公开(公告)号：US5061551A

公开(公告)日：1991-10-29

申请号：US472194

申请日：1990-01-30

Applicant: David Durand

Inventor： David Durand

IPC: C09D11/00 ,  C09D11/10 ,  H01B1/22 ,  H01F41/16 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  H05K3/24

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/10 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104 ,  Y10S428/907 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/2991

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired circuit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.

公开(公告)号：US5059756A

公开(公告)日：1991-10-22

申请号：US277116

申请日：1988-11-29

Applicant: Homer E. Henschenp ,  Michael J. McKee ,  Joseph M. Pawlikowski

Inventor： Homer E. Henschenp ,  Michael J. McKee ,  Joseph M. Pawlikowski

IPC: B23K1/002 ,  B23K3/04 ,  B23K3/047 ,  H01R43/02 ,  H05B3/12 ,  H05B3/40 ,  H05K1/02 ,  H05K1/11 ,  H05K3/24 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/0212 ,  B23K3/0475 ,  H01R43/0242 ,  H05B3/12 ,  H05K1/0242 ,  H05K1/117 ,  H05K2201/083 ,  H05K2201/1028 ,  H05K2201/10924 ,  H05K2203/1115 ,  H05K3/244 ,  H05K3/3494 ,  H05K3/363 ,  H05K3/4015

Abstract: Spaced contact pads (23,43,83,84) on a printed circuit board (19,45,85) are soldered to respective spaced contacts (21,41,51,81,82) in a cable (230,50) or connector assembly (40,80) by means of respective spaced connecting members (15,48,57,70,92,94,96,98,100,102,104,106) interposed between contacts to be soldered. The connecting members are typically electrically and thermally conductive finger-like projections formed as part of a heater body (10,60,55,47,91) and are readily severably from the heater body after soldering to thereby remain part of the final solder connection. A presecribed amount of fusible material (e.g., solder) is pre-deposited on the connecting members and/or contacts and is melted when the heater is actuated. The heater body may be a self-regulating heater in the form of a copper substrate (11,61,65) having a thin surface layer (13, 63,67) of magnetically permeable, high resistance alloy. An alternating current of constant amplitude and high frequency is passed through the heater body and is concentrated in the surface layer at temperatures below the surface layer Curie temperature. At higher temperatures the current is distributed through the lower resistance substrate to limit further heating. During the time interval required for the surface layer to reach its Curie temperature, the resistive power dissipation creates sufficient thermal energy to melt the pre-deposited solder. The connecting members are positioned and configured as necessary to reach their respective connection sites.

公开(公告)号：US5006397A

公开(公告)日：1991-04-09

申请号：US472310

申请日：1990-01-30

Applicant: David Durand

Inventor： David Durand

IPC: C09D11/00 ,  C09D11/10 ,  H01B1/22 ,  H01F41/16 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  H05K3/24

CPC classification number: H05K3/1283 ,  C09D11/101 ,  C09D11/52 ,  H01B1/22 ,  H01F41/16 ,  H05K1/095 ,  H05K3/10 ,  H05K3/245 ,  H05K2201/083 ,  H05K2203/104 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/29 ,  Y10T428/2973 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: A method for producing a circuit board involves printing a U.V. curable ink onto a substrate in a desired cirucit pattern and curing the ink by exposing it to a pulsed U.V. source or subjecting the circuit pattern prepared from a U.V. curable ink containing magnetite particles to a magnetic field to move the magnetite particles to the upper surface of the U.V. curable ink. Other embodiments include circuit boards made in accordance with these methods and the use of the U.V. curable ink as a shielding composition for enclosures housing electronic equipment.

Abstract translation: 制造电路板的方法包括： 可固化油墨以所需的凝胶图案在基材上固化，并通过将其暴露于脉冲的紫外线 来源或经受由U.V.制备的电路图案。 含有磁铁矿颗粒的可固化油墨到磁场以将磁铁矿颗粒移动到紫外线的上表面。 可固化油墨。 其他实施例包括根据这些方法制造的电路板和使用U.V. 作为容纳电子设备的外壳的屏蔽组合物的可固化油墨。

公开(公告)号：US4708545A

公开(公告)日：1987-11-24

申请号：US797983

申请日：1985-11-14

Applicant: Toshinori Fujii ,  Shinji Okamoto

Inventor： Toshinori Fujii ,  Shinji Okamoto

IPC: H05K3/00 ,  B23B49/00 ,  B23Q35/02 ,  G03F9/00 ,  H05K1/02 ,  H05K3/46 ,  B23C3/00

CPC classification number: B23Q35/02 ,  G03F9/00 ,  H05K3/4638 ,  H05K1/0269 ,  H05K2201/083 ,  H05K2201/09781 ,  H05K2203/101 ,  H05K3/0008 ,  H05K3/0047 ,  H05K3/4611 ,  Y10T408/03 ,  Y10T409/303752

Abstract: A method for drilling reference holes in a multi-layer printed wiring board assembly, in which drilling position marks provided on inner-layer circuit board in the assembly are roughly detected through each of two outer-layer boards of the assembly, a spot-facing is made with respect to the outer-layer boards at roughly detected points of the marks, and thereafter the marks are precisely detected at the faced spots. Positions for drilling the reference holes can be thereby determined at the spots precisely in close proximity to the internally provided drilling position marks, to allow the drilling performed very accurately in simpler and economical manner.

