Resin Composition
    61.
    发明公开
    Resin Composition 审中-公开

    公开(公告)号:US20230242736A1

    公开(公告)日:2023-08-03

    申请号:US18007884

    申请日:2021-11-22

    Abstract: One embodiment of the present invention relates to a resin composition or a method of producing a resin composition, and the resin composition includes 100 parts by volume of a resin (A), and 230 to 640 parts by volume of a filler (B) having an average particle diameter of 5 μm to 60 μm, wherein the filler (B) contains a filler (B-1) having a spherical shape with an average particle diameter of 0.1 μm or more and 0.7 μm or less and a filler (B-2) having a peak at least in a range of 0.9 μm to 3.0 μm in a particle size distribution measured by a laser diffraction method, and the proportion of the filler (B-1) is from 0.2 vol % to 5.0 vol % with respect to 100 vol % of the filler (B).

    SILICONE GEL COMPOSITION AND SILICONE GEL SHEET

    公开(公告)号:US20230227625A1

    公开(公告)日:2023-07-20

    申请号:US18002399

    申请日:2021-04-05

    CPC classification number: C08K5/01 C08K9/06 C08J5/18 C08K2201/001 C08J2383/07

    Abstract: A silicone gel composition of the present invention contains the following components; A 100 parts by mass of an organopolysiloxane that is curable by an addition reaction; B. 0.01 to 10 parts by mass of an unsaturated hydrocarbon compound having one alkenyl group per molecule; and C. an addition reaction curing catalyst in a catalytic amount. The unsaturated hydrocarbon compound is at least one selected from the group consisting of an a-olefin that is liquid at room temperature (25° C.) and does not volatilize or decompose at 100° C. and α-methylstyrene. A silicone gel sheet of the present invention is obtained by molding the silicone gel composition into a sheet, and curing the sheet.

    Anisotropic conductive film and connection structure

    公开(公告)号:US11685137B2

    公开(公告)日:2023-06-27

    申请号:US15765439

    申请日:2016-10-06

    CPC classification number: B32B5/142 B32B27/20 C08K9/02 C08K2201/001 Y10T428/25

    Abstract: An anisotropic conductive film which suppresses occurrence of short circuit at the time of anisotropic conductive connection, prevents reduction in capturing capability of electrically conductive particles, enables favorable pushing of electrically conductive particles and exhibits not only favorable initial conductivity but also favorable conduction reliability, contains a first electrically conductive particle group and a second electrically conductive particle group, each including a plurality of electrically conductive particles, in an insulating binder. The first electrically conductive particle group and the second electrically conductive particle group are present in a first region and a second region, respectively, which differ from each other in the thickness direction of the anisotropic conductive film and are parallel to the plane direction. Moreover, the first electrically conductive particle group and the second electrically conductive particle group differ from each other in an existence state of the electrically conductive particles.

    THERMALLY CONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING SAME

    公开(公告)号:US20230174837A1

    公开(公告)日:2023-06-08

    申请号:US17913620

    申请日:2021-03-26

    Abstract: The present invention relates to a thermally conductive resin composition excellent in toughness and thermal conductivity. The thermally conductive resin composition comprises a thermoplastic resin (A) and scale-like graphite (B), and is free from a polyester elastomer, wherein a content of the thermoplastic resin (A) is 45 to 60 parts by mass and a content of the scale-like graphite (B) is 40 to 55 parts by mass (based on 100 parts by mass in total of the thermoplastic resin (A) and the scale-like graphite (B)), the scale-like graphite (B) comprises scale-like graphite (B1) having a mean particle diameter D50 of 150 to 400 μm and scale-like graphite (B2) having a mean particle diameter D50 of 10 to 40 μm, a mass ratio B1:B2 is 94:6 to 60:40, and thermal conductivity in a plane direction of a molded article obtained from the thermally conductive resin composition is 8 W/(m·K) or more.

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