公开(公告)号：US09764129B2

公开(公告)日：2017-09-19

申请号：US15163241

申请日：2016-05-24

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Robert Shawn Johnson ,  Warren S. Dabney ,  Thomas Marzano ,  Richard L. Brendel ,  Christopher Michael Williams ,  Holly Noelle Moschiano ,  Keith W. Seitz ,  John E. Roberts

IPC: A61N1/08 ,  A61N1/375 ,  A61N1/37 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H03H1/00

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/3754 ,  A61N1/3758 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H03H1/0007

Abstract: An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

公开(公告)号：US20170080239A1

公开(公告)日：2017-03-23

申请号：US15368722

申请日：2016-12-05

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano

IPC: A61N1/375 ,  A61N1/05 ,  C22C29/12 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  A61N1/08 ,  B23K35/30

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A filter feedthrough is described. The filter feedthrough includes a conductive ferrule supporting a dielectric substrate having a body fluid side and a device side. At least one via hole provided with a conductive fill is disposed through the dielectric substrate from the body fluid side to the device side. At least one MLCC-type capacitor is supported by the dielectric substrate. A first circuit trace couples from an active metallization connected to the active electrode plates of the capacitor to conductive fill in the via hole. A second circuit trace couples from the ground electrode plate of the capacitor to a metallization contacting an outer surface of the dielectric substrate. Then, a conductive material couples from the ground metallization to the ferrule to thereby electrically couple the capacitor to the ferrule.

公开(公告)号：US09511220B2

公开(公告)日：2016-12-06

申请号：US14600401

申请日：2015-01-20

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Steven W. Winn ,  Dominick J. Frustaci ,  Bruehl E. Truex ,  Donald H. Hickel, Jr.

IPC: A61N1/00 ,  A61N1/08 ,  A61N1/05 ,  H01G4/35 ,  H01G2/10 ,  H01R43/00 ,  H01G4/005 ,  H01G4/12 ,  H01G4/40 ,  H02G3/22 ,  A61N1/372 ,  A61N1/375 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

公开(公告)号：US20150134039A1

公开(公告)日：2015-05-14

申请号：US14600401

申请日：2015-01-20

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Steven W. Winn ,  Dominick J. Frustaci ,  Bruehl E. Truex ,  Donald H. Hickel, JR.

IPC: A61N1/375 ,  H01G2/10

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

Abstract translation: 升高的馈通可附接到有源可植入医疗装置的顶部或侧面。 馈通包括导电套圈和电介质基片。 电介质基板被定义为包括体液侧和设置在导电套圈内的器件侧。 电介质基片包括通常在导电套圈上方升高的体液侧提升部分。 至少一个通孔穿过电介质基底从体液侧设置到器件侧。 导电填料设置在至少一个通孔内，形成气密密封并在体液侧和装置侧之间导电。 引线连接特征在体液侧电耦合到导电填充物并且邻近电介质基底的升高部分设置。

公开(公告)号：US08855768B1

公开(公告)日：2014-10-07

申请号：US14088849

申请日：2013-11-25

Applicant: Greatbatch Ltd.

Inventor： Robert Shawn Johnson ,  Dominick J. Frustaci ,  Warren S. Dabney ,  Robert A. Stevenson ,  Keith W. Seitz ,  Christine A. Frysz ,  Thomas Marzano ,  Richard L. Brendel ,  John E. Roberts ,  William Thiebolt ,  Christopher M. Williams ,  Jason Woods ,  Buehl E. Truex

IPC: H01G4/35 ,  A61N1/05 ,  A61N1/08

CPC classification number: A61N1/08 ,  A61N1/05 ,  A61N1/3718 ,  A61N1/3754 ,  H01G4/35 ,  H03H1/0007

Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮​​法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。

公开(公告)号：US20130184797A1

公开(公告)日：2013-07-18

申请号：US13743254

申请日：2013-01-16

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: A61N1/05

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

公开(公告)号：US12272899B2

公开(公告)日：2025-04-08

申请号：US18736643

申请日：2024-06-07

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Robert A. Stevenson ,  Christine A. Frysz ,  Marc Gregory Martino

