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公开(公告)号：US20190290920A1
公开(公告)日：2019-09-26
申请号：US16360372
申请日：2019-03-21
Applicant: Greatbatch Ltd.
Inventor： Robert A. Stevenson , Christine A. Frysz , Jason Woods
Abstract: A filter feedthrough for an AIMD includes an electrically conductive ferrule. An insulator hermetically seals a ferrule opening with either a first gold braze, a ceramic seal, a glass seal or a glass-ceramic seal. At least one conductive pathway is hermetically sealed to and disposed through the insulator body in non-conductive relationship with the ferrule. A feedthrough capacitor includes at least one active and ground electrode plate disposed within a capacitor dielectric and electrically connected to a capacitor active metallization and a capacitor ground metallization, respectively. At least a first edge of the feedthrough capacitor extends beyond a first outermost edge of the ferrule. At least a second edge of the feedthrough capacitor does not extend beyond a second outermost edge of the ferrule, or said differently, the second edge is either aligned with or setback from the second outermost edge of the ferrule.
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公开(公告)号：US20190192862A1
公开(公告)日：2019-06-27
申请号：US16291356
申请日：2019-03-04
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Marc Gregory Martino
CPC classification number: A61N1/3754 , H01G4/012 , H01G4/018 , H01G4/224 , H01G4/236 , H01G4/35 , H01G4/40 , H05K1/181 , H05K2201/10015
Abstract: A feedthrough separates a body fluid side from a device side. A passageway is disposed through the feedthrough. A body fluid side leadwire extends from a first end disposed inside the passageway to a second end on the body fluid side. A device side leadwire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side leadwire is hermetically sealed to the feedthrough body and is not of the same material as the device side leadwire. A circuit board has an active via hole with a second end of the second leadwire residing therein. The circuit board has an active circuit trace that is electrically connectable to electronic circuits housed in an AIMD, and a circuit board ground metallization. An active electrical path extends from the first leadwire to the second leadwire to an MLCC chip capacitor mounted on the circuit board and to the circuit board active circuit trace, and a ground electrical path extends from the MLCC chip capacitor to the circuit board ground metallization and then to the ferrule.
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63.发明申请公开(公告)号：US20180126176A1
公开(公告)日：2018-05-10
申请号：US15797278
申请日：2017-10-30
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel
CPC classification number: A61N1/3754 , H01B17/303
Abstract: A feedthrough subassembly is attachable to an active implantable medical device. A via hole is disposed through an electrically insulative and biocompatible feedthrough body extending from a body fluid side to a device side. A composite fill partially disposed within the via hole extends between a first and a second composite fill end. The first composite fill end is disposed at or near the device side of the feedthrough body. The second composite fill end is disposed within the via hole recessed from the body fluid side. The composite fill includes a first portion of a ceramic reinforced metal composite including alumina and platinum and a second portion of a substantially pure platinum fill and/or a platinum wire. A via hole metallization covers a portion of the second composite fill end. A metallic leadwire is at least partially disposed within the via hole and gold brazed via hole metallization.
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公开(公告)号：US20180126175A1
公开(公告)日：2018-05-10
申请号：US15603521
申请日：2017-05-24
Applicant: Greatbatch Ltd.
Inventor： Keith W. Seitz , Thomas Marzano , Robert A. Stevenson , Christine A. Frysz , Jason Woods , Richard L. Brendel , Marc Gregory Martino
CPC classification number: A61N1/3754 , H01G4/012 , H01G4/018 , H01G4/224 , H01G4/236 , H01G4/35 , H05K1/181 , H05K2201/10015
Abstract: An insulative feedthrough attachable to an active implantable medical device includes a feedthrough body having a material which is both electrically insulative, biocompatible and separates a body fluid side from a device side. A passageway is disposed through the feedthrough body. A composite conductor is disposed within the passageway and has a body fluid side metallic wire electrically conductive to a device side metallic wire. The body fluid side metallic wire extends from a first end disposed inside the passageway to a second end on the body fluid side. The device side metallic wire extends from a first end disposed inside the passageway to a second end on the device side. The body fluid side metallic wire is hermetically sealed to the feedthrough body. The body fluid side metallic wire is biocompatible and is not the same material as the device side metallic wire.
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Patent Agency Ranking
公开(公告)号：US20160367821A1
公开(公告)日：2016-12-22
申请号：US15250210
申请日：2016-08-29
Applicant: Greatbatch Ltd.
