中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

171 records (took 0.017 seconds)

    DRIVING SYSTEM FOR PIEZOELECTRIC PUMP
    61.
    发明申请
    DRIVING SYSTEM FOR PIEZOELECTRIC PUMP 审中-公开

    公开(公告)号：US20180108825A1

    公开(公告)日：2018-04-19

    申请号：US15782514

    申请日：2017-10-12

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Shih-Chang Chen ,  Jia-Yu Liao ,  Chi-Feng Huang ,  Wei-Ming Lee ,  Yung-Lung Han

    IPC: H01L41/04

    Abstract: A driving system includes a voltage conversion module, a switching module, a detecting module, a voltage dividing module and a microcontroller. The voltage conversion module converts a first DC voltage into a second DC voltage. The switching module converts the second DC voltage into an AC voltage so as to drive a piezoelectric actuator of a piezoelectric pump. The detecting module includes a feedback circuit and a gas pressure sensor, wherein the feedback circuit detects an electric power reference value of the switching module, and the gas pressure sensor detects the gas pressure value of the piezoelectric pump. The microcontroller acquires a working frequency according to the electric power reference value so as to operate the piezoelectric actuator at the working frequency. The microcontroller controls the voltage conversion module to adjust the output voltage. Consequently, a gas pressure in the piezoelectric pump is correspondingly adjusted.

    Piezoelectric actuator
    66.
    发明授权
    Piezoelectric actuator 有权

    公开(公告)号：US11889764B2

    公开(公告)日：2024-01-30

    申请号：US17349249

    申请日：2021-06-16

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hao-Jan Mou ,  Shih-Chang Chen ,  Jia-Yu Liao ,  Hung-Hsin Liao ,  Che-Wei Huang ,  Chi-Feng Huang ,  Yung-Lung Han ,  Chun-Yi Kuo ,  Wei-Ming Lee

    IPC: H01L41/053 ,  H10N30/20 ,  H10N30/88

    CPC classification number: H10N30/20 ,  H10N30/88

    Abstract: A piezoelectric actuator includes a square suspension plate, an outer frame, a plurality of brackets and a square piezoelectric ceramic plate. The outer frame is arranged around the suspension plate. A second surface of the outer frame and a second surface of the suspension plate are coplanar with each other. Each of the plurality of brackets has two ends, a first end is perpendicular to and connected with the suspension plate, and a second end is perpendicular to and connected with the outer frame for elastically supporting the suspension plate. Each bracket has a length in a range between 1.22 mm and 1.45 mm and a width in a range between 0.2 mm and 0.6 mm. A length of the piezoelectric ceramic plate is not larger than a length of the suspension plate. The piezoelectric ceramic plate is attached on a first surface of the suspension plate.

    Gas detecting module
    69.
    发明授权
    Gas detecting module 有权

    公开(公告)号：US11353438B2

    公开(公告)日：2022-06-07

    申请号：US17017025

    申请日：2020-09-10

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hao-Jan Mou ,  Yung-Lung Han ,  Chi-Feng Huang ,  Chang-Yen Tsai ,  Wei-Ming Lee ,  Chun-Yi Kuo ,  Tsung-I Lin

    IPC: G01N33/00 ,  G01N1/24

    Abstract: A gas detecting module is disclosed. A gas-inlet concave and a gas-outlet concave are formed on a sidewall of a base. A gas-inlet-groove region and a gas-outlet-groove region are formed on a surface of the base. The gas-inlet concave is in fluid communication with a gas-inlet groove of the gas-inlet-groove region, and the gas-outlet concave is in fluid communication a gas-outlet groove of the gas-outlet-groove region. The gas-inlet-groove region and the gas-outlet-groove region are covered by a thin film to achieve the effectiveness of laterally inhaling and discharging out gas relative to the gas detecting module.

    WAFER STRUCTURE
    70.
    发明申请
    WAFER STRUCTURE 有权

    公开(公告)号：US20220134749A1

    公开(公告)日：2022-05-05

    申请号：US17116617

    申请日：2020-12-09

    Applicant: Microjet Technology Co., Ltd.

    Inventor： Hao-Jan Mou ,  Ying-Lun Chang ,  Hsien-Chung Tai ,  Chi-Feng Huang ,  Yung-Lung Han ,  Wei-Ming Lee

    IPC: B41J2/14

    Abstract: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chip is directly formed on the chip substrate by the semiconductor process, whereby the wafer is diced, and the inkjet chip is produced, to be implemented for inkjet printing. The inkjet chip includes plural ink-drop generators produced by the semiconductor process and formed on the chip substrate. The ink-drop generators are arranged in a longitudinal direction to form plural longitudinal axis array groups having a pitch maintained between two adjacent ink-drop generators in the longitudinal direction, and arranged in a horizontal direction to form plural horizontal axis array groups having a central stepped pitch equal to or less than 1/600 inches maintained between two adjacent ink-drop generators in the horizontal direction.

Patent Agency Ranking