公开(公告)号：US6154365A

公开(公告)日：2000-11-28

申请号：US258614

申请日：1999-02-26

Applicant: Lloyd Pollard, II ,  Chia-Pin Chiu

Inventor： Lloyd Pollard, II ,  Chia-Pin Chiu

IPC: H01L23/40 ,  H05K7/20

CPC classification number: H01L23/4006 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/3011

Abstract: An electrical assembly which includes a heat sink that is pressed into an integrated circuit package by a spring fixture. The integrated circuit package is mounted to a substrate. Inserted through the spring fixture is a screw. The screw is also inserted through a clearance hole of the substrate and into an attachment hole of the heat sink to attach the heat sink to the substrate. Other features are disclosed.

Abstract translation: 一种电气组件，其包括通过弹簧夹具压入集成电路封装的散热器。 集成电路封装安装在基板上。 通过弹簧夹具插入螺丝。 螺钉也通过衬底的间隙插入散热器的安装孔中，以将散热器附接到衬底上。 公开了其他特征。

公开(公告)号：US20140307388A1

公开(公告)日：2014-10-16

申请号：US13860937

申请日：2013-04-11

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  F04B17/00 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20 ,  H05K7/20236 ,  H01L2924/00

Abstract: A heat dissipation device that includes a base plate having a plurality of substantially circular channels which are substantially concentrically arranged; and a fluid distribution structure adjacent the base plate, wherein the fluid distribution structure has a plurality of inlet conduits extending substantially radially from a central area with each of the plurality of inlet conduits having at least one fluid delivery port extending through the fluid distribution structure to at least one base plate circular channel, and wherein the fluid distribution structure has a plurality of outlet zones defined between adjacent inlet conduits with each of the plurality of outlet zones having at least one fluid removal port extending through the fluid distribution structure to at least one base plate circular channel.

Abstract translation: 一种散热装置，包括：基板，具有基本同心配置的多个基本圆形的通道; 以及邻近所述基板的流体分配结构，其中所述流体分配结构具有多个从中心区域大致径向延伸的入口导管，所述多个入口管道中的每一个具有延伸穿过所述流体分配结构的至少一个流体输送端口， 至少一个基板圆形通道，并且其中所述流体分配结构具有限定在相邻入口管道之间的多个出口区域，所述多个出口区域中的每一个具有延伸穿过所述流体分配结构的至少一个流体移除端口至少一个 基板圆形通道。

公开(公告)号：US20140159228A1

公开(公告)日：2014-06-12

申请号：US13707159

申请日：2012-12-06

Applicant: Weng Hong Teh ,  Chia-Pin Chiu

Inventor： Weng Hong Teh ,  Chia-Pin Chiu

IPC: H01L21/56 ,  H01L23/522

CPC classification number: H01L24/25 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/2501 ,  H01L2224/2505 ,  H01L2224/2512 ,  H01L2224/255 ,  H01L2224/73209 ,  H01L2224/81005 ,  H01L2224/92133 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/1431 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15747 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/00

Abstract: Discussed generally herein are devices that include high density interconnects between dice and techniques for making and using those devices. In one or more embodiments a device can include a bumpless buildup layer (BBUL) substrate including a first die at least partially embedded in the BBUL substrate, the first die including a first plurality of high density interconnect pads. A second die can be at least partially embedded in the BBUL substrate, the second die including a second plurality of high density interconnect pads. A high density interconnect element can be embedded in the BBUL substrate, the high density interconnect element including a third plurality of high density interconnect pads electrically coupled to the first and second plurality of high density interconnect pads.

Abstract translation: 这里通常讨论的是包括骰子之间的高密度互连和用于制造和使用这些设备的技术的设备。 在一个或多个实施例中，器件可以包括无冲突构建层（BBUL）衬底，其包括至少部分地嵌入在BBUL衬底中的第一管芯，第一管芯包括第一多个高密度互连焊盘。 第二管芯可以至少部分地嵌入在BBUL衬底中，第二管芯包括第二多个高密度互连焊盘。 高密度互连元件可以嵌入在BBUL基板中，高密度互连元件包括电耦合到第一和第二多个高密度互连焊盘的第三多个高密度互连焊盘。

公开(公告)号：US20140087590A1

公开(公告)日：2014-03-27

申请号：US13627128

申请日：2012-09-26

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01R24/28 ,  H01R13/02

CPC classification number: H01R12/714 ,  H01R13/24

Abstract: A conductive contact includes a hollow cylinder, a spring strip and a contact head.

Abstract translation: 导电触头包括中空圆筒，弹簧条和接触头。

公开(公告)号：US20140084441A1

公开(公告)日：2014-03-27

申请号：US13629368

申请日：2012-09-27

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L23/48 ,  H01L21/50

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/29109 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2924/1515 ,  H01L2924/15321 ,  H01L2924/171 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include a substrate, a first die, and a second die coupled to the first die and the substrate. The substrate may include an opening. At least a portion of the die may occupy at least a portion of the opening in the substrate. Other embodiments including additional apparatuses and methods are described.

