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    Soldering and unsoldering machines
    61.
    发明授权
    Soldering and unsoldering machines 失效
    焊接和非焊接机械

    公开(公告)号：US3629543A

    公开(公告)日：1971-12-21

    申请号：US3629543D

    申请日：1970-06-29

    Applicant: MARCONI CO LTD

    Inventor： MAYHEW ANTONY JAMES ,  CHEALE LEONARD FREDERICK

    IPC: B23K1/018 ,  B23K3/06 ,  B23K1/02

    CPC classification number: B23K3/0646 ,  B23K1/018 ,  B23K2201/42

    Abstract: This invention provides a machine for simultaneously soldering or unsoldering a multiple connection component on a printed circuit board. The machine consists of a pot suitable for holding liquid at a temperature above the melting point of solder. A piston is fitted in the pot, and there is a channel passing through the piston. When the piston is depressed the hot liquid held in the pot rises up through the channel. The component to be soldered or unsoldered is positioned so that the surface of the hot displaced liquid comes in contact with the joints to be soldered or unsoldered.

    Solder flow reversing apparatus
    62.
    发明授权
    Solder flow reversing apparatus 失效
    焊接回流装置

    公开(公告)号：US3407984A

    公开(公告)日：1968-10-29

    申请号：US54476066

    申请日：1966-04-25

    Applicant: BRITISH AIRCRAFT CORP LTD

    Inventor： THOMAS WALKER BRIAN

    IPC: B23K3/06

    CPC classification number: B23K3/0653 ,  B23K2201/42 ,  Y10T29/49144

    Abstract: 1,110,892. Soldering. BRITISH AIRCRAFT CORPORATION (OPERATING) Ltd. 22 April, 1966 [28 April, 1965], No. 17888/65. Heading B3R. The subject matter of this Specification is substantially the same as that described in Specification 1,110,891 but the claims are concerned with a method of wave soldering parts mounted on a board wherein the solder encountered by the parts to be soldered as the board passes over the solder wave flows in a direction opposite to that of the board's travel having emerged from a nozzle and travelled along an upwardly inclined member extending from the nozzle and been reversed in direction by an upstanding lip at the end of the inclined member and with apparatus for use in the method.

    Apparatus for coating electrical articles
    65.
    发明授权
    Apparatus for coating electrical articles 失效
    电器用涂层装置

    公开(公告)号：US3207128A

    公开(公告)日：1965-09-21

    申请号：US19073262

    申请日：1962-04-27

    Applicant: WESTERN ELECTRIC CO

    Inventor： LEAVITT JR WILLIAM H ,  MCHALE DAVID T ,  STOCKER EDWARD T

    IPC: B23K3/06

    CPC classification number: B23K3/0653 ,  B23K2201/42

    Abstract: Apparatus for applying solder to a conducting surface on a wiring board includes a heated tank 10, Fig. 1, having a supply of molten solder 11, a layer of molten wax 45 on the supply of solder to seal it against air, a platform 26, Fig. 2, over which a stream of solder is pumped from the supply, and means 40, Fig. 1, to guide a wiring board so that the stream of solder contacts the board's conducting surface. The wax layer is excluded from the region of the platform. Excess solder is removed from the board by rollers 21, 22. Roller 21 dips into the wax and roller 22 is spring loaded at 54. The levels of solder and wax in the tank are controlled at 36 and 61. The solder is circulated as indicated in Fig. 2 by a pump 28, Fig. 1, and the rate of circulation controlled by valves 34 and 35. Wax from an overflow tank 60 is recirculated to the tank 10 by a pump 62.

