公开(公告)号：US09761444B2

公开(公告)日：2017-09-12

申请号：US15084091

申请日：2016-03-29

Applicant: The Board of Trustees of the University of Illinois

Inventor： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC: H01L21/02 ,  B82Y10/00 ,  H01L29/06 ,  H01L29/786 ,  H01L31/0392 ,  H01L31/18 ,  H01L21/308 ,  H01L29/12 ,  H01L29/04 ,  H01L23/00 ,  H01L21/683 ,  H01L27/12 ,  H01L25/075 ,  H01L33/00 ,  H01L33/32

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

公开(公告)号：US20170257687A1

公开(公告)日：2017-09-07

申请号：US15600148

申请日：2017-05-19

Applicant: ANALOG DEVICES, INC.

Inventor： Oliver J. Kierse ,  Christian Lillelund

IPC: H04R1/02 ,  B81B7/00

CPC classification number: H04R1/02 ,  B81B7/0061 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C2201/0185 ,  H01L23/053 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/13062 ,  H01L2924/1461 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.

公开(公告)号：US20170179085A1

公开(公告)日：2017-06-22

申请号：US15402718

申请日：2017-01-10

Applicant: The Board of Trustees of the University of Illinois ,  Semprius, Inc.

Inventor： John ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC: H01L25/075 ,  H01L33/48 ,  H01L31/054 ,  H01L31/0232 ,  H01L31/167 ,  H01L25/16 ,  H01L27/12 ,  H01L33/62 ,  H01L33/00 ,  H01L33/30 ,  H01L33/06 ,  H01L31/0693 ,  H01L33/54 ,  H01L33/56 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/043 ,  H01L31/0288 ,  H01S5/42 ,  H01S5/02 ,  H01S5/343 ,  H01L33/58

CPC classification number: H01L25/50 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/00 ,  H01L25/042 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/1214 ,  H01L27/124 ,  H01L27/1285 ,  H01L27/1292 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L29/78603 ,  H01L29/78681 ,  H01L31/02005 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/0288 ,  H01L31/03046 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/0543 ,  H01L31/0547 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/1804 ,  H01L31/1824 ,  H01L31/1868 ,  H01L31/1876 ,  H01L31/1892 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/30 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01S5/021 ,  H01S5/02284 ,  H01S5/183 ,  H01S5/3013 ,  H01S5/34326 ,  H01S5/423 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/00

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

公开(公告)号：US20160027737A1

公开(公告)日：2016-01-28

申请号：US14789645

申请日：2015-07-01

Applicant: The Board of Trustees of the University of Illinois

Inventor： John A. ROGERS ,  Dahl-Young KHANG ,  Yugang SUN ,  Etienne MENARD

IPC: H01L23/538 ,  H05K1/02 ,  H01L29/786 ,  H01L23/00

CPC classification number: H01L23/5387 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02422 ,  H01L21/02521 ,  H01L21/02532 ,  H01L21/02546 ,  H01L21/02628 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3157 ,  H01L23/564 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L27/1266 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/151 ,  H01L29/158 ,  H01L29/16 ,  H01L29/1602 ,  H01L29/1606 ,  H01L29/7781 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03926 ,  H01L31/18 ,  H01L31/1804 ,  H01L2221/68368 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/80894 ,  H01L2224/8385 ,  H01L2924/0002 ,  H01L2924/01002 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/10349 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/3025 ,  H05K1/0277 ,  H05K1/0283 ,  Y02E10/547 ,  Y02P70/521 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

公开(公告)号：US08739390B2

公开(公告)日：2014-06-03

申请号：US12636757

申请日：2009-12-13

Applicant: Vladimir Bulovic ,  Corinne Evelyn Packard ,  Jennifer Jong-Hua Yu ,  Apoorva Murarka ,  LeeAnn Kim

Inventor： Vladimir Bulovic ,  Corinne Evelyn Packard ,  Jennifer Jong-Hua Yu ,  Apoorva Murarka ,  LeeAnn Kim

IPC: H01H11/00

CPC classification number: B81C1/0046 ,  B81B2201/042 ,  B81C2201/0185 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49105 ,  Y10T156/1168

Abstract: The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.