Abstract translation: 一种用于在多层印刷线路板组件中钻取参考孔的方法，其中通过组件的两个外层板中的每一个大致检测在组件中的内层电路板上提供的钻孔位置标记， 在标记的大致检测点处相对于外层板制成，然后在面部处精确地检测出标记。 因此，可以在精确地靠近内部提供的钻孔位置标记的位置处确定钻孔参考孔的位置，以便以更简单和经济的方式非常精确地执行钻孔。

公开(公告)号：US12101873B2

公开(公告)日：2024-09-24

申请号：US17660618

申请日：2022-04-25

Applicant: Microsoft Technology Licensing, LLC

Inventor： Jaejin Lee ,  Edward Charles Leacock ,  Charbel Khawand

IPC: G06F1/16 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0218 ,  G06F1/1681 ,  H05K1/0216 ,  H05K1/0393 ,  H05K1/18 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/08 ,  H05K2201/083

Abstract: An FPC cable assembly is provided that includes a first ground layer, a second ground layer, and at least one signal line sandwiched by the first and second ground layers. The FPC cable assembly further includes an electromagnetic shielding structure including a first magnetic layer at least partially covering and electrically grounded to the first ground layer, a second magnetic layer at least partially covering and electrically grounded to the second ground layer, and a plurality of magnetic rings magnetically engaged with and electrically contacting the first magnetic layer and the second magnetic layer so as to surround the first and second ground layers, the at least one signal line, and the first and second magnetic layers, thereby providing electromagnetic shielding of the at least one signal line.

公开(公告)号：US20230412095A1

公开(公告)日：2023-12-21

申请号：US17882913

申请日：2022-08-08

Applicant: CenturyLink Intellectual Property LLC

Inventor： Patrick Giagnocavo

IPC: H02N2/04 ,  H05K1/18 ,  H01L41/12

CPC classification number: H02N2/04 ,  H05K1/189 ,  H01L41/12 ,  H05K2201/10151 ,  H05K2201/083 ,  H05K2201/10121 ,  H05K2201/10106 ,  H05K2201/10037

Abstract: Novel tools and techniques are provided for implementing flexible printed circuit board (“PCB”)-based mobile sensor platform. In various embodiments, a flexible PCB-based mobile sensor platform includes a body portion(s) and at least one of a microcontroller, a locomotion system, sensors, a transceiver(s), and/or the like, each disposed on the body portion(s). The locomotion system includes one or more flexible PCB portions and corresponding actuators. Based on instructions from the microcontroller, at least one actuator may cause bending and unbending of a corresponding flexible PCB portion(s) that causes the flexible PCB-based mobile sensor platform to move toward a target location within a first environment. Upon arrival, the sensors may collect sensor data regarding at least one of the target location, an object located at the target location, or a portion of the object, and the microcontroller may send the collected sensor data to an external device via the transceiver.

公开(公告)号：US20190037709A1

公开(公告)日：2019-01-31

申请号：US15662959

申请日：2017-07-28

Applicant: International Business Machines Corporation

Inventor： Gerald K. Bartley ,  Darryl J. Becker ,  Matthew S. Doyle ,  Mark J. Jeanson

IPC: H05K3/40 ,  H05K1/11 ,  H05K3/42 ,  H05K3/12 ,  H05K3/32

CPC classification number: H05K3/4046 ,  H05K1/113 ,  H05K3/1266 ,  H05K3/323 ,  H05K3/425 ,  H05K3/429 ,  H05K2201/083 ,  H05K2203/0713 ,  H05K2203/104

Abstract: A method and apparatus are provided for implementing customized printed circuit board (PCB) via creation through use of magnetic capture pads. At least one magnetic capture pad is rendered before aqueous seed and plate processing in the PCB manufacture. The magnetic capture pad selectively provides seed material rendering copper in at least one selected region of the via.

公开(公告)号：US20170350751A1

公开(公告)日：2017-12-07

申请号：US15240277

申请日：2016-08-18

Applicant: NANNING FUGUI PRECISION INDUSTRIAL CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： XIAO-HU TANG ,  PEI LIU

IPC: G01J1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02

CPC classification number: G01J1/18 ,  G01V8/20 ,  H05K1/0274 ,  H05K1/0275 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/08 ,  H05K2201/083 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10234

Abstract: A security device in an electronic device which protects against unauthorized disassembly includes light sources, a plurality of photosensitive elements, a detection unit, a storage unit, a processor, and light guiding devices. Light conducting channels are provided between the light sources and the induction elements. Barrier objects that block light are installed at certain first light guiding channels of the light guiding channels, and are removed from the first light conducting channels when the electronic device is disassembled, so that induction signals output by the photosensitive elements are changed from the model or original digitally-recorded signals.

公开(公告)号：US09777197B2

公开(公告)日：2017-10-03

申请号：US14512535

申请日：2014-10-13

Applicant: SunRay Scientific LLC

Inventor： S. Kumar Khanna

IPC: C09J9/02 ,  C09J9/00 ,  H05K13/04 ,  H05K3/30 ,  H05K3/32 ,  H01L23/00 ,  C08K9/02

CPC classification number: C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

公开(公告)号：US09622344B2

公开(公告)日：2017-04-11

申请号：US14391748

申请日：2013-02-28

Applicant: KABUSHIKI KAISHA NIHON MICRONICS

Inventor： Tatsuo Inoue ,  Takayasu Sugai ,  Toshiyuki Kudo ,  Toshinori Omori

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/09

CPC classification number: H05K1/0298 ,  H05K1/0233 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/09 ,  H05K3/46 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/0776 ,  H05K2201/0792 ,  H05K2201/083 ,  Y10T29/49155

Abstract: A multi-layer wiring board includes wiring layers stacked on a substrate with an insulating layer between each layer. A wire formed in the wiring layer consists of a first layer and a second layer to form a double layered structure. The first layer is made of a first conductive material and the second layer is made of a second conductive material having relative magnetic permeability of 10 or more and larger than that of the first conductive material. The characteristic impedance of the wire is adjusted to a value closer to 50 ohms than that of a wire which has the same thickness as of the wire with the double layered structure, and is made only of the first conductive material.