公开(公告)号：US20200005114A1

公开(公告)日：2020-01-02

申请号：US16260110

申请日：2019-01-29

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q7/00 ,  H01Q21/29 ,  H05K1/16

Abstract: A dual-interface metal hybrid smartcard comprising a plastic card body (CB), a booster antenna (BA) and a metal frame (CMF, DMF) disposed in the card body, in the form of a rectangular metal frame disposed external to the booster antenna (BA). The metal frame may extend continuously around the periphery of the card body as a continuous metal frame (CMF), or may have a slit (S), thereby forming a discontinuous metal frame (DMF). A second metal slug (MS-2) may be disposed at a lower portion of the card body (CB), inside the booster antenna. A smartcard may comprise a plastic card body (CB) and a generally rectangular metal slug (MS) having a main body portion slightly smaller than the card body, and having at least one protrusion extending from corresponding at least one corner of the main body portion of the metal slug to corresponding at least one corner of the card body.

公开(公告)号：US20190197386A1

公开(公告)日：2019-06-27

申请号：US16246495

申请日：2019-01-13

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H05K1/16 ,  H01Q7/00

Abstract: A smartcard (SC) having at least a contactless interface, such as having a dual interface transponder chip module (TCM) with a chip (IC), a module antenna (MA) for the contactless interface, and contact pads (CP) for a contact interface. Metal layers (ML) may have openings (MO) for receiving the module, and slits (S) or nonconductive stripes (NCS) extending to the openings, thereby forming coupling frames (CF). A card body (CB) for the smartcard may comprise two such metal layers (front and rear coupling frames) separated by a layer of non-conductive (dielectric) material. A front face card layer and a rear face card layer may complete a multiple coupling frame stack-up for a smartcard.

公开(公告)号：US20190171923A1

公开(公告)日：2019-06-06

申请号：US16247612

申请日：2019-01-15

Applicant: David Finn

Inventor： David Finn

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H05K1/16 ,  H01Q7/00

Abstract: A dual-interface smartcard (SC) having a booster antenna (BA) with coupler coil (CC) in its card body, and a metallized face plate having a window opening for an antenna module (AM) having contact pads (CP) and a module antenna (MA). A compensation loop (CL) may be disposed directly behind a peripheral portion of the booster antenna. The compensation loop may be formed of a conductive material, such as copper, or of ferrite, and may have two free ends or no free ends. Additionally, the window opening may be substantially larger than the antenna module, the face plate may be perforated, ferrite material may be disposed between the face plate and the booster antenna, the coupler coil may be offset from the antenna, and a ferrite element may be disposed in the antenna module between the module antenna and the contact pads.

公开(公告)号：US20180341847A1

公开(公告)日：2018-11-29

申请号：US15939282

申请日：2018-03-29

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/077 ,  H01Q1/22 ,  H04B5/00 ,  H01Q1/38

CPC classification number: G06K19/07754 ,  G06K19/07769 ,  G06K19/07783 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H04B5/0062

Abstract: Smartcard (SC) having a card body (CB) and a conductive coupling frame antenna (CFA) extending as a closed loop circuit around a periphery of the card body, and also extending inwardly so that two portions of the coupling frame antenna are closely adjacent each other, with a gap therebetween. The gap may extend from a periphery of the card body to a position corresponding with a module antenna (MA) of a transponder chip module (TCM) disposed in the card body, and may function like a slit (S) in a coupling frame (CF). A portion of the coupling frame antenna may be arranged to surround the ISO position of the transponder chip module in the card body. A coupling frame antenna (CFA) may be incorporated onto a module tape (MT) for a transponder chip module (TCM).

公开(公告)号：US09960476B2

公开(公告)日：2018-05-01

申请号：US15358138

申请日：2016-11-22

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/06 ,  H01Q1/22 ,  G06K19/077 ,  H04B5/00

CPC classification number: H01Q1/2225 ,  G06K19/077 ,  H04B5/0056 ,  H04B5/0062

Abstract: A conductive coupling frame (CF) or a discontinuous metal layer disposed surrounding and closely adjacent a transponder chip module (TCM), and substantially coplanar with an antenna structure (AS, CES, LES) in the transponder chip module (TCM). A metal card body (MCB, CB) or a transaction card with a discontinuous metal layer having a slit (S), extending from an inner end to a periphery of the metal layer, and not terminating in a distinct opening sized to accommodate a transponder chip module (TCM).