Abstract translation: 本文描述的一些实施例包括形成这种装置的装置和方法。 在一个这样的实施例中，装置可以包括衬底，第一管芯和耦合到第一管芯和衬底的第二管芯。 衬底可以包括开口。 模具的至少一部分可以占据基板中的开口的至少一部分。 描述包括附加装置和方法的其他实施例。

公开(公告)号：US07875973B2

公开(公告)日：2011-01-25

申请号：US11851547

申请日：2007-09-07

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L23/48

CPC classification number: H01L23/49805 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/16251 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/184 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10719 ,  Y02P70/611

Abstract: A microelectronic combination and a method of making the combination. The combination includes a package substrate including a substrate body having a peripheral surface and contacts disposed at the peripheral surface; and a surface mount component electrically and mechanically bonded to the contacts.

Abstract translation: 微电子组合和组合方法。 该组合包括：封装基板，包括具有外围表面的基板主体和设置在周边表面的触点; 以及表面安装部件电接触和机械地接合到触头。

公开(公告)号：US20100327424A1

公开(公告)日：2010-12-30

申请号：US12459007

申请日：2009-06-24

Applicant: Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

Inventor： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC: H01L23/538 ,  H01L21/60

CPC classification number: H01L23/5385 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

Abstract translation: 多芯片封装包括具有第一侧面（111），相对的第二侧面（112）和从第一侧向第二侧延伸的第三侧面（213）的基板（110），第一模具（120） ）和附接到所述基板的第一侧的第二模具（130），以及邻近所述基板的第三侧并连接到所述第一模具和所述第二模具的桥接件（140） 。 基板的任何部分都不在桥下。 该桥在第一管芯和第二管芯之间形成连接。 或者，桥可以设置在衬底中的空腔（615,915）中，或者设置在衬底和裸片层（750）之间。 该桥可以构成一个有源管芯，并且可以使用引线键连接到衬底（241,841,1141,1541）。

公开(公告)号：US07511372B2

公开(公告)日：2009-03-31

申请号：US11170289

申请日：2005-06-28

Applicant: Chia-Pin Chiu

Inventor： Chia-Pin Chiu

IPC: H01L23/10

CPC classification number: H01L23/473 ,  H01L2224/73253 ,  H01L2924/15311

Abstract: A microelectronic assembly and a method of forming same. The microelectronic assembly comprises: a microelectronic package including a substrate and a die, the die being electrically conductively bonded to the substrate at a front side thereof and further having a backside; a cover plate defining an inlet opening and an outlet opening therethrough; bonding posts mechanically bonding the cover plate to the backside of the die; a sealant body sealingly bonding an inner periphery of a die side of the cover plate to an inner periphery of a backside of the die to form, along with the backside of the die and the cover plate, a cooling fluid chamber. The backside of the die, the cover plate, the bonding posts and the sealant body together define a microelectronic cooling device including the cooling fluid chamber and configured to receive cooling fluid through the inlet opening, to flow the cooling fluid in the chamber between the bonding posts, and to allow the cooling fluid to exit from the outlet opening to cool the die.

Abstract translation: 微电子组件及其形成方法。 该微电子组件包括：包括基板和模具的微电子封装，该裸片在其前侧与该基板导电结合并且还具有背面; 限定入口开口和穿过其的出口开口的盖板; 将盖板机械地结合到模具的背面; 将盖板的模具侧的内周密封地连接到模具的背面的内周的密封体与模具和盖板的背面一起形成冷却流体室。 模具的背面，盖板，接合柱和密封剂主体一起限定了包括冷却流体室的微电子冷却装置，并且构造成通过入口开口接收冷却流体，以使得腔室中的冷却流体在粘合 柱，并且允许冷却流体从出口开口排出以冷却模具。

公开(公告)号：US20070296071A1

公开(公告)日：2007-12-27

申请号：US11474182

申请日：2006-06-23

Applicant: Chia-Pin Chiu ,  John P. Dirner

Inventor： Chia-Pin Chiu ,  John P. Dirner

IPC: H01L23/02

CPC classification number: H01L23/34 ,  H01L23/467 ,  H01L2224/16 ,  H01L2924/15311

Abstract: A microelectronic package, a method of forming the package and a system incorporating the package. The package includes a substrate; a die bonded to the substrate; and a thermal sensor connected to the substrate.

Abstract translation: 微电子封装，形成封装的方法和结合封装的系统。 所述包装包括基材; 与基板结合的管芯; 以及连接到基板的热传感器。

公开(公告)号：US07312527B2

公开(公告)日：2007-12-25

申请号：US11305527

申请日：2005-12-16

Applicant: Sandeep B. Sane ,  Nitin Deshpande ,  Chia-Pin Chiu

Inventor： Sandeep B. Sane ,  Nitin Deshpande ,  Chia-Pin Chiu

IPC: H01L23/34

CPC classification number: H01L23/4275 ,  H01L24/32 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/14 ,  H01L2924/1433

Abstract: A method, apparatus and system with a semiconductor package including a thermal interface material dam enclosing a volume of thermal interface material.

Abstract translation: 一种具有半导体封装的方法，装置和系统，包括封闭一定体积的热界面材料的热界面材料坝。