Abstract:
A heat-sealing film having a haze of not more than 30% and having a sealant layer made of a resin composition which comprises from 50 to 100 wt % of the total of the following components (a) to (c): (a) from 5 to 50 wt % of a block copolymer of from 50 to 95 wt % of a styrene-type hydrocarbon and from 5 to 50 wt % of a conjugated diene-type hydrocarbon, (b) from 5 to 50 wt % of an ethylene/α-olefin random copolymer, and (c) from 5 to 70 wt % of a block copolymer of from 10 to 50 wt % of a styrene-type hydrocarbon and from 50 to 90 wt % of a conjugated diene-type hydrocarbon, and (d) from 0 to 50 wt % of an impact-resistant polystyrene.
Abstract:
Disclosed is a pressure-sensitive adhesive sheet for use in processing a product such a semiconductor wafer. To provide a pressure-sensitive adhesive sheet that provides a minimized number of broken semiconductor wafers during the process of polishing them and that produces a less curl of the wafer due to the residual stress of the pressure-sensitive adhesive sheet, the pressure-sensitive adhesive sheet includes a composite film formed from a composition containing a urethane polymer and a vinyl polymer as effective components, a first film comprising a material different from that of the composite film, and a pressure-sensitive adhesive layer. It is preferable that the pressure-sensitive adhesive sheet has a modulus of 9 N/mm2 or more and 250 N/mm2 or less when an oblong piece of the pressure-sensitive adhesive sheet with a width of 20 mm is bent at a radius of curvature of 3.0 mm.
Abstract translation:公开了一种用于加工诸如半导体晶片的产品的压敏粘合片。 为了提供在抛光过程中提供最小数目的破裂的半导体晶片的压敏粘合片,并且由于压敏粘合片的残余应力而使晶片产生较少的卷曲,压敏粘合剂 片材包括由含有氨基甲酸酯聚合物和乙烯基聚合物作为有效成分的组合物形成的复合膜,包含不同于复合膜的材料的第一膜和压敏粘合剂层。 优选的是,压力敏感粘合片的长方体压力为9N / mm 2以上且250N / mm 2以下的模量 宽度为20mm的敏感性粘合片以3.0mm的曲率半径弯曲。
Abstract:
The re-peelable pressure-sensitive adhesive sheet of the invention is a re-peelable pressure-sensitive adhesive sheet, which comprises an adhesive agent layer formed over a base film, and which further comprises at least one intermediate layer between the base film and the adhesive agent layer, the intermediate layer having a storage elastic modulus (G′) of 3.0×104 to 1.0×108 Pa at 23° C. and a storage elastic modulus (G′) of 1.0×103 to 8.0×104 Pa at 200° C. Even when this re-peelable pressure-sensitive adhesive sheet and a semiconductor wafer are adhered to each other and they are placed, as they are, in a heating environment, the wafer can be prevented from being warped.
Abstract:
This invention relates to a multilayer film for use as in-mold labels, comprising a core layer having an upper surface and a lower surface; a skin layer overlying the upper surface of the core layer; a heat activatable layer bonded to the lower surface of the core layer by a tie layer; wherein the core layer comprises a blend of a propylene homopolymer and at least one polyterpene and wherein the multilayer film is oriented in the machine direction only and heat set.
Abstract:
The present invention is to provide a stain resistant film that shows excellent stain resistance in a long period of time immediate after forming the film, which exhibits stain resistance in initial use (within one month after forming the film) and keeps the resistance from reduction thereof with time. A stain resistant protective film comprising (a) a base layer formed from a film-forming resin and containing a hydrophilic stain resistant agent therein, and (b) a-surface layer containing another hydrophilic stain resistant agent at least, remaining on the periphery of the surface, formed on the base layer (a).
Abstract:
To provide an adhesive film having a high durability. A protective film comprising a cured resin and a filler dispersed in said cured resin, wherein said filler is composed of ceramic particles made of a composition containing alumina and zirconia, and said zirconia has mainly a tetragonal crystal form and is dispersed in said ceramic particles.
Abstract:
An article for reducing the drag caused by a fluid flowing over a surface comprises a backing layer having an outer, exposed patterned surface that reduces drag, and an adhesive bonding layer for bonding the backing layer to the surface of a substrate, the article being free of a reinforcing layer.
Abstract:
To provide a laminate film having better shaping processability than conventional laminate films by disposing between the first resin layer 1 and the adhesive layer 3 the second resin layer 2 which has a Vicat softening point lower than that of the first resin layer, has a melting point lower than that of the first resin layer by 2° C. or more, is at least 0.5 times thicker than the first resin layer, and contains as the main component a propylene-&agr;-olefin copolymer. In addition, it becomes possible to provide the laminated structure 5 having the laminate film provided with the second resin layer 2 on the substrate 4. Hence, the present invention has great industrial significance.
Abstract:
A tacky dust cleaner has an expanded pressure-sensitive adhesive layer, the expanded pressure-sensitive adhesive layer being constituted of a pressure-sensitive adhesive containing (A) an acrylic polymer containing an isocyanate group-reactive functional group, (B) a polyisocyanate based compound, (C) thermally expandable microspheres, and (D) an amine based compound containing plural hydroxyl groups.
Abstract:
This invention relates to labels. In one embodiment the labels comprise a polymer facestock layer, a nano-porous layer underlying the facestock, and an adhesive layer underlying the nano-porous layer. In another embodiment, the labels comprise a polymer facestock layer, a nano-porous layer underlying the facestock, and a metal layer overlying the facestock or underlying the facestock between the facestock and the nano-porous layer. These labels can be bonded to substrates of glass, plastic, or metal using a water based adhesive which is in contact with the nano-porous layer.