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公开(公告)号:US20250142784A1
公开(公告)日:2025-05-01
申请号:US18939317
申请日:2024-11-06
Applicant: Frore Systems Inc.
Inventor: Prabhu Sathyamurthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Vikram Mukundan , Narayana Prasad Rayapati , Brian James Gally , William Finn Ninian Paisley
IPC: H05K7/20
Abstract: A thermal management system is described. The thermal management system includes a heat sink structure and an array of microelectromechanical system (MEMS) jets. The heat sink structure is in thermal communication with a plurality of heat sources. The heat sink structure includes fins and a collection channel. The array of MEMS jets is arranged to cause a fluid to impinge on a surface of each of the fins and to be directed through the collection channel.
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公开(公告)号:US12240750B2
公开(公告)日:2025-03-04
申请号:US17474815
申请日:2021-09-14
Applicant: Frore Systems Inc.
Inventor: Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Vikram Mukundan , Ananth Saran Yalamarthy , Prabhu Sathyamurthy , Brian James Gally
Abstract: A system including a plurality of cooling cells is described. Each of the cooling cells includes a support structure and a cooling element. The cooling element has a central region having an axis and a perimeter. The cooling element IS supported by the support structure at the central region and along the axis. At least a portion of the perimeter being unpinned. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. A portion of the cooling cells aligned along the axis are physically connected such that the cooling cells form an integrated cooling cell tile.
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公开(公告)号:US20250031350A1
公开(公告)日:2025-01-23
申请号:US18907306
申请日:2024-10-04
Applicant: Frore Systems Inc.
Inventor: Ananth Saran Yalamarthy , Suryaprakash Ganti , Vikram Mukundan , Seshagiri Rao Madhavapeddy , Prabhu Sathyamurthy , Narayana Prasad Rayapati
Abstract: A cooling system is described. The cooling system includes a cooling element having a central region and a perimeter. The cooling element is anchored at the central region. At least a portion of the perimeter is unpinned. The cooling element is in communication with a fluid. The cooling element is actuated to induce vibrational motion to drive the fluid toward a heat-generating structure.
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公开(公告)号:US20240373593A1
公开(公告)日:2024-11-07
申请号:US18774103
申请日:2024-07-16
Applicant: Frore Systems Inc.
Inventor: Prabhu Sathyamurthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Lumaya Ahmed , Shekhar Halakatti
IPC: H05K7/20 , B06B1/06 , H01L23/427 , H01L23/433 , H10N30/20
Abstract: A cooling system including a heat spreader and a cooling element is described. The heat spreader is thermally coupled with a heat-generating structure. The cooling element is in fluid communication heat spreader. The heat-generating structure is offset from the cooling element. The cooling element undergoes vibrational motion when actuated to drive a fluid toward the heat spreader while not directing the fluid directly at the heat-generating structure.
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公开(公告)号:US12133362B2
公开(公告)日:2024-10-29
申请号:US17862171
申请日:2022-07-11
Applicant: Frore Systems Inc.
Inventor: Vikram Mukundan , Ananth Saran Yalamarthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Prabhu Sathyamurthy
CPC classification number: H05K7/20272 , G06F1/20
Abstract: A cooling system including a support structure and a cooling element is described. The cooling element has a thickness and includes an anchored region and a cantilevered arm. The anchored region is coupled to and supported by the support structure. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes at least one cavity therein. The at least one cavity has a depth of at least one-third and not more than three-fourths of the thickness of the cooling element. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid for cooling a heat-generating structure.
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公开(公告)号:US12127369B2
公开(公告)日:2024-10-22
申请号:US17475252
申请日:2021-09-14
Applicant: Frore Systems Inc.
Inventor: Prabhu Sathyamurthy , Suryaprakash Ganti , Prathima Kapa , Seshagiri Rao Madhavapeddy , Shekhar Halakatti , Brian James Gally
IPC: H05K7/20 , F04B45/047 , H01L23/467 , H01L23/473
CPC classification number: H05K7/20172 , H01L23/467 , H01L23/4735 , F04B45/047
Abstract: A system including a tile and a hood is described. The tile includes a plurality of cooling cells. Each of the cooling cells includes a support structure and a cooling element. The cooling element is supported by the support structure and is configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure. The hood is coupled to the tile and directs the fluid around the plurality of cooling cells.
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公开(公告)号:US12029005B2
公开(公告)日:2024-07-02
申请号:US17121620
申请日:2020-12-14
Applicant: Frore Systems Inc.
Inventor: Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Prabhu Sathyamurthy , Vikram Mukundan , Lumaya Ahmed
CPC classification number: H05K7/20145 , H05K5/0213 , H05K5/03 , H05K7/14
Abstract: A system including an active cooling system is described. The active cooling system includes a cooling element in communication with a fluid and configured to use vibrational motion to direct a fluid toward a surface of heat-generating structure(s). Heat is transferred from the heat-generating structure to the fluid. The system is configured such that the fluid follows a path from the surface of the heat-generating structure(s) past a structure having a lower temperature than the surface of the heat-generating structure. The structure absorbs heat from the fluid. The structure is within the system and distal from the active cooling system.
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公开(公告)号:US20240060733A1
公开(公告)日:2024-02-22
申请号:US18370732
申请日:2023-09-20
Applicant: Frore Systems Inc.
Inventor: Vikram Mukundan , Suryaprakash Ganti , Ananth Saran Yalamarthy , Seshagiri Rao Madhavapeddy , Prabhu Sathyamurthy , Narayana Prasad Rayapati
IPC: F28F13/10
CPC classification number: F28F13/10
Abstract: A flow chamber, a cooling system and a method are described. The flow chamber includes an upper chamber including a top wall, an actuator, and a lower chamber. The actuator is located distally from the top wall. The lower chamber receives fluid from the upper chamber when the actuator is actuated. The top wall includes at least one cavity therein. The cooling system utilizes cooling cells including the flow chamber. The method includes driving the actuator at a frequency that directs fluid through the flow chamber.
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公开(公告)号:US20230422433A1
公开(公告)日:2023-12-28
申请号:US18213222
申请日:2023-06-22
Applicant: Frore Systems Inc.
Inventor: Prabhu Sathyamurthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Nilesh Sudhir Hasabnis , Shekhar Halakatti
CPC classification number: H05K7/20218 , H04M1/026 , G06F1/203 , H05K5/0215
Abstract: A computing device includes a housing having a plurality of apertures therein, an active cooling system, and at least one of a plurality of membranes or a plurality of valves. The membranes and/or valves are coupled with the apertures. Each of the membranes is watertight and gas breathable. The valves are configured to prevent entry of water through the apertures. The active cooling system is in the housing. When activated, the active cooling system drives a gas through a membrane but does not drive water through the membrane.
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公开(公告)号:US20230413471A1
公开(公告)日:2023-12-21
申请号:US18211045
申请日:2023-06-16
Applicant: Frore Systems Inc.
Inventor: Suryaprakash Ganti , Prabhu Sathyamurthy , Vikram Mukundan , Sangkyu Kim , Prathima Kapa , Lizbeth Gomez , Brian James Gally
CPC classification number: H05K7/20145 , H05K7/20154 , G06F1/20
Abstract: A heat transfer system including an active component and a dissipation region is described. The active component is configured to undergo vibrational motion. The active component transfers fluid from a high pressure region to an ambient pressure region via an egress. The active component also induces a pulsating pressure in the fluid. The pulsating pressure is dissipated in the dissipation region such that turbulence is reduced where the fluid is introduced to the ambient pressure region.
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