公开(公告)号：US06438098B1

公开(公告)日：2002-08-20

申请号：US09706825

申请日：2000-11-07

Applicant: Junsaku Nakajima ,  Masaru Nomura ,  Hitoshi Takeuchi

Inventor： Junsaku Nakajima ,  Masaru Nomura ,  Hitoshi Takeuchi

IPC: G11B700

CPC classification number: G11B7/24085 ,  G11B7/00718 ,  G11B7/00745 ,  G11B7/0901 ,  G11B7/0906 ,  G11B7/0938

Abstract: An optical recording medium capable of obtaining a large reproduced signal from the recoded mark, a large reproduced signal of a pre-pit and a large tracking signal both in an area of the grooves and an area of the pre-pits, which provides a sufficient time allowance for switching tracking to that suitable for the area of the grooves or to that suitable for the area of the pre-pits. An optical recording medium comprising a substrate whereon tracks each comprising at least of writable grooves and pre-pits deeper than or equal to the grooves are formed and areas of a relatively shallow pits are each provided between an area of the deep pits and an area of the grooves. The depth Dg of the grooves, the depth Dsp of the shallow pits and the depth Ddp of the deep pits satisfy the following conditions: Dg

Abstract translation: 一种能够从重新编码的标记获得大的再现信号的光学记录介质，在凹槽的区域和预制凹坑的区域中的预制凹坑的大的再现信号和大的跟踪信号，其提供足够的 切换跟踪的时间容限适合于槽的区域或适合于预制坑的区域。 一种光记录介质，其特征在于，包括基板，其中，所述基板的轨道各自包括至少可写入的凹槽，并且凹槽深度大于或等于所述凹槽，并且所述凹坑的深度大于或等于所述凹槽的预凹坑，并且相对较浅的凹坑的区域各自设置在所述深凹坑的区域和 凹槽。 凹槽的深度Dg，浅凹坑的深度Dsp和深坑的深度Ddp满足以下条件：Dg

公开(公告)号：US5977575A

公开(公告)日：1999-11-02

申请号：US54074

申请日：1993-04-27

Applicant: Masaaki Mandai ,  Hitoshi Takeuchi ,  Yutaka Saito ,  Tomoyuki Yoshino

Inventor： Masaaki Mandai ,  Hitoshi Takeuchi ,  Yutaka Saito ,  Tomoyuki Yoshino

IPC: H01L21/98 ,  H01L23/538 ,  H01L25/18 ,  H01L27/148

CPC classification number: H01L25/50 ,  H01L23/5381 ,  H01L23/5385 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/01322 ,  H01L2924/10253

Abstract: The semiconductor image sensor device of the multiple chip mount type is constructed such that electrical and mechanical connections are carried out concurrently among chips. Coupling chips 4 are utilized to couple a plurality of semiconductor image sensor chips 1 with each other, and the couple one semiconductor image sensor chip 1 to a driver substrate 3 which mounts thereon a semiconductor driving chip 2 for driving the semiconductor image sensor chips 1.

Abstract translation: 多芯片安装型的半导体图像传感器装置被构造成使得在芯片之间同时进行电气和机械连接。 耦合芯片4用于将多个半导体图像传感器芯片1彼此耦合，并且将一个半导体图像传感器芯片1耦合到驱动器基板3，驱动器基板3上安装用于驱动半导体图像传感器芯片1的半导体驱动芯片2。

公开(公告)号：US5869893A

公开(公告)日：1999-02-09

申请号：US816195

申请日：1997-03-12

Applicant: Osamu Koseki ,  Takichi Ishii ,  Masaaki Mandai ,  Tomoyuki Yoshino ,  Hitoshi Takeuchi

Inventor： Osamu Koseki ,  Takichi Ishii ,  Masaaki Mandai ,  Tomoyuki Yoshino ,  Hitoshi Takeuchi

IPC: H01L21/98 ,  H01L23/538 ,  H01L23/34

CPC classification number: H01L25/50 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73267 ,  H01L2224/92 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  Y10S438/94

Abstract: A semiconductor device comprises at least two semiconductor elements connected together at a connecting region of the semiconductor elements. At least one joint chip is adhered to the connection region of the semiconductor elements for connecting the semiconductor elements together. The joint chip has a trapezoidal cross-section defining a first surface and a second surface wider than the first surface. The second surface of the joint chip is adhered to the connection region of the semiconductor elements.

