公开(公告)号：US20210157058A1

公开(公告)日：2021-05-27

申请号：US16693364

申请日：2019-11-24

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Hao-Chiang CHENG ,  Ziliang CAI

IPC: G02B6/35 ,  G02B6/125 ,  G02B6/12

Abstract: The present disclosure is generally directed to an optical demultiplexer for use in an optical transceiver module having a truncated profile/shape to increase tolerance and accommodate adjacent optical components. In more detail, the optical demultiplexer comprises a body with at least one truncated corner at the input end. The at least one truncated corner allows the optical demultiplexer to be disposed/mounted, e.g., directly, on a densely populated transceiver substrate, e.g., a printed circuit board (PBC), and provide additional tolerance/space for mounting of circuitry and/or components within the region that would normally be occupied by corner(s) of the optical demultiplexer body. The at least one truncated corner may be introduced in a post-production step, e.g., via cut & polishing, or introduced during formation of the optical demultiplexer using, for instance, photolithography techniques.

公开(公告)号：US10983291B2

公开(公告)日：2021-04-20

申请号：US16561531

申请日：2019-09-05

Applicant: Applied Optoelectronics, Inc.

Inventor： Kevin Liu ,  Kai-Sheng Lin ,  Hsiu-Che Wang

IPC: G02B6/42

Abstract: The present disclosure is generally directed to a holder element, also generally referred to herein as a welding element, configured to couple an optical coupling receptacle to a substrate and provide an integrated optical arrangement to redirect light received from the optical coupling receptacle along a receive light path to an output light path that is offset from the receive light path.

公开(公告)号：US10951005B2

公开(公告)日：2021-03-16

申请号：US16506587

申请日：2019-07-09

Applicant: Applied Optoelectronics, Inc.

Inventor： Chong Wang ,  Kai-Sheng Lin ,  YongXuan Liang

IPC: H01S5/024 ,  H04B10/50 ,  H01S5/022

Abstract: In general the present disclosure is directed to a temperature control device, e.g., a TEC, that includes a top plate with at least first and second contact pads to allow for a soldering process to attach optical components to the first contact pad without causing one or more layers of the second contact pad to reflow and solidify with an uneven mounting surface. Thus, optical components such as a focus lens can be mounted to the second contact pad via, for instance, thermal epoxy. This avoids the necessity of a submount to protect the focus lens from the relatively high heat introduced during a soldering process as well as maintain the flatness of the second contact pad within tolerance so that the mounted focus lens optically aligns by virtue of its physical location/orientation with other associated optical components coupled to the first contact pad, e.g., a laser diode.

公开(公告)号：US10859775B1

公开(公告)日：2020-12-08

申请号：US16561555

申请日：2019-09-05

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng Lin ,  Ziliang Cai ,  Hao-Chiang Cheng

IPC: G02B6/42

Abstract: In general, the present disclosure is directed to an optical turning mirror for receiving channel wavelengths along a first optical path and reflecting the same towards a fiber or photodetector (PD) without the necessity of disposing a highly reflective layer to increase reflectivity. In more detail, the optical turning mirror includes a substantially transparent body, e.g., capable of passing at least 80% of incident wavelengths, that defines an input region with integrated focus lens(es) for receiving channel wavelengths along a first optical path and a reflective surface disposed opposite the input region to direct/launch received channel wavelengths along a second optical path towards an output interface having an angled light-transmissive surface, with the second optical path extending substantially transverse relative to the first optical path.

公开(公告)号：US20200335934A1

公开(公告)日：2020-10-22

申请号：US16387805

申请日：2019-04-18

Applicant: Applied Optoelectronics, Inc.

Inventor： I-Lung HO ,  Chong WANG ,  Shih-Chia LIU

IPC: H01S5/022 ,  H04B10/40 ,  H04B10/50 ,  H01S5/026

Abstract: The present disclosure is generally directed to a TO can laser package that includes an off-center focus lens integrated into a lens cap to compensate displacement of an associated laser diode. The TO can laser package includes a TO header with a mounting structure for directly electrically coupling an associated laser diode to electrical leads/pins without the use of an intermediate interconnect. The mounting structure displaces the laser diode such that an emission surface, and more particularly, an origin thereof, is displaced/offset relative to a center of the TO header. The integrated lens cap includes a focus lens with an optical center that is offset from a center of the TO header at a distance that is substantially equal to the displacement of the laser diode. Thus, the displacement of the laser diode is compensated for by the off-center focus lens to minimize or otherwise reduce optical misalignment.

公开(公告)号：US20200225427A1

公开(公告)日：2020-07-16

申请号：US16246853

申请日：2019-01-14

Applicant: Applied Optoelectronics, Inc.