公开(公告)号：US09812782B2

公开(公告)日：2017-11-07

申请号：US15197795

申请日：2016-06-30

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/07 ,  H01Q7/00 ,  B23K26/40 ,  H01Q1/22 ,  H01Q1/38 ,  B23K26/361 ,  G06K19/077 ,  B23K101/40 ,  B23K103/00

CPC classification number: H01Q7/00 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G06K19/07722 ,  G06K19/07747 ,  G06K19/07794 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01Q1/2225 ,  H01Q1/38 ,  H01L2224/45099

Abstract: A transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF) may be in the form of a conductive layer having an outer edge (OE) and a slit (S) or non-conductive stripe (NCS) extending from the outer edge to an inner position thereof which may be a central opening (OP). The coupling frame (CF) may be arranged so that the slit (S) or non-conductive strips (NCS) overlaps at least a portion of the module antenna (MA). Methods and apparatus are disclosed.

公开(公告)号：US09798968B2

公开(公告)日：2017-10-24

申请号：US14492113

申请日：2014-09-22

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  B23K26/362 ,  B23K26/40 ,  B23K101/40 ,  B23K103/00

CPC classification number: G06K19/07747 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G06K19/07722 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00

Abstract: A conductive coupling frame (CF) having two ends, forming an open loop having two ends or a discontinuous metal layer disposed surrounding and closely adjacent a transponder chip module (TCM, 610), and substantially coplanar with an antenna structure (AS, CES, LES) in the transponder chip module (TCM). A metal card body (MCB, CB) or a transaction card with a discontinuous metal layer having a slit (S) or a non-conductive strip (NCS, 1034) extending from a module opening (MO) to a periphery of the card body to function as a coupling frame (CF). The coupling frame (CF) may be thick enough to be non-transparent to RF at frequencies of interest. A switch (SW) may be provided to connect ends of the coupling frame (CF) across the slit (S, 630). A reinforcing structure (RS) may be provided to stabilize the coupling frame (CF) and card body (CB). The transponder chip module (TCM) may comprise an antenna structure which may be a laser-etched antenna structure (LES) or a chemical-etched antenna structure (CES), and may comprise and a non-perforated contact pad (CP) arrangement. A coupling frame (CF) may be incorporated onto the module tape (MT, CCT) for a transponder chip module (TCM).

公开(公告)号：US09697459B2

公开(公告)日：2017-07-04

申请号：US14862119

申请日：2015-09-22

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/06 ,  G06K19/077 ,  B23K26/362 ,  B23K26/40 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  B23K26/21 ,  G06K7/10 ,  B23K101/40 ,  B23K103/00

CPC classification number: G06K19/07788 ,  B23K26/21 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G06K7/10336 ,  G06K19/07722 ,  G06K19/07747 ,  G06K19/07756 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00

Abstract: RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

公开(公告)号：US09489613B2

公开(公告)日：2016-11-08

申请号：US14619164

申请日：2015-02-11

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  B23K26/36 ,  B23K26/40

CPC classification number: G06K19/07783 ,  B23K26/361 ,  B23K26/362 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  G06K19/07722 ,  G06K19/07747 ,  G06K19/07769 ,  G06K19/07794 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  Y10T29/49018 ,  H01L2924/00

Abstract: The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).

Abstract translation: 应答器芯片模块（TCM）的平面天线（PA）可以具有U形部分，使得天线的外端（OE）可以靠近设置在中心区域的RFID芯片（IC） 用于应答器芯片模块的模块磁带（MT）。 模块带（MT2）可以在其一侧具有接触垫（CP）和在其另一侧上具有连接桥（CBR），并且可以与具有平面天线（PA）的模块带（MT1）连接。 诸如耦合框架（CF）或平面天线（PA）之类的导电元件内的导电层（CL）的金属可以被刻划为具有许多小的段。 金属片可以被冲压以具有接触侧金属化，并且与具有平面天线（PA）的模块带（MT）连接。

公开(公告)号：US09195932B2

公开(公告)日：2015-11-24

申请号：US14173815

申请日：2014-02-06

Applicant: David Finn ,  Mustafa Lotya ,  Klaus Ummenhofer

Inventor： David Finn ,  Mustafa Lotya ,  Klaus Ummenhofer

IPC: G06K19/07 ,  G06K19/077 ,  H01Q7/00 ,  H01Q1/22 ,  H01Q21/29 ,  H05K3/10 ,  H01F38/14

CPC classification number: G06K19/07794 ,  G06K19/07769 ,  H01F38/14 ,  H01Q1/2216 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H01Q21/29 ,  H05K1/0239 ,  H05K1/165 ,  H05K3/103 ,  H05K2201/09036 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2203/0285 ,  Y10T29/49162

Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).

Abstract translation: 用于智能卡的增强天线（BA）包括围绕卡体（CB）的周边延伸的卡片天线（CA）部件，在天线模块（AM）的位置处的耦合线圈（CC）部件，以及 扩展天线（EA）有助于增强天线（BA）的电感。 还公开了一种通过控制由嵌入工具在卡体（CB）上的不同位置施加的力和超声功率的电线嵌入方法。