion, sidewalls, a recessed mounting portion, and an edge portion. The edge mounting portion of the front baffle is attached to the recessed mounting portion of the rear baffle such that an entirety of said front baffle is recessed within said rear baffle spaced apart from said open bottom portion.
Abstract:
The present invention relates to a loudspeaker assembly and a method of assembling a loudspeaker assembly, comprising forming a front baffle, a first driver mounting portion, an intermediate portion, and an edge mounting portion. A port aperture formed in the intermediate portion, and a first driver installed in the first driver mounting portion. A rear baffle comprises a top portion, sidewalls, a recessed mounting portion, an edge portion and an electrical assembly. The edge mounting portion of the front baffle is attached to the recessed mounting portion of the rear baffle, and the rear baffle is secured to the back of the first driver. A back box is placed over the rear baffle provides thermal insulation, and a mounting plate securely attaches the first driver to a structural support. A perforated grille is crimped to the edge portion of the rear baffle and an edge portion of the back box.
Abstract:
Speaker assemblies are disclosed that are configured for simple installation and removal. Speaker assemblies include a gear ring, a plurality of screws adapted to rotate when the gear ring is rotated, and a latching mechanism adapted to extend one or more latches outward when the screws are rotated. Methods of installing speaker assemblies include inserting a frame through a mounting hole in a mounting panel. A gear ring coupled to a plurality of screws is rotated, and a plurality of latches extend outward to engage a back-side surface of the mounting panel. Methods of making speaker assemblies include coupling a plurality of screws with a gear ring to enable rotation of the plurality of screws upon rotation of the gear ring. A latching mechanism is coupled to each of the plurality of screws.