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公开(公告)号：US12245396B2
公开(公告)日：2025-03-04
申请号：US18523790
申请日：2023-11-29
Applicant: Frore Systems Inc.
Inventor： Prabhu Sathyamurthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Nilesh Sudhir Hasabnis , Vikram Mukundan , William Finn Ninian Paisley
Abstract: A cooling system for a computing device is described. The cooling system includes a heat transfer structure. The heat transfer structure includes a heat spreader, a fin structure, and a differential pressure device. The fin structure transfers heat from the heat spreader to a fluid. The differential pressure device generates a low pressure region that draws the fluid from an ingress in the computing device through the fin structure. The heat transfer structure is enclosed in a chamber of the computing device. The chamber includes the ingress and an egress.
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公开(公告)号：US20230422433A1
公开(公告)日：2023-12-28
申请号：US18213222
申请日：2023-06-22
Applicant: Frore Systems Inc.
Inventor： Prabhu Sathyamurthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Nilesh Sudhir Hasabnis , Shekhar Halakatti
CPC classification number: H05K7/20218 , H04M1/026 , G06F1/203 , H05K5/0215
Abstract: A computing device includes a housing having a plurality of apertures therein, an active cooling system, and at least one of a plurality of membranes or a plurality of valves. The membranes and/or valves are coupled with the apertures. Each of the membranes is watertight and gas breathable. The valves are configured to prevent entry of water through the apertures. The active cooling system is in the housing. When activated, the active cooling system drives a gas through a membrane but does not drive water through the membrane.
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公开(公告)号：US12167564B2
公开(公告)日：2024-12-10
申请号：US17983289
申请日：2022-11-08
Applicant: Frore Systems Inc.
Inventor： Prabhu Sathyamurthy , Seshagiri Rao Madhavapeddy , Nilesh Sudhir Hasabnis , Shekhar Halakatti , Varun Prasanna Rajamuthu , Woo Sung Chung , Suryaprakash Ganti
Abstract: A system including a module and an egress passageway is described. The module includes a cooling cells, a heat spreader, and a cover including vents therein. The cooling cells are between the heat spreader and the cover. Each of the cooling cells includes a cooling element configured to draw air in through the plurality of vents and drive air out of an aperture between the heat spreader and the cover at a first flow rate. A stream of hot air having been heated by a heat from a heat-generating structure thermally coupled to the heat spreader is thus provided. The hot air passes through the egress passageway toward an egress. The egress passageway includes at least one inlet through which cool air is drawn at a second flow rate to be mixed with the hot air. The second flow rate is greater than the first flow rate.
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Patent Agency Ranking
公开(公告)号：US20240256013A1
公开(公告)日：2024-08-01
申请号：US18424356
申请日：2024-01-26
Applicant: Frore Systems Inc.
Inventor： Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Prabhu Sathyamurthy , Nilesh Sudhir Hasabnis , Shekhar Halakatti
CPC classification number: G06F1/203 , G06F1/1658 , G06F1/206 , H05K7/20154 , H05K7/20272 , G06F2200/201
Abstract: A mobile phone is described. The mobile phone includes a cover, a circuit board to which a heat-generating structure is coupled, and a cooling system including active cooling cell(s) and contained by the cover. The cover defines an interior of the mobile phone. The circuit board is within the interior. The heat-generating structure is thermally coupled with the cooling system. The active cooling cell(s) utilize vibrational motion to drive a fluid for transferring heat from the heat-generating structure. At least one of the mobile phone includes an interposer, the cover includes a raised portion, or the mobile phone includes a cavity therein. The interposer is coupled to the circuit board and includes a gap such that a first portion of the cooling system thermally coupled with the heat-generating structure resides within the gap. The raised portion of the cover is such that a second portion of the cooling system resides in the raised portion. The cavity includes the cooling system, separates the cooling system from the interior, and is such that the interior is water resistant.
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公开(公告)号：US20240344690A1
公开(公告)日：2024-10-17
申请号：US18633273
申请日：2024-04-11
Applicant: Frore Systems Inc.
Inventor： Nilesh Sudhir Hasabnis , Shekhar Halakatti , Prabhu Sathyamurthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy
IPC: F21V29/58 , F21V15/01 , F21Y115/10
CPC classification number: F21V29/59 , F21V15/01 , F21Y2115/10
Abstract: A lighting system is described. The lighting system includes a housing, a lighting module, and a cooling system. The lighting module includes a light source and is coupled with the housing. The cooling system includes active cooling cell(s). The lighting module is thermally coupled with the cooling system. The active cooling cell(s) are configured to utilize vibrational motion to drive a fluid for transferring heat from the lighting module. The cooling system is coupled with and contained by the housing.
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公开(公告)号：US20240336475A1
公开(公告)日：2024-10-10
申请号：US18630881
申请日：2024-04-09
Applicant: Frore Systems Inc.
Inventor： Prabhu Sathyamurthy , Nilesh Sudhir Hasabnis , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy
CPC classification number: B81B3/0081 , G08B3/1008 , H04N7/186 , B81B2201/036 , B81B2203/0118 , B81B2207/11 , H05K7/20154 , H05K7/20272
Abstract: A doorbell system is disclosed. The doorbell system includes a housing, a heat-generating structure, and a cooling system. The housing is configured to be coupled to a structure. The heat-generating structure and cooling system are coupled with the housing. The cooling system includes at least one active cooling cell. The heat-generating structure may be thermally coupled with the cooling system. The active cooling cell(s) are configured to utilize vibrational motion to drive a fluid for transferring heat from the heat-generating structure. The cooling system is coupled with and contained by the housing.
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公开(公告)号：US20240179868A1
公开(公告)日：2024-05-30
申请号：US18523790
申请日：2023-11-29
Applicant: Frore Systems Inc.
Inventor： Prabhu Sathyamurthy , Suryaprakash Ganti , Seshagiri Rao Madhavapeddy , Nilesh Sudhir Hasabnis , Vikram Mukundan , William Finn Ninian Paisley
CPC classification number: H05K7/20172 , G06F1/20 , H05K7/20145 , H05K7/20154 , H05K7/20436
Abstract: A cooling system for a computing device is described. The cooling system includes a heat transfer structure. The heat transfer structure includes a heat spreader, a fin structure, and a differential pressure device. The fin structure transfers heat from the heat spreader to a fluid. The differential pressure device generates a low pressure region that draws the fluid from an ingress in the computing device through the fin structure. The heat transfer structure is enclosed in a chamber of the computing device. The chamber includes the ingress and an egress.
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公开(公告)号：US20230137610A1
公开(公告)日：2023-05-04
申请号：US17983289
申请日：2022-11-08
Applicant: Frore Systems Inc.
Inventor： Prabhu Sathyamurthy , Seshagiri Rao Madhavapeddy , Nilesh Sudhir Hasabnis , Shekhar Halakatti , Varun Rajamuthu , Woo Sung Chung , Suryaprakash Ganti
Abstract: A system including a module and an egress passageway is described. The module includes a cooling cells, a heat spreader, and a cover including vents therein. The cooling cells are between the heat spreader and the cover. Each of the cooling cells includes a cooling element configured to draw air in through the plurality of vents and drive air out of an aperture between the heat spreader and the cover at a first flow rate. A stream of hot air having been heated by a heat from a heat-generating structure thermally coupled to the heat spreader is thus provided. The hot air passes through the egress passageway toward an egress. The egress passageway includes at least one inlet through which cool air is drawn at a second flow rate to be mixed with the hot air. The second flow rate is greater than the first flow rate.
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