公开(公告)号：US20200066663A1

公开(公告)日：2020-02-27

申请号：US16465132

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Sasha N. OSTER

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L25/16 ,  H01L23/552 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52

Abstract: Embodiments of the invention include a microelectronic device that includes a first ultra thin substrate formed of organic dielectric material and conductive layers, a first mold material to integrate first radio frequency (RF) components with the first substrate, and a second ultra thin substrate being coupled to the first ultra thin substrate. The second ultra thin substrate formed of organic dielectric material and conductive layers. A second mold material integrates second radio frequency (RF) components with the second substrate.

公开(公告)号：US20190259622A1

公开(公告)日：2019-08-22

申请号：US16399703

申请日：2019-04-30

Applicant: INTEL CORPORATION

Inventor： Sasha N. OSTER ,  Fay HUA ,  Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Henning BRAUNISCH ,  Johanna M. SWAN

IPC: H01L21/285 ,  B82Y40/00 ,  H01L21/768 ,  H01L21/4763 ,  H01L21/033 ,  H01L25/16 ,  H05K1/16 ,  H05K3/28 ,  H01L23/66

Abstract: Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.

公开(公告)号：US20180350772A1

公开(公告)日：2018-12-06

申请号：US15777040

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING

IPC: H01L25/065 ,  H01L23/66 ,  H01L25/10 ,  H01L23/00

CPC classification number: H01L25/0655 ,  H01L23/66 ,  H01L24/16 ,  H01L25/065 ,  H01L25/105 ,  H01L2224/16225

Abstract: Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.

公开(公告)号：US20180316383A1

公开(公告)日：2018-11-01

申请号：US15771865

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR

IPC: H04B1/44 ,  H04B1/401 ,  H01Q3/42 ,  H01Q21/22

CPC classification number: H04B1/44 ,  H01Q3/36 ,  H01Q3/42 ,  H01Q21/06 ,  H01Q21/22 ,  H01Q23/00 ,  H04B1/18 ,  H04B1/401 ,  H04B1/48

Abstract: Embodiments of the invention include a communication module that includes a die having a transceiver and a phase shifter die that is coupled to the die. The phase shifter includes a power combiner and splitter. The communication module also includes a substrate that is coupled to the phase shifter die. The substrate includes an antenna unit with steerable beam forming capability for transmitting and receiving communications.

公开(公告)号：US20180218986A1

公开(公告)日：2018-08-02

申请号：US15748449

申请日：2015-12-02

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING

IPC: H01L23/66 ,  H01L25/16 ,  H01L23/00

CPC classification number: H04W76/10 ,  H01L23/66 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2224/16221 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01Q1/2266 ,  H01Q1/2283 ,  H01Q3/30 ,  H04B1/38 ,  H04B1/48 ,  H04Q1/15 ,  H05K7/1487

Abstract: A patch on interposer (PoINT) package is described with a wireless communications interface. Some examples include an interposer, a main patch attached to the interposer, a main integrated circuit die attached to the patch, a second patch attached to the interposer, and a millimeter wave radio die attached to the second patch and coupled to the main integrated circuit die through the interposer to communicate data between the main die and an external component.

公开(公告)号：US20180212645A1

公开(公告)日：2018-07-26

申请号：US15745908

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Adel A. ELSHERBINI ,  Emanuel COHEN

IPC: H04B1/48 ,  H01L23/66 ,  H01L25/065 ,  H01Q1/22

CPC classification number: H04W76/10 ,  H01L23/66 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2224/16221 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/19105 ,  H01Q1/2266 ,  H01Q1/2283 ,  H01Q3/30 ,  H04B1/38 ,  H04B1/48 ,  H04Q1/15 ,  H05K7/1487

Abstract: A microelectronic package is described with a wireless interconnect for chip-to-chip communication. In one example, the package includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier, and an antenna on the package substrate coupled to the radio to send the modulated data over the carrier to an external device.

公开(公告)号：US20170288642A1

公开(公告)日：2017-10-05

申请号：US15088987

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Feras EID ,  Georgios C. DOGIAMIS ,  Valluri R. RAO ,  Adel A. ELSHERBINI ,  Johanna M. SWAN ,  Telesphor KAMGAING ,  Vijay K. NAIR

IPC: H03H9/54 ,  H03H9/05 ,  B01D21/30 ,  H03H9/17

CPC classification number: H03H9/54 ,  H03H9/05 ,  H03H9/0542 ,  H03H9/17 ,  H03H9/173 ,  H03H9/2463 ,  H03H2009/02503 ,  H03H2009/155

Abstract: Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

公开(公告)号：US20170285695A1

公开(公告)日：2017-10-05

申请号：US15089001

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Feras EID ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Valluri R. RAO ,  Johanna M. SWAN

IPC: G06F1/18 ,  H03H9/54 ,  H03H9/56

CPC classification number: G06F1/18 ,  H03H9/0542 ,  H03H9/0557 ,  H03H9/542 ,  H03H9/545 ,  H03H9/56 ,  H03H9/587

Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.

公开(公告)号：US20240364000A1

公开(公告)日：2024-10-31

申请号：US18140361

申请日：2023-04-27

Applicant: Intel Corporation

Inventor： Bernd WAIDHAS ,  Thomas WAGNER ,  Georg SEIDEMANN ,  Harald GOSSNER ,  Telesphor KAMGAING ,  Shuhei YAMADA ,  Tae Young YANG

IPC: H01Q1/42 ,  H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q1/422 ,  H01Q1/2283 ,  H01Q9/0407

Abstract: Embodiments disclosed herein include a die module. In an embodiment, the die module comprises a die with a first surface and a second surface. In an embodiment, a first pad is on the second surface of the die, and a dielectric layer is over the second surface of the die and the first pad. In an embodiment, an antenna module is over the dielectric layer, where the antenna module comprises a second pad that is aligned over the first pad.

公开(公告)号：US20240266745A1

公开(公告)日：2024-08-08

申请号：US18620275

申请日：2024-03-28

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q19/22

CPC classification number: H01Q9/0414 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/526 ,  H01Q19/22 ,  H01L23/3675 ,  H01L2223/6672 ,  H01L2223/6677

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.