公开(公告)号：US12147072B2

公开(公告)日：2024-11-19

申请号：US17834124

申请日：2022-06-07

Applicant: CORNING INCORPORATED

Inventor： Nicholas Francis Borrelli ,  Ming-Jun Li ,  Xiao Li ,  David John McEnroe ,  Robert Adam Modavis ,  Daniel Aloysius Nolan ,  Alranzo Boh Ruffin ,  Vitor Marino Schneider ,  Thomas Philip Seward, III ,  Alexander Mikhailovich Streltsov

IPC: G02B6/04 ,  C03B23/023 ,  C03B33/04 ,  C03C19/00 ,  C03C23/00

Abstract: An article includes an optical transforming layer and a guide region positioned inside and adjacent to at least a portion of a perimeter of the optical transforming layer. The guide region comprises an inlet end positioned adjacent to a first surface of the optical transforming layer and an outlet end positioned adjacent a second surface of the optical transforming layer. The guide region propagates light from the inlet end to the outlet end such that the light is directed from the first surface to the second surface. The guide region includes a phase-separated glass comprising a continuous network phase and a discontinuous phase. A relative difference in index of refraction between the continuous network phase and the discontinuous phase is greater than or equal to 0.3%. The discontinuous phase comprises elongated shaped regions aligned along a common axis and having an aspect ratio greater than or equal to 10:1.

公开(公告)号：US12053839B2

公开(公告)日：2024-08-06

申请号：US17056963

申请日：2019-05-21

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: B23K26/211 ,  B23K26/0622 ,  B23K26/12 ,  B23K26/18 ,  B23K26/57 ,  B23K101/34 ,  B23K103/16

CPC classification number: B23K26/211 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/57 ,  B23K26/1224 ,  B23K2101/34 ,  B23K2103/166

Abstract: Disclosed herein are methods of bonding a multi-layer film to a substrate and resulting structures thereof. A method of laser bonding a multi-layer film to a substrate can include forming a film over a first surface of a first substrate that is transmissive to light at a first wavelength. The film may include a reflective layer that is reflective to light at the first wavelength and a refractive layer that is refractive to light at the first wavelength. The method may include irradiating a region of the film using laser radiation passing through the first substrate. A wavelength profile of the laser radiation can have a peak at about the first wavelength. The first wavelength can be between about 300 nm and about 5000 nm.

公开(公告)号：US20210284572A1

公开(公告)日：2021-09-16

申请号：US17183539

申请日：2021-02-24

Applicant: Corning Incorporated

Inventor： Matthew John Dejneka ,  Jesse Kohl ,  Alexander Mikhailovich Streltsov

IPC: C03C23/00 ,  C03C4/00 ,  C03C10/00

Abstract: A method of marking a glass-ceramic article includes the steps of: illuminating a glass-ceramic article with a beam from a laser, the glass-ceramic article having a thickness, T; and forming a mark in the glass-ceramic article while translating at least one of the glass-ceramic article or laser. The mark has a Contrast Ratio greater than 10. The step of forming a mark includes focusing the beam from the laser within the thickness, T, of the glass-ceramic article. The focusing of the beam results in alteration of a chemical property or a physical property of the glass-ceramic article. The mark produced by the beam from the laser extends through at least 50% of the thickness, T, of the glass-ceramic article. The glass-ceramic article may have a global temperature less than 100° C. during the marking process and does not fracture as the mark is formed.

公开(公告)号：US20210197316A1

公开(公告)日：2021-07-01

申请号：US17056963

申请日：2019-05-21

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: B23K26/211 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/57

Abstract: Disclosed herein are methods of bonding a multi-layer film to a substrate and resulting structures thereof. A method of laser bonding a multi-layer film to a substrate can include forming a film over a first surface of a first substrate that is transmissive to light at a first wavelength. The film may include a reflective layer that is reflective to light at the first wavelength and a refractive layer that is refractive to light at the first wavelength. The method may include irradiating a region of the film using laser radiation passing through the first substrate. A wavelength profile of the laser radiation can have a peak at about the first wavelength. The first wavelength can be between about 300 nm and about 5000 nm.

公开(公告)号：US10746937B2

公开(公告)日：2020-08-18

申请号：US16663917

申请日：2019-10-25

Applicant: CORNING INCORPORATED

Inventor： Douglas Llewellyn Butler ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov ,  James Scott Sutherland

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/30 ,  G02B6/38 ,  G02B6/02

Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

公开(公告)号：US20200057202A1

公开(公告)日：2020-02-20

申请号：US16663917

申请日：2019-10-25

Applicant: CORNING INCORPORATED

Inventor： Douglas Llewellyn Butler ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov ,  James Scott Sutherland

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/30 ,  G02B6/38 ,  G02B6/02

Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.

公开(公告)号：US20190232435A1

公开(公告)日：2019-08-01

申请号：US16257853

申请日：2019-01-25

Applicant: CORNING INCORPORATED

Inventor： Jeffery Alan DeMeritt ,  Davide Domenico Fortusini ,  Andrey Kobyakov ,  David Mark Lance ,  Leonard Thomas Masters ,  Ulrich Wilhelm Heinz Neukirch ,  Alexander Mikhailovich Streltsov ,  James Scott Sutherland

IPC: B23K26/384 ,  B23K26/40 ,  B23K26/00 ,  B23K26/06 ,  G02B6/36

CPC classification number: C03B33/082 ,  B23K26/009 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/384 ,  B23K26/40 ,  G02B6/3644

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

公开(公告)号：US10283731B2

公开(公告)日：2019-05-07

申请号：US15699337

申请日：2017-09-08

Applicant: CORNING INCORPORATED

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: H01L51/52 ,  C03C3/12 ,  C03C23/00 ,  C03C27/06 ,  C03C27/08 ,  C03B23/203 ,  B23K26/20 ,  B32B37/06 ,  H01L51/00 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/00 ,  C03C8/24

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

公开(公告)号：US10069104B2

公开(公告)日：2018-09-04

申请号：US15655194

申请日：2017-07-20

Applicant: CORNING INCORPORATED

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: H01L51/00 ,  H01L51/52 ,  C03C3/12 ,  C03C23/00 ,  C03C27/06 ,  C03C27/08 ,  C03B23/203 ,  B23K26/20 ,  B32B37/06 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/00 ,  C03C8/24

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

公开(公告)号：US09802855B2

公开(公告)日：2017-10-31

申请号：US14972352

申请日：2015-12-17

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Robert Carl Burket ,  Daniel Ralph Harvey ,  Alexander Mikhailovich Streltsov

IPC: C03B33/08 ,  B23K26/386 ,  C03C15/02 ,  C03C15/00 ,  C03C23/00 ,  B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K26/402 ,  G02B6/122 ,  G02B6/136 ,  B23K103/00

CPC classification number: C03B33/082 ,  B23K26/382 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/50 ,  C03C15/00 ,  C03C15/02 ,  C03C23/0025 ,  G02B6/1225 ,  G02B6/136

Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.