公开(公告)号：US4692843A

公开(公告)日：1987-09-08

申请号：US929819

申请日：1986-11-13

Applicant: Masaru Matsumoto ,  Mikio Nishihara ,  Kiyoshi Kuwabara

Inventor： Masaru Matsumoto ,  Mikio Nishihara ,  Kiyoshi Kuwabara

IPC: H05K3/46 ,  H05K1/14

CPC classification number: H05K3/462 ,  H05K1/0272 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/1025 ,  H05K2201/2036 ,  H05K3/4623 ,  H05K3/4647

Abstract: A multilayer printed wiring board having an air gap between neighboring printed wiring boards of the multilayer printed wiring board by inserting plated spacers to both end faces of through-hole pads which are provided to each printed wiring board so that each through-hole pad opposes to another through-hole pad on the neighboring printed wiring board. The spacers opposed to each other are joined together by solder, and each spacer has an end surface having a size being smaller than a size of the end surface of each through-hole pad to provide a drop part at the joint part of the spacers, so that melted solder stays at the drop part not flowing toward the board through the side surface of the through-hole pad when the printed wiring boards are integrated to the multilayer printed wiring board under pressure and high temperature.

Abstract translation: 一种多层印刷线路板，其通过将设置在每个印刷线路板上的通孔焊盘的两个端面插入电镀间隔件，使得每个通孔焊盘与所述多层印刷线路板的相邻的印刷线路板之间具有气隙， 相邻印刷电路板上的另一个通孔焊盘。 彼此相对的间隔件通过焊料接合在一起，并且每个间隔件具有尺寸小于每个通孔焊盘的端面的尺寸的端面，以在间隔件的接合部分处提供液滴部分， 使得当印刷线路板在压力和高温下与多层印刷线路板集成在一起时，熔融的焊料停留在通过通孔焊盘的侧表面而不流向板的液滴部分。

公开(公告)号：US4610908A

公开(公告)日：1986-09-09

申请号：US730256

申请日：1985-05-06

Applicant: Robert S. Reylek ,  James G. Berg

Inventor： Robert S. Reylek ,  James G. Berg

IPC: H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  B32B3/10

CPC classification number: H05K3/323 ,  H01R4/04 ,  H05K2201/09945 ,  H05K2201/1025 ,  H05K2203/1189 ,  H05K3/361 ,  Y10T428/24355 ,  Y10T428/24372 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24579 ,  Y10T428/24612 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24959 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2887 ,  Y10T428/2891

Abstract: Insulated sheet material useful for making bonded electrical connections, especially to sets of small side-by-side terminal pads. In one typical form, the sheet material is an elongated tape comprising an elongated insulating web; a plurality of narrow spaced parallel elongated electrically conductive stripes on the web; electrically conductive adhesive disposed over the stripes comprising a layer of adhesive material in which are dispersed a monolayer of rather thick electrically conductive particles; and a thin electrically insulating layer disposed over the conductive adhesive and which is nontacky or poorly tacky at room temperature, provides high electrical resistance throughout the layer to the conductive particles, softens to an adhesive and flowable condition upon heating to an elevated temperature, and upon cooling to room temperature assumes a firm and substantially nonflowable condition. Such a connector tape is readily handleable and free from conductive bonding at room temperature but when laid over a set of adjacent spaced terminal pads with the electrically conductive stripes in registry with the pads, and pressed and heated, the conductive particles penetrate through the insulating layer to make electrical connection to the pads.

Abstract translation: 用于制造粘结电连接的绝缘片材料，特别是小型并排端子焊盘的组合。 在一种典型形式中，片材是包括细长绝缘网的细长带; 在幅材上的多个窄间隔的平行细长的导电条纹; 布置在条纹之上的导电粘合剂包括一层粘合剂材料，其中分散有相当厚的导电颗粒的单层; 以及设置在导电粘合剂上并且在室温下不粘或不良粘性的薄的电绝缘层，在整个层向导电颗粒提供高电阻，在加热到高温时软化到粘合剂和可流动状态，并且在 冷却至室温呈现稳固且基本上不可流动的状态。 这种连接器带易于处理并且在室温下没有导电接合，但是当放置在一组相邻间隔的端子焊盘上，导电条与焊盘对准并被加压和加热时，导电颗粒穿过绝缘层 以使电连接到焊盘。