Abstract translation: 半导体器件包括在半导体元件的连接区域处连接在一起的至少两个半导体元件。 至少一个接合芯片粘附到用于将半导体元件连接在一起的半导体元件的连接区域。 接头芯片具有限定第一表面和比第一表面更宽的第二表面的梯形横截面。 接头芯片的第二表面粘附到半导体元件的连接区域。

公开(公告)号：US5517369A

公开(公告)日：1996-05-14

申请号：US348161

申请日：1994-11-28

Applicant: Hitoshi Takeuchi ,  Eiji Yamada ,  Chiaki Yamawaki ,  Tetsuo Iwaki

Inventor： Hitoshi Takeuchi ,  Eiji Yamada ,  Chiaki Yamawaki ,  Tetsuo Iwaki

IPC: G11B5/00 ,  G11B5/008 ,  G11B5/02 ,  G11B5/035 ,  G11B5/09 ,  G11B5/39 ,  G11B5/49 ,  G11B15/02 ,  G11B15/12

CPC classification number: G11B5/3961 ,  G11B15/02 ,  G11B15/12 ,  G11B5/02 ,  G11B5/035 ,  G11B5/09 ,  G11B5/4992 ,  G11B2005/0016 ,  G11B5/00813

Abstract: In a multi-track magnetic signal reproducing apparatus, a plurality of MR heads including MR (Magneto Resistance Effect) elements are provided correspondingly to tracks on a magnetic tape. At the time of reproduction, constant current from a constant current power supply is sequentially supplied as pulse-shaped current for detecting a signal to each MR element by a switching operation by switch in response to a prescribed clock signal, and output voltage from each MR element related to reproduction of a magnetic signal on a corresponding track is sequentially provided to one input side of a differential amplifier. In differential amplifier, the offset voltage of each MR element provided to the other input side and the above-described output voltage are differentially amplified and only voltage due to the reproducing magnetic signal of each track is accurately extracted. Accordingly, the supply of pulse-shaped current effectively suppresses increase in the amount of consumption current regardless of the number of tracks on the tape (or the number of heads), and since amplifier is shared between the tracks, the number of necessary terminals for such a multi-track MR head is reduced.

Abstract translation: 在多磁道磁信号重放装置中，相应于磁带上的轨道提供包括MR（磁阻效应）元件的多个MR磁头。 在再现时，来自恒流电源的恒定电流作为脉冲形电流被顺序提供，用于通过响应于规定的时钟信号的开关的切换操作检测每个MR元件的信号，并且从每个MR输出电压 将与相应轨道上的磁信号的再现相关的元件依次提供给差分放大器的一个输入侧。 在差分放大器中，提供给另一输入侧的每个MR元件的偏移电压和上述输出电压被差分放大，并且仅准确地提取由于每个磁道的再现磁信号引起的电压。 因此，脉冲电流的供给有效地抑制消耗电流量的增加，而与带上的磁道数（或磁头数）无关，并且由于放大器在磁道之间共享，所以需要的端子的数量 这样的多轨MR磁头减少了。

公开(公告)号：US5349320A

公开(公告)日：1994-09-20

申请号：US108058

申请日：1993-08-17

Applicant: Nobuo Suzuki ,  Koji Yoshikawa ,  Hitoshi Takeuchi

Inventor： Nobuo Suzuki ,  Koji Yoshikawa ,  Hitoshi Takeuchi

IPC: H01F27/02 ,  H01F38/12 ,  H01F27/30

CPC classification number: H01F38/12 ,  H01F27/02

Abstract: An ignition coil for internal combustion engines including a primary core formed in a shape of rectangular ring and fixed on the inner peripheral edge of the bottom wall of a casing, a secondary core having a main portion of which is formed in a shape of straight beam, a primary winding assembly having a primary bobbin formed on the main portion of the secondary core, and a secondary winding assembly. Both winding assemblies are housed in an internal space of the casing, and a synthetic resin is filled in the internal space of the casing and cured. In the side wall of the casing is formed a rectangular opening portion which opens at the top end; and on the primary bobbin a rectangular closing member is formed integrally therewith. When the opening portion of the casing is closed with the closing member, both end faces in the longitudinal direction of the secondary core formed in the primary bobbin face to the inside peripheral surfaces of the primary core. A permanent magnet with its one face in contact with one end face of the secondary core is supported on the primary bobbin, while the other face of the permanent magnet is in contact with the primary core.

