公开(公告)号：US20110061908A1

公开(公告)日：2011-03-17

申请号：US12875184

申请日：2010-09-03

Applicant: Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

Inventor： Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

IPC: H05K1/09 ,  B05D5/12

CPC classification number: H05K3/06 ,  H01L51/442 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2203/121 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T428/12063

Abstract: Disclosed is a method of manufacturing a pattern electrode which excels in electroconductivity, transparency and etching property and a pattern electrode, the method comprising a step of applying a metal particle containing solution onto a substrate to form a conductive layer, a step of pattern printing a metal particle removing solution on a portion of the conductive layer, which is to be removed, and a step of washing the resulting printed material, whereby the portion of the conductive layer on which the metal particle removing solution has been printed is removed to form a non-conductive portion.

Abstract translation: 公开了一种制造导电性，透明性和蚀刻性优异的图形电极的方法以及图案电极，所述方法包括将含金属颗粒的溶液涂布在基板上以形成导电层的步骤，图案印刷步骤 将要除去的导电层的一部分上的金属颗粒去除溶液和洗涤所得印刷材料的步骤，从而去除已经印刷有金属颗粒去除溶液的导电层的部分以形成 非导电部分。

公开(公告)号：US20110021016A1

公开(公告)日：2011-01-27

申请号：US12923590

申请日：2010-09-29

Applicant: Yuji Awano ,  Masataka Mizukoshi

Inventor： Yuji Awano ,  Masataka Mizukoshi

IPC: H01L21/60

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01L24/12 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/1134 ,  H01L2224/13193 ,  H01L2224/13582 ,  H01L2224/13693 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81899 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/026 ,  H05K2201/09472 ,  H05K2201/209 ,  H01L2224/13099 ,  H01L2224/0401

Abstract: A semiconductor package is disclosed that includes a semiconductor device; a circuit board; and a connection mechanism including a first conductive terminal provided on the semiconductor device, and a second conductive terminal provided on the circuit board side, the connection mechanism electrically connecting the semiconductor device and the circuit board via the first conductive terminal and the second conductive terminal. At least one of the first conductive terminal and the second conductive terminal of the connection mechanism includes one or more carbon nanotubes each having one end thereof fixed to the surface of the at least one of the first conductive terminal and the second conductive terminal, and extending in a direction away from the surface. The first conductive terminal and the second conductive terminal engage each other through the carbon nanotubes.

Abstract translation: 公开了一种包括半导体器件的半导体封装; 电路板; 以及连接机构，其包括设置在所述半导体器件上的第一导电端子和设置在所述电路板侧的第二导电端子，所述连接机构经由所述第一导电端子和所述第二导电端子电连接所述半导体器件和所述电路板。 连接机构的第一导电端子和第二导电端子中的至少一个包括一个或多个碳纳米管，每个碳纳米管的一端固定到第一导电端子和第二导电端子中的至少一个的表面，并且延伸 在远离表面的方向上。 第一导电端子和第二导电端子通过碳纳米管彼此接合。

公开(公告)号：US07875340B2

公开(公告)日：2011-01-25

申请号：US12003490

申请日：2007-12-26

Applicant: Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

Inventor： Seung Hyun Cho ,  Byoung Youl Min ,  Soon Jin Cho ,  Jin Won Choi

IPC: H05K1/00

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L21/486 ,  H01L21/4871 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K7/20481 ,  H05K2201/026 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: Disclosed herein is a method of manufacturing a heat radiation substrate, including injection-molding mixed powder of carbon nanotubes and metal in a die to fabricate a metal core having through holes; molding the entire metal core including the through holes with an insulating resin to fabricate a metal core substrate; processing the insulating resin provided in the through holes to form connection holes; and forming a circuit pattern on the metal core substrate in which the connection holes are formed.

Abstract translation: 本发明公开了一种制造散热基板的方法，包括：在模具中注入碳纳米管和金属的混合粉末以制造具有通孔的金属芯; 用绝缘树脂模制包括通孔的整个金属芯，以制造金属芯基板; 处理设置在通孔中的绝缘树脂以形成连接孔; 在形成有连接孔的金属芯基板上形成电路图案。

公开(公告)号：US20110011629A1

公开(公告)日：2011-01-20

申请号：US12804175

申请日：2010-07-15

Applicant: Steven Trigwell ,  Alexandru S. Biris ,  Carlos I. Calle

Inventor： Steven Trigwell ,  Alexandru S. Biris ,  Carlos I. Calle

IPC: H05K1/00 ,  B05D5/12 ,  H05K1/09

CPC classification number: B03C7/02 ,  B82Y30/00 ,  H01L31/022466 ,  H01L51/002 ,  H01L51/444 ,  H05K1/038 ,  H05K1/097 ,  H05K3/28 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10S977/932 ,  Y10T29/49155

Abstract: An electrodynamic array of conductive nanomaterial electrodes and a method of making such an electrodynamic array. In one embodiment, a liquid solution containing nanomaterials is deposited as an array of conductive electrodes on a substrate, including rigid or flexible substrates such as fabrics, and opaque or transparent substrates. The nanomaterial electrodes may also be grown in situ. The nanomaterials may include carbon nanomaterials, other organic or inorganic nanomaterials or mixtures.

