Tunable Multiband Antenna With Passive and Active Circuitry
    62.
    发明申请
    Tunable Multiband Antenna With Passive and Active Circuitry 有权
    可调谐多频天线与被动和主动电路

    公开(公告)号:US20140313087A1

    公开(公告)日:2014-10-23

    申请号:US13864968

    申请日:2013-04-17

    Applicant: Apple Inc.

    CPC classification number: H01Q1/243 H01Q1/245 H01Q1/44 H01Q1/48 H01Q3/22 H01Q5/392

    Abstract: An electronic device may have an antenna for providing coverage in wireless communications bands of interest such as a low frequency communications band and a high frequency communications band. The antenna may have an antenna ground and an antenna resonating element. The antenna resonating element may have a high band arm that contributes to a first high band resonance in the high band and may have a low band arm that exhibits a low band resonance in the low band. A passive filter that is coupled between first and second portions of the antenna resonating element may be configured to exhibit a short circuit impedance associated with a bypass path that allows the antenna resonating element to contribute to a second high band resonance in the high band. A tunable inductor coupled to the antenna resonating element may be used to tune the low band resonance.

    Abstract translation: 电子设备可以具有用于在诸如低频通信频带和高频通信频带之类的感兴趣的无线通信频带中提供覆盖的天线。 天线可以具有天线接地和天线谐振元件。 天线谐振元件可以具有有助于高频带中的第一高频带谐振的高频带臂,并且可以具有在低频带中表现出低频带谐振的低频带臂。 耦合在天线谐振元件的第一和第二部分之间的无源滤波器可以被配置为呈现与允许天线谐振元件对高频段中的第二高频带谐振有贡献的旁路路径相关联的短路阻抗。 耦合到天线谐振元件的可调谐电感器可用于调谐低频带谐振。

    ANTENNA GROUNDING
    63.
    发明申请

    公开(公告)号:US20250079687A1

    公开(公告)日:2025-03-06

    申请号:US18293027

    申请日:2023-06-03

    Applicant: Apple Inc.

    Abstract: An electronic device may have first and second rear-facing displays, a front-facing display, a cover at a front side overlapping the front-facing display, and an antenna that radiates through the cover. The cover may have a three-dimensional curvature. The device may have an inner chassis and an outer chassis. The antenna may include a radiating element and a ground trace on a flexible printed circuit. To maximize wireless performance of the antenna, the ground trace may be electrically coupled to as much conductive material in the vicinity of the antenna as possible. For example, the ground trace may be grounded to conductive structures in the front-facing display via a conductive cavity for the antenna, may be grounded directly to the outer chassis using conductive screws, and/or may be grounded directly to the inner chassis using conductive screws.

    Electronic devices having antennas with loaded dielectric apertures

    公开(公告)号:US12218424B2

    公开(公告)日:2025-02-04

    申请号:US17832421

    申请日:2022-06-03

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a conductive sidewall. An aperture may be formed in the sidewall. The sidewall may have a cavity that extends from the aperture towards the interior of the device. The cavity may be filled with an injection-molded plastic substrate. A dielectric block having a dielectric constant greater than that of the injection-molded plastic substrate and the antenna layers may be embedded in the injection-molded plastic substrate. The dielectric block may at least partially overlap an antenna. The antenna may convey radio-frequency signals at a frequency greater than 10 GHz through the cavity, the dielectric block, the injection-molded plastic substrate, and the aperture. The dielectric block may increase the effective dielectric constant of the cavity, allowing the antenna to cover relatively low frequencies without increasing the size of the aperture.

    Electronic Device with Lightweight Antenna Shielding

    公开(公告)号:US20240405451A1

    公开(公告)日:2024-12-05

    申请号:US18424602

    申请日:2024-01-26

    Applicant: Apple Inc.

    Abstract: An electronic device may have first and second rear-facing displays, a front-facing display, a cover at a front side overlapping the front-facing display, and an antenna that radiates through the cover. The antenna may be formed from traces on a flexible printed circuit. The antenna may be provided with a conductive shield on a dielectric carrier. The flexible printed circuit may be mounted to the carrier opposite the shield. A biasing member may be mounted to the carrier and may press the flexible printed circuit against the cover. To minimize weight of the device, the shield may be formed from conductive traces patterned onto the carrier. The carrier may include first and second substrates formed from respective shots of co-molded plastic. The second substrate may include plateable grade plastic and the conductive traces may be patterned onto plateable outer surfaces of the second substrate opposite the first substrate.

    Multi-Layer Matching Structures for High Frequency Signal Transmission

    公开(公告)号:US20220109464A1

    公开(公告)日:2022-04-07

    申请号:US17223888

    申请日:2021-04-06

    Applicant: Apple Inc.

    Abstract: An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.

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