Abstract translation: 一种用于内燃机的点火线圈，其包括形成为矩形环形状的主芯并固定在壳体的底壁的内周边缘上，次级铁心的主要部分形成为直梁形状 ，具有形成在次级芯的主要部分上的初级线轴的初级绕组组件和次级绕组组件。 两个卷绕组件被容纳在壳体的内部空间中，并且合成树脂填充在壳体的内部空间中并固化。 在壳体的侧壁形成有在顶端开口的矩形开口部分; 并且在主线轴上形成与其一体形成的矩形闭合部件。 当壳体的开口部分用封闭构件封闭时，形成在初级线轴面中的副芯的纵向方向上的两个端面到主芯的内周面。 永磁体的一个面与次级芯的一个端面相接触，而主永久磁铁的另一个面与主芯接触。

公开(公告)号：US5148678A

公开(公告)日：1992-09-22

申请号：US631304

申请日：1990-12-20

Applicant: Hironori Ueda ,  Kazumichi Hanai ,  Hitoshi Takeuchi ,  Kazutaka Nakamichi ,  Takashi Kubota

Inventor： Hironori Ueda ,  Kazumichi Hanai ,  Hitoshi Takeuchi ,  Kazutaka Nakamichi ,  Takashi Kubota

IPC: F02B37/22 ,  F02D9/04 ,  F02M25/07

CPC classification number: F02B37/22 ,  F02D9/04 ,  F02M26/58 ,  F02M26/70 ,  F02M26/74 ,  Y02T10/144 ,  Y10T137/6525 ,  Y10T137/6579 ,  Y10T137/7036

Abstract: An exhaust gas flow control valve for an internal combustion engine comprises a body, a diaphragm actuator and a bracket. The body is equipped with an exhaust passage and a valve member arranged in the exhaust passage. The bracket is equipped with an actuator mounting seat for mounting the diaphragm actuator and a body mounting seat connected to the body. The diaphragm actuator is equipped with a casing connected to the actuator mounting seat of the bracket, a diaphragm cased in the casing and a rod protruding from the diaphragm and out of the casing for actuating the valve member in accordance with the action of the diaphragm. Between the actuator mounting seat of the bracket and the diaphragm of the diaphragm actuator, moreover, there is formed an insulating layer for insulating the heat to be transferred to the diaphragm.

Abstract translation: 用于内燃机的废气流量控制阀包括主体，隔膜致动器和支架。 主体装有排气通道和布置在排气通道中的阀构件。 支架配备有用于安装隔膜致动器的致动器安装座和连接到车身的车身安装座。 隔膜致动器配备有连接到支架的致动器安装座的壳体，套在壳体中的隔膜和从隔膜突出并且从外壳中突出的杆，用于根据隔膜的作用致动阀构件。 此外，在支架的致动器安装座和隔膜致动器的隔膜之间形成有绝缘层，用于将传递到隔膜的热量绝缘。

公开(公告)号：US4676189A

公开(公告)日：1987-06-30

申请号：US801856

申请日：1985-11-26

Applicant: Hitoshi Takeuchi ,  Naoki Yamada ,  Hisao Ikemura ,  Noriyasu Suzuki

Inventor： Hitoshi Takeuchi ,  Naoki Yamada ,  Hisao Ikemura ,  Noriyasu Suzuki

IPC: B05B5/04 ,  B05B12/14 ,  B05B15/00 ,  B05D1/04

CPC classification number: B05B5/04 ,  B05B12/14 ,  B05B15/00 ,  Y10S118/07

Abstract: An electrostatic spray coating apparatus. Piping for supplying paint, operating air, etc. is divided in the middle of its course between a pressurized air source and downstream portions such as an air motor and a color-change valve, and is connected by a joint at these divided points. The apparatus can thereby be put to functional testing before it is installed on its work spot.