Abstract translation: 本文公开的实施例涉及通过使用小的有机分子释放层通过微接触印刷创建MEMS的制造方法。 公开的方法能够将连续金属膜转移到不连续平台上以形成可变电容器阵列。 可变电容器阵列可以在施加电压的情况下产生机械运动。 本文公开的方法消除掩蔽和其它传统的MEMS制造方法。 本文公开的方法可以用于形成基本上透明的MEMS，其具有介于电极和石墨烯隔膜之间的PDMS层。

公开(公告)号：US08664699B2

公开(公告)日：2014-03-04

申请号：US13801868

申请日：2013-03-13

Applicant: The Board of Trustees of the University of Illinois

Inventor： Ralph G. Nuzzo ,  John A. Rogers ,  Etienne Menard ,  Keon Jae Lee ,  Dahl-Young Khang ,  Yugang Sun ,  Matthew Meitl ,  Zhengtao Zhu

IPC: H01L29/76 ,  H01L21/70 ,  H01L21/20 ,  H01L21/36 ,  C23C16/54

CPC classification number: H01L29/76 ,  B81C2201/0185 ,  B82Y10/00 ,  H01L21/02521 ,  H01L21/02603 ,  H01L21/02628 ,  H01L21/308 ,  H01L21/322 ,  H01L21/6835 ,  H01L23/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/04 ,  H01L29/06 ,  H01L29/0665 ,  H01L29/0673 ,  H01L29/0676 ,  H01L29/068 ,  H01L29/12 ,  H01L29/78603 ,  H01L29/78681 ,  H01L29/78696 ,  H01L31/0392 ,  H01L31/03926 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/32 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/03 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/0362 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/08225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/80 ,  H01L2224/80006 ,  H01L2224/80121 ,  H01L2224/80862 ,  H01L2224/80895 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/01032 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y02E10/547 ,  Y02P70/521 ,  Y10S977/707 ,  Y10S977/724 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Abstract translation: 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。 本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。 本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

公开(公告)号：US08601658B2

公开(公告)日：2013-12-10

申请号：US13248901

申请日：2011-09-29

Applicant: Vladimir Bulovic ,  Corinne Evelyn Packard ,  Jennifer Jong-Hua Yu ,  Apoorva Murarka ,  LeeAnn Kim

Inventor： Vladimir Bulovic ,  Corinne Evelyn Packard ,  Jennifer Jong-Hua Yu ,  Apoorva Murarka ,  LeeAnn Kim

IPC: H01G7/00

CPC classification number: B81C1/0046 ,  B81B2201/042 ,  B81C2201/0185 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49105 ,  Y10T156/1168

Abstract: The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.

Abstract translation: 本文公开的实施例涉及通过使用小的有机分子释放层通过微接触印刷创建MEMS的制造方法。 公开的方法能够将连续金属膜转移到不连续平台上以形成可变电容器阵列。 可变电容器阵列可以在施加电压的情况下产生机械运动。 本文公开的方法消除掩蔽和其它传统的MEMS制造方法。 本文公开的方法可以用于形成基本上透明的MEMS，其具有介于电极和石墨烯隔膜之间的PDMS层。

公开(公告)号：US20120142135A1

公开(公告)日：2012-06-07

申请号：US13308878

申请日：2011-12-01

Applicant: Cornel P. COBIANU

Inventor： Cornel P. COBIANU

IPC: H01L21/02

CPC classification number: G01N29/022 ,  B01L3/502707 ,  B81B2201/0214 ,  B81B2203/0118 ,  B81B2207/015 ,  B81C1/00214 ,  B81C2201/0185 ,  B81C2203/0118 ,  B81C2203/0714 ,  B81C2203/0735 ,  B82Y40/00 ,  G01N29/036 ,  G01N29/222 ,  G01N2291/021 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0427

Abstract: Some embodiments relate to method of fabricating a sensor. The method includes providing a substrate wafer that includes a suspended beam; adding an adhesive layer to the substrate wafer such that the adhesive layer covers portions of the substrate without covering the suspended beam; positioning a cover wafer onto the adhesive layer such that the suspend beam is exposed to ambient air through openings in the cover wafer; and functionalizing the suspended beam by contacting the suspended beam with materials through the opening in the cover wafer.