Inventor： Christine A. Frysz , Robert A. Stevenson , Jason Woods
CPC classification number: A61N1/3754 , H01G2/02 , H01G4/228 , H01G4/35 , H01G4/40 , H01R13/5224 , H01R13/7197 , H02G15/013 , H03H1/00 , H03H2001/0042 , H03H2001/0085
Abstract: A hermetically sealed filtered feedthrough assembly for an active implantable medical device includes an electrically conductive ferrule hermetically sealed by a first braze to an insulator. A conductor is hermetically sealed to and disposed through the insulator. A filter capacitor has an active electrode plate and a ground electrode plate which are disposed within and supported by a capacitor dielectric in an interleaved, partially overlapping relationship. A first passageway is disposed through the capacitor dielectric having a capacitor internal metallization which is connected to the active electrode plate. A capacitor external metallization electrically connects to the ground electrode plate. An oxide-resistant metal addition includes a conductive core with a conductive cladding of a different material. A first electrical connection is between the oxide-resistant metal addition and the capacitor external metallization. A second electrical connection is between the oxide-resistant metal addition and the ferrule.
Abstract translation: 用于有源可植入医疗装置的气密密封的过滤馈通组件包括由第一钎焊密封到绝缘体的导电套圈。 导体密封并穿过绝缘体。 滤波电容器具有有源电极板和接地电极板，其以交错的，部分重叠的关系设置在电容器电介质中并由电容器电介质支撑。 通过电容器电介质设置第一通道，该电容器电介质具有连接到有源电极板的电容器内部金属化。 电容器外部金属化电连接到接地电极板。 耐氧化金属添加物包括具有不同材料的导电覆层的导电芯。 第一电连接在耐氧化金属添加和电容器外部金属化之间。 第二电连接在耐氧化金属添加和套圈之间。
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公开(公告)号：US09511220B2
公开(公告)日：2016-12-06
申请号：US14600401
申请日：2015-01-20
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Bruehl E. Truex , Donald H. Hickel, Jr.
IPC: A61N1/00 , A61N1/08 , A61N1/05 , H01G4/35 , H01G2/10 , H01R43/00 , H01G4/005 , H01G4/12 , H01G4/40 , H02G3/22 , A61N1/372 , A61N1/375 , C22C29/12
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
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67.发明申请公开(公告)号：US20150134039A1
公开(公告)日：2015-05-14
申请号：US14600401
申请日：2015-01-20
Applicant: Greatbatch Ltd.
Inventor： Thomas Marzano , Keith W. Seitz , Robert A. Stevenson , Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Richard L. Brendel , Jason Woods , Steven W. Winn , Dominick J. Frustaci , Bruehl E. Truex , Donald H. Hickel, JR.
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.
Abstract translation: 升高的馈通可附接到有源可植入医疗装置的顶部或侧面。 馈通包括导电套圈和电介质基片。 电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。 电介质基片包括通常在导电套圈上方升高的体液侧提升部分。 至少一个通孔穿过电介质基底从体液侧设置到器件侧。 导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。 引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。
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68.发明授权Capacitor for an active implantable medical device (AIMD) for handling high RF power induced in an implanted lead from an external RF field 有权用于处理来自外部RF场的植入引线中感应的高RF功率的有源植入式医疗设备（AIMD）的电容器公开(公告)号：US08855768B1
公开(公告)日：2014-10-07
申请号：US14088849
申请日：2013-11-25
Applicant: Greatbatch Ltd.
Inventor： Robert Shawn Johnson , Dominick J. Frustaci , Warren S. Dabney , Robert A. Stevenson , Keith W. Seitz , Christine A. Frysz , Thomas Marzano , Richard L. Brendel , John E. Roberts , William Thiebolt , Christopher M. Williams , Jason Woods , Buehl E. Truex
CPC classification number: A61N1/08 , A61N1/05 , A61N1/3718 , A61N1/3754 , H01G4/35 , H03H1/0007
Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.
Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。
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69.发明申请CO-FIRED HERMETICALLY SEALED FEEDTHROUGH WITH ALUMINA SUBSTRATE AND PLATINUM FILLED VIA FOR AN ACTIVE IMPLANTABLE MEDICAL DEVICE 有权通过用于活性可植入医疗装置填充的氧化铝基底和铂填充物进行密封公开(公告)号：US20130184797A1
公开(公告)日：2013-07-18
申请号：US13743254
申请日：2013-01-16
Applicant: Greatbatch Ltd.
Inventor： Xiaohong Tang , William C. Thiebolt , Christine A. Frysz , Keith W. Seitz , Robert A. Stevenson , Richard L. Brendel , Thomas Marzano , Jason Woods , Dominick J. Frustaci , Steven W. Winn
IPC: A61N1/05
CPC classification number: A61N1/3754 , A61N1/05 , A61N1/08 , A61N1/372 , A61N1/375 , B23K35/3013 , C22C29/12 , H01G2/103 , H01G4/005 , H01G4/12 , H01G4/30 , H01G4/35 , H01G4/40 , H01R43/00 , H02G3/22 , Y10T156/1052
Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。
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