Light-emitting diode package and electronic device

    公开(公告)号:US11322646B2

    公开(公告)日:2022-05-03

    申请号:US16726285

    申请日:2019-12-24

    Abstract: Some embodiments of the present disclosure provide a light-emitting diode package. The light-emitting diode package includes a transparent substrate. The light-emitting diode package also includes a first light-emitting diode which is disposed on the transparent substrate and has a first multiple quantum well structure. The light-emitting diode package further includes a second light-emitting diode which is disposed on the transparent substrate and has a second multiple quantum well structure. The first multiple quantum well structure and the second multiple quantum well structure are disposed to emit lights with different wavelengths.

    Touch display devices
    67.
    发明授权

    公开(公告)号:US11042254B2

    公开(公告)日:2021-06-22

    申请号:US15795531

    申请日:2017-10-27

    Abstract: A touch display device includes a substrate. The substrate includes a display area, a non-display area, a first touch area, and a non-touch area. A first touch grid is disposed within the first touch area. A second touch grid is electrically isolated from the first touch grid and disposed within the first touch area. A first wire is disposed within the non-touch area and electrically connected to the first touch grid. A second wire is disposed within the non-touch area and electrically connected to the second touch grid. The first wire and the second wire are staggered and are electrically isolated from each other. The second wire includes at least two separate conductive units and at least one bridge wire connected to the at least two separate conductive units. An insulating layer is disposed between the first wire and the second wire.

    Tiled electronic device
    68.
    发明授权

    公开(公告)号:US10950685B2

    公开(公告)日:2021-03-16

    申请号:US16288547

    申请日:2019-02-28

    Abstract: A tiled electronic device includes a first electronic device and a second electronic device adjacent to each other. The first electronic device includes a first substrate having a first upper surface, a first lower surface, and a first side surface; and a first flexible substrate including a first upper portion, a first lower portion, and a first connection portion. The first upper portion is disposed corresponding to the first upper surface. The first lower portion is disposed corresponding to the first lower surface. The first connection portion is disposed corresponding to the first side surface. The second electronic device includes a second substrate having a second upper surface, a second lower surface, and a second side surface. The second side surface is opposite and adjacent to the first side surface. The first connection portion is located between the first side surface and the second side surface.

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