Inventor： Chong WANG ,  Qin LI ,  Hsiu-Che WANG

IPC: G02B6/42

Abstract: The present disclosure is generally directed to a lens clip that includes an optical lens slot to securely hold an optical lens at a predetermined position to mitigate effects of post-annealing shift. The lens clip includes a base that provides at least one substrate mating surface for mounting to a substrate, and at least first and second arms extending from the base. The first and second arms extend substantially parallel relative to each other and define at least a portion of an optical lens slot. The optical lens slot is configured to receive at least a portion of an optical lens and securely hold the optical lens at a predetermined position to ensure optical alignment of the optical lens, e.g., relative to an associated laser diode or other optical component, during fixation of the optical lens to the substrate using, for instance, UV-curing optical adhesives.

公开(公告)号：US20200073052A1

公开(公告)日：2020-03-05

申请号：US16116087

申请日：2018-08-29

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Kevin LIU ,  I-Lung HO

IPC: G02B6/12 ,  G02B6/42 ,  H04J14/02 ,  H04B10/40 ,  H04B10/50

Abstract: In general, a TOSA consistent with the present disclosure includes a light driving circuit coupled to a hermetically-sealed light engine. The hermetically-sealed light engine includes a housing defined by a plurality of sidewalls. The housing defines a cavity that is hermetically-sealed to prevent introduction of contaminants that would otherwise reduce optical power. The hermetically-sealed light engine optically couples to an external arrayed waveguide grating (AWG), or other multiplexing device, by way of an optical receptacle. The optical receptacle can include a waveguide implemented external to the hermetically-sealed cavity and can include, for instance, an optical isolator, fiber stub, and fiber ferrule section. Thus, the external AWG and associated external optical coupling components advantageously allow for the hermetically-sealed light engine to have a cavity with dimensions relatively smaller than other approaches that dispose an AWG and associated components within a hermetically-sealed cavity.

公开(公告)号：US10418782B2

公开(公告)日：2019-09-17

申请号：US15640978

申请日：2017-07-03

Applicant: Applied Optoelectronics, Inc.

Inventor： Jun Zheng ,  Stefan J. Murry ,  Bujin Guo

IPC: H04J14/02 ,  H01S5/14 ,  H04B10/50 ,  H01S3/08 ,  H01S3/105 ,  H01S3/106 ,  H01S5/022

Abstract: A wavelength-selectable laser device providing spatially-selectable wavelength(s) may be used to select one or more wavelengths for lasing in a tunable transmitter or transceiver, for example, in a wavelength division multiplexed (WDM) optical system such as a WDM passive optical network (PON). The wavelength-selectable laser device uses a dispersive optical element, such as a diffraction grating, to disperse light emitted from a laser emitter and to direct different wavelengths of the light toward a reflector at different spatial positions such that the wavelengths may be selected by allowing light to be reflected from selected spatial position(s) back into the laser emitter. Thus, the reflected light with a wavelength at the selected spatial position(s) is allowed to complete the laser cavity.

公开(公告)号：US10313024B1

公开(公告)日：2019-06-04

申请号：US15963246

申请日：2018-04-26

Applicant: Applied Optoelectronics, Inc.

Inventor： I-Lung Ho ,  Kevin Liu ,  YongXuan Liang

IPC: H04J14/02 ,  H04B10/00 ,  H04B10/80 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40 ,  H04B10/50 ,  H01S5/042

Abstract: The present disclosure is generally directed to a transmitter optical subassembly (TOSA) having a hermetically-sealed housing with a feedthrough device that electrically isolates RF and power traces. In more detail, a TOSA consistent with the present disclosure includes a substrate with driving circuitry disposed thereon. A first end of the substrate may electrically couple to transmit connecting circuitry and a second end may couple to a hermetically-sealed housing. The hermetically-sealed housing can include one or more laser packages for emitting associated channel wavelengths in addition to monitor photodiodes (PDs), and temperature control devices such as TECs. The hermetic-sealed housing includes a first end with a feedthrough device that provides traces to electrically couple to the circuitry of the substrate. The hermetic-sealed housing further includes an optical coupling port, e.g., a LC connector, for coupling to an external fiber, for example.

公开(公告)号：US10295765B2

公开(公告)日：2019-05-21

申请号：US15413514

申请日：2017-01-24

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng Lin ,  YongXuan Liang ,  Justin Lii

IPC: G02B6/42 ,  H04B10/40 ,  H04B10/60 ,  H04B10/66 ,  H04B10/69

Abstract: A photodiode package is disclosed that includes a TO-Can style body with an exposed sensor cavity that eliminates the necessity of an encapsulant dispensing process. The TO-Can body of the photodiode package includes an integrated coupling member to allow for coupling to a ROSA housing without an intermediate member. The photodiode package includes a base portion with a cylindrical wall portion that extends therefrom to form an optical coupling cavity. A surface of the base portion provides at least one mounting surface within the optical coupling cavity for coupling to a photodiode chip. The cylindrical wall may function as an integrated coupling member and may be used to directly couple the photodiode package, e.g., without an intermediate cap/ring, into a socket of a ROSA housing. The base portion and cylindrical wall may be formed from a single piece of material, or from multiple pieces depending on a desired configuration.