-
Patent Agency Ranking
公开(公告)号：US20200120801A1
公开(公告)日：2020-04-16
申请号：US16288998
申请日：2019-02-28
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： JING-WEI LI , SHIN-WEN CHEN , YU-SHUAI LI , SHENG-JIE DING
Abstract: A camera module has a reduced light leakage. The camera module includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. Gaps are formed on the printed circuit board. The gaps extend from the first surface to a thickness direction of the first surface. Bumps are formed on the mounting bracket and correspondingly placed according to the gaps. Each of the bumps is received and fixed in a corresponding one of the gaps.
-
公开(公告)号：US20200089090A1
公开(公告)日：2020-03-19
申请号：US16182565
申请日：2018-11-06
Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
Inventor： SHUAI-PENG LI , JING-WEI LI , SHIN-WEN CHEN , SHENG-JIE DING
IPC: G03B21/16
Abstract: An optical projection module with improved heat dissipation includes a circuit board having a first surface and a second surface opposite the first surface. A semiconductor substrate is mounted on the first surface. The semiconductor substrate has a third surface facing the first surface and a fourth surface opposite to the third surface. A light source and an optical member are mounted on the fourth surface. The optical member includes a lens holder. The lens holder defines a receiving space for receiving the light source. The lens holder further defines at least one escaping hole. A heat dissipation block is received in each escaping hole.
-
公开(公告)号：US20190384145A1
公开(公告)日：2019-12-19
申请号：US16158115
申请日：2018-10-11
Inventor： SHIN-WEN CHEN , JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG
Abstract: An optical projector module proofed against distortion caused by heat building up in and around the light-emitting element includes a printed circuit board (PCB), a light emitting element, and an optical structure. The optical structure on the PCB includes a supporting member almost completely enclosing the light emitting element. The supporting member includes an embedded metal heat dissipating layer extending to cover outside surfaces of the supporting member. The metal heat dissipating layer occupies more than 70% of the outside surfaces of the supporting member, and being metallic the dissipating layer is able to conduct electricity.
-
公开(公告)号：US20190331988A1
公开(公告)日：2019-10-31
申请号：US16022957
申请日：2018-06-29
Inventor： SHIN-WEN CHEN , JING-WEI LI , SHENG-JIE DING , JIAN-CHAO SONG
Abstract: An optical projector module protected against image distortion caused by heat building up in the light-emitting element includes a printed circuit board, and a light emitting element and an optical member mounted on the printed circuit board. The optical member includes a supporting structure which forms a housing. The housing contains the light emitting element, and a dissipating member made of electrically and thermally conductive metal is embedded on an inner surface of the housing. The housing extends outside of the housing and forms a path to carry away heat generated.
-
65.发明申请公开(公告)号：US20190170915A1
公开(公告)日：2019-06-06
申请号：US15869190
申请日：2018-01-12
Inventor： SHENG-JIE DING , JING-WEI LI , SHIN-WEN CHEN , KUN LI
Abstract: A light shielding member includes a transparent plate. The transparent plate includes a first surface and a second surface opposite to the first surface; the first surface of the transparent plate comprises a first light permeable area and a light shielding area surrounding the first light permeable area. The light shielding member further comprises a opaque adhesive layer formed on the light shielding area.
-
-
-
-
Search Results
65
records
(took 0.014 seconds)