IPC: H01R13/52 ,  A61N1/375 ,  H01G4/35 ,  H01R13/426 ,  H01R13/719

Abstract: A feedthrough terminal pin connector assembly for an active implantable medical device (AIMD) includes first and second terminal pin connectors, each comprising a sidewall having an exterior surface spaced from an interior surface defining a connector opening extending along a longitudinal axis. At least a first portion of the sidewall is electrically conductive. An electrically conductive compliant structure is supported by the electrically conductive portion of the sidewall in each of the first and second connector openings. A common housing contains the first and second terminal pin connectors with an insulative material electrically isolating the first and second electrically conductive sidewall portions from each other. The common housing is configured to be supported on a circuit board having at least a first and a second electrical circuits with the first and second electrically conductive portions being electrically connected to the respective first and second electrical circuits.

公开(公告)号：US12246183B1

公开(公告)日：2025-03-11

申请号：US18631709

申请日：2024-04-10

Applicant: Greatbatch Ltd.

Inventor： Jason Woods ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz

IPC: A61N1/375 ,  F16B43/00 ,  H01G4/35 ,  H01R13/52 ,  H01R13/533 ,  H05K1/02

Abstract: A self-centering washer is positioned between a feedthrough and a filter circuit board. The washer has openings through which first and second terminal pins extend. A first opening has an inner arcuate portion contacting the first terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. A second opening has an inner arcuate portion contacting the second terminal pin and an outer perimeter portion exposing the braze sealing the terminal pin to the insulator. In an imaginary configuration with the first and second washer openings superimposed one on top of the other, the cumulative arcuate distance of the inner arcuate portions about one of the terminal pins, subtracting overlap, results in a gap between the superimposed washer openings that is less than a diameter of the first and second terminal pins so that the washer is prevented from lateral movement.

公开(公告)号：US12149021B2

公开(公告)日：2024-11-19

申请号：US17561048

申请日：2021-12-23

Applicant: Greatbatch Ltd.

Inventor： Thomas Marzano ,  Keith W. Seitz ,  Robert A. Stevenson ,  Christine A. Frysz ,  Marc Gregory Martino

IPC: H01R13/52 ,  A61N1/375 ,  H01G4/35 ,  H01R13/426 ,  H01R13/719

Abstract: A hermetic feedthrough terminal pin connector for an active implantable medical device (AIMD) includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A feedthrough terminal pin is hermetically sealed to and disposed through the insulator, the feedthrough terminal pin extending outwardly beyond the insulator on the inside of the casing of the AIMD. A circuit board is disposed on the inside of the casing of the AIMD. A terminal pin connector includes: an electrically conductive connector housing disposed on the circuit board, wherein the connector housing is electrically connected to at least one electrical circuit disposed on the circuit board; and at least one electrically conductive prong supported by the connector housing, the at least one prong contacting and compressed against the feedthrough terminal pin, the at least one prong making a removable electrical connection.

公开(公告)号：US11406817B2

公开(公告)日：2022-08-09

申请号：US16880392

申请日：2020-05-21

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Keith W. Seitz

IPC: A61N1/08 ,  H01G4/005 ,  H01G4/30 ,  H01G4/35 ,  H01G4/236 ,  A61N1/375 ,  H01G4/12 ,  H03H1/00 ,  A61N1/37

Abstract: A filtered feedthrough assembly includes a ferrule configured to be installed in an AIMD housing. An insulator is disposed within a ferrule opening. A conductive pathway is disposed within a passageway through the insulator. A filter capacitor is disposed on a device side having active and ground electrode plates disposed within a capacitor dielectric k greater than 0 and less than 1,000. A capacitor active metallization is electrically connected to the active electrode plates. A ground capacitor metallization is electrically connected to the ground electrode plates. The filter capacitor is the first filter capacitor electrically connected to the conductive pathway coming from a body fluid side into the device side. An active electrical connection electrically connects the conductive pathway to the capacitor active metallization. A ground electrical connection electrically connects the ground capacitor metallization to the ferrule. The filter capacitor is a flat-through or an X2Y attenuator filter capacitor.