Abstract translation: 静电喷涂装置。 用于供给油漆，工作空气等的管道在加压空气源和气动马达，变色阀等下游部分之间的中间被分割，并通过这些分割点处的接头进行连接。 因此，该装置可以在其工作点安装之前进行功能测试。

公开(公告)号：US4490362A

公开(公告)日：1984-12-25

申请号：US382364

申请日：1982-05-26

Applicant: Hiroshi Shionoya ,  Hitoshi Takeuchi ,  Gunki Funatsu

Inventor： Hiroshi Shionoya ,  Hitoshi Takeuchi ,  Gunki Funatsu

IPC: A61K36/47 ,  A61K38/00 ,  A61K38/16 ,  A61K39/39 ,  A61K45/00 ,  A61P37/00 ,  A61K37/02 ,  A61K39/00

CPC classification number: A61K45/05 ,  A61K38/168 ,  A61K39/39 ,  A61K2039/55516

Abstract: An immunopotentiator comprising the B chain of ricin as an active ingredient. The immunopotentiator serves to increase immune response to fungi, viruses and other microorganisms and is therefore effective for prevention or treatment of infectious diseases by such microorganisms.

Abstract translation: 一种包含蓖麻毒素B链作为活性成分的免疫增强剂。 免疫增强剂用于增加对真菌，病毒和其它微生物的免疫应答，因此可有效预防或治疗这些微生物的感染性疾病。

公开(公告)号：US4299889A

公开(公告)日：1981-11-10

申请号：US41196

申请日：1979-05-21

Applicant: Masaru Kato ,  Hitoshi Takeuchi ,  Toshiaki Horiuchi

Inventor： Masaru Kato ,  Hitoshi Takeuchi ,  Toshiaki Horiuchi

IPC: H01H33/66 ,  H01H1/02 ,  B22F7/00

CPC classification number: H01H1/0203 ,  Y10T428/1216 ,  Y10T428/12167 ,  Y10T428/12174

Abstract: A contact for a vacuum interrupter has excellent characteristics of high withstand voltage, large current durability and low chopping current and is prepared by infiltrating copper into a skeleton obtained by sintering a specific tungsten powder having an average diameter of less than 1 .mu.m.The skeleton is preferably prepared by a vacuum sintering process and the copper is infiltrating into the skeleton in hydrogen atmosphere or in vacuum.

Abstract translation: 用于真空断路器的触点具有高耐受电压，大电流耐久性和低切断电流的优异特性，并且通过将铜浸入通过烧结平均直径小于1μm的特定钨粉而获得的骨架中来制备。 骨架优选通过真空烧结工艺制备，并且铜在氢气氛或真空中渗透到骨架中。

公开(公告)号：US08441799B2

公开(公告)日：2013-05-14

申请号：US12759417

申请日：2010-04-13

Applicant: Hitoshi Takeuchi ,  Keiji Sato ,  Kiyoshi Aratake ,  Masashi Numata ,  Takahiko Nakamura ,  Daisuke Terada ,  Takeshi Sugiyama

Inventor： Hitoshi Takeuchi ,  Keiji Sato ,  Kiyoshi Aratake ,  Masashi Numata ,  Takahiko Nakamura ,  Daisuke Terada ,  Takeshi Sugiyama

IPC: H05K1/00 ,  H05K1/18 ,  H05K7/00

CPC classification number: H01L23/055 ,  H01L2924/0002 ,  H01L2924/19041 ,  Y10T29/49002 ,  Y10T29/49124 ,  H01L2924/00

Abstract: To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component (1) is formed by bonding together a base (3) made of glass and a lid (2). Outer electrodes (8) and (18) are formed on a bottom surface of the base (3), and the outer electrodes (8) and (18) are respectively connected to through electrodes (7) and (17). The outer electrodes (8) and (18) each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes (8) and (18) are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

Abstract translation: 为了提供用于将电子部件安装到电路板上的改进的可焊性，通过将由玻璃制成的基部（3）和盖（2）接合在一起而形成电子部件（1）的封装。 外电极（8）和（18）形成在基座（3）的底表面上，外电极（8）和（18）分别连接到电极（7）和（17）。 外部电极（8）和（18）各自具有三个CrAu层的层压结构，即从Cr层（第一层）到Au层（第六层）。 当将外电极（8）和（18）焊接到电路板上时，作为第二层，第四层和第六层的Au层溶解在焊料中，而作为第三层和第五层的Cr层几乎不形成 金属间化合物与焊料分离，保留在焊料中。