    Soldering device
    69.
    发明授权
    Soldering device 失效
    焊接装置

    公开(公告)号：US6126060A

    公开(公告)日：2000-10-03

    申请号：US238494

    申请日：1999-01-27

    Applicant: Young-Zoon Moon

    Inventor： Young-Zoon Moon

    IPC: B23K1/00 ,  B23K1/08 ,  B23K3/00 ,  H05K3/34 ,  B23K31/00 ,  B23K31/02

    CPC classification number: B23K1/08 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/0763 ,  H05K3/3447

    Abstract: A soldering device adaptable to dipping method for preventing neighboring leads (L) from being mixed in molten lead (Pb) even though spaces between leads (L) of parts mounted to a PCB substrate (P) are relatively narrow, the device having a lead tub where molten lead is filled up to an upper end thereof and maintained at a predetermined temperature, the device comprising a receiving plate disposed at an upper surface of the lead tub and formed with a receiving unit for soldered parts of PCB substrate to contact the molten lead, a fixing unit mounted at the receiving plate for the PCB substrate to be accommodated with, detached from and fixed to the receiving unit, and an elevation arranged to elevate the receiving plate horizontally and slantingly.

    Abstract translation: 一种适用于浸渍方法的焊接装置，即使安装到PCB基板（P）的部件的引线（L）之间的空间相对较窄，防止相邻引线（L）不熔融在铅（Pb）中，该器件具有引线 其中熔融铅被填充到其上端并保持在预定温度，所述装置包括设置在引导槽的上表面处的接收板，并形成有用于与PCB基板的焊接部分接触的接收单元， 引线，安装在用于PCB基板的接收板上的固定单元，其被容纳，从接收单元分离并固定到接收单元，以及设置成水平和倾斜地升高接收板的高度。

    Method and apparatus for placing and attaching solder balls to substrates
    70.
    发明授权
    Method and apparatus for placing and attaching solder balls to substrates 失效
    用于将焊球放置和附接到基板的方法和装置

    公开(公告)号：US6119927A

    公开(公告)日：2000-09-19

    申请号：US27042

    申请日：1998-02-18

    Applicant: Richard Ramos ,  Paul W. Barnes

    Inventor： Richard Ramos ,  Paul W. Barnes

    IPC: B23K3/06 ,  B23K35/14 ,  B23K35/12 ,  B23K3/02 ,  B23K28/00 ,  B23K31/02 ,  B23K35/38

    CPC classification number: B23K3/0623 ,  B23K2201/42 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082

    Abstract: A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pattern is mated to the carrier plate with its holes aligned with the predetermine pattern on the substrate. Solder balls are loaded into each hole of the alignment plate. The solder balls may be loaded with a vacuum plate which uses vacuum to pick up solder balls in the predetermined pattern and place them over the holes on the alignment plate. The vacuum is released for dropping the balls in the holes of the alignment plate. Alternatively a shutter plate having holes corresponding to the holes on the alignment plate is fitted on the alignment plate and afforded slidable movement between an offset position and an aligned position. A ball is loaded in each hole in the shutter plate when it is in its offset position. The shutter plate is then slid its aligned position wherein its holes are aligned with the holes on the alignment plate causing the balls to drop into the holes on the alignment plate and onto a conductive pad of the substrate. The assembly of carrier and alignment plate is then heated in a non-oxidizing atmosphere in a furnace causing the solder balls to reflow and attach to the pads on the substrate.

    Abstract translation: 公开了一种用于将焊球放置并附着到具有预定图案的导电焊盘的基板的方法和装置。 将基板放置在载体板上。 具有对应于预定图案的孔的对准板与载体板配合，其孔与衬底上的预定图案对准。 焊球装载到对准板的每个孔中。 焊球可以装有真空板，该真空板使用真空来以预定图案拾取焊球，并将它们放置在对准板上的孔上。 释放真空以将球落在对准板的孔中。 或者，具有对应于对准板上的孔的孔的快门板装配在对准板上，并在偏移位置和对准位置之间提供可滑动运动。 当挡板处于其偏移位置时，球被装载在挡板中的每个孔中。 然后将快门板滑动其对准位置，其中其孔与对准板上的孔对齐，使得球落入对准板上的孔和衬底的导电垫上。 然后将载体和对准板的组件在炉中的非氧化气氛中加热，使得焊球回流并附着到衬底上的焊盘。

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