Abstract translation: 一些实施例涉及制造传感器的方法。 该方法包括提供包括悬挂梁的衬底晶片; 向所述基板晶片添加粘合剂层，使得所述粘合剂层覆盖所述基板的部分而不覆盖所述悬挂梁; 将覆盖晶片定位在粘合剂层上，使得悬挂梁通过盖晶片中的开口暴露于环境空气; 并且通过使悬挂的梁与材料通过覆盖晶片中的开口接触使悬臂的功能化。

公开(公告)号：US08173525B2

公开(公告)日：2012-05-08

申请号：US11454334

申请日：2006-06-16

Applicant: Samuel Graham, Jr. ,  William P. King ,  Ching-ping Wong

Inventor： Samuel Graham, Jr. ,  William P. King ,  Ching-ping Wong

IPC: H01L21/00 ,  H01L21/20

CPC classification number: G03F7/0002 ,  B81C1/00031 ,  B81C2201/0185 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  Y10S977/707 ,  Y10S977/887

Abstract: Systems and methods of nanomaterial transfer are described. A method of nanomaterial transfer involving fabricating a template and synthesizing nanomaterials on the template. Subsequently, the nanomaterials are transferred to a substrate by pressing the template onto the substrate. In some embodiments, the step of transferring the nanomaterials involves pressing the template onto the substrate such that the nanomaterials are embedded below a surface layer of the substrate. In some embodiments, the temperature of the plurality of nanomaterials is raised to assist the transfer of the nanomaterials to the substrate.

Abstract translation: 描述纳米材料转移的系统和方法。 纳米材料转移的方法涉及制作模板并在模板上合成纳米材料。 随后，通过将模板压在衬底上，将纳米材料转移到衬底。 在一些实施方案中，转移纳米材料的步骤包括将模板压在衬底上，使得纳米材料嵌入在衬底的表面层下面。 在一些实施方案中，提高多个纳米材料的温度以辅助将纳米材料转移到基底。

公开(公告)号：US20120069488A1

公开(公告)日：2012-03-22

申请号：US13248901

申请日：2011-09-29

Applicant: Vladimir Bulovic ,  Corinne Evelyn Packard ,  Jennifer Jong-Hua Yu ,  Apoorva Murarka ,  LeeAnn Kim

Inventor： Vladimir Bulovic ,  Corinne Evelyn Packard ,  Jennifer Jong-Hua Yu ,  Apoorva Murarka ,  LeeAnn Kim

IPC: H01G4/06

CPC classification number: B81C1/0046 ,  B81B2201/042 ,  B81C2201/0185 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49105 ,  Y10T156/1168

Abstract: The embodiments disclosed herein are directed to fabrication methods useful for creating MEMS via microcontact printing by using small organic molecule release layers. The disclose method enables transfer of a continuous metal film onto a discontinuous platform to form a variable capacitor array. The variable capacitor array can produce mechanical motion under the application of a voltage. The methods disclosed herein eliminate masking and other traditional MEMS fabrication methodology. The methods disclosed herein can be used to form a substantially transparent MEMS having a PDMS layer interposed between an electrode and a graphene diaphragm.

Abstract translation: 本文公开的实施例涉及通过使用小的有机分子释放层通过微接触印刷创建MEMS的制造方法。 公开的方法能够将连续金属膜转移到不连续平台上以形成可变电容器阵列。 可变电容器阵列可以在施加电压的情况下产生机械运动。 本文公开的方法消除掩蔽和其它传统的MEMS制造方法。 本文公开的方法可以用于形成基本上透明的MEMS，其具有介于电极和石墨烯隔膜之间的PDMS层。