Abstract translation: 导电纳米材料电极的电动力学阵列和制造这种电动力阵列的方法。 在一个实施方案中，含有纳米材料的液体溶液作为导电电极阵列沉积在基底上，包括刚性或柔性基底如织物和不透明或透明基底。 纳米材料电极也可以原位生长。 纳米材料可以包括碳纳米材料，其它有机或无机纳米材料或混合物。

公开(公告)号：US20100307792A1

公开(公告)日：2010-12-09

申请号：US12773734

申请日：2010-05-04

Applicant: Pierre-Marc Allemand ,  Florian Pschenitzka ,  Teresa Ramos ,  Jelena Sepa

Inventor： Pierre-Marc Allemand ,  Florian Pschenitzka ,  Teresa Ramos ,  Jelena Sepa

IPC: H01B5/00 ,  B05D5/12

CPC classification number: H01B1/02 ,  B82Y10/00 ,  C08K3/08 ,  C09D5/24 ,  C09D7/70 ,  C09D11/037 ,  C09D11/38 ,  G02F1/13439 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/022475 ,  H01L31/1884 ,  H05K1/097 ,  H05K2201/026 ,  Y02E10/50

Abstract: Reliable and durable conductive films formed of conductive nanostructures are described. The conductive films show substantially constant sheet resistance following prolonged and intense light exposure.

Abstract translation: 描述了由导电纳米结构形成的可靠和耐用的导电膜。 导电膜在长时间和强烈的曝光后显示出基本上恒定的薄层电阻。

公开(公告)号：US20100253375A1

公开(公告)日：2010-10-07

申请号：US12418438

申请日：2009-04-03

Applicant: Treliant Fang ,  Michael Harburn ,  Onnik Yaglioglu

Inventor： Treliant Fang ,  Michael Harburn ,  Onnik Yaglioglu

IPC: G01R31/02 ,  H01R13/02 ,  B32B7/00 ,  B82B1/00 ,  B82B3/00

CPC classification number: G01R3/00 ,  B81C1/00031 ,  G01R1/0483 ,  G01R1/06744 ,  G01R1/07314 ,  H05K3/4007 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/0338 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49222 ,  Y10T428/24174

Abstract: A technique for anchoring carbon nanotube columns to a substrate can include use of a filler material placed onto the surface of the substrate into area between the columns and surrounding a base portion of each of the columns.

Abstract translation: 用于将碳纳米管柱锚定到基底的技术可以包括使用放置在基底表面上的填充材料到列之间的区域并围绕每个柱的基部。

公开(公告)号：US20100243298A1

公开(公告)日：2010-09-30

申请号：US12414122

申请日：2009-03-30

Applicant: Vadim Gektin ,  David W. Copeland

Inventor： Vadim Gektin ,  David W. Copeland

IPC: H05K1/14 ,  H01B5/00

CPC classification number: H05K3/325 ,  B82Y10/00 ,  H01R12/7082 ,  H05K2201/026 ,  H05K2201/10378

Abstract: In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough. The at least one interconnect includes a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board.

Abstract translation: 在至少一个实施例中，提供了用于板互连系统的插入器。 插入器包括框架和至少一个互连件。 框架接收基板。 基板包括顶侧，底侧和导电界面。 导电接口延伸穿过顶侧和底侧，用于从位于顶侧的电气装置传送电信号。 所述至少一个互连件包括位于所述框架内的多个碳纳米管（CNT），用于接触所述基板的所述导电接口以将所述电信号传送到电路板的导电布置。

公开(公告)号：US20100207269A1

公开(公告)日：2010-08-19

申请号：US12389236

申请日：2009-02-19

Applicant: Ezekiel Kruglick

Inventor： Ezekiel Kruglick

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L21/76885 ,  B82Y30/00 ,  H01L21/288 ,  H01L21/76802 ,  H01L21/76817 ,  H01L21/76834 ,  H01L21/76877 ,  H01L2221/1094 ,  H05K3/1275 ,  H05K2201/026 ,  Y10S977/762

Abstract: Implementations of encapsulated nanowires are disclosed.

Abstract translation: 公开了封装的纳米线的实现。

公开(公告)号：US07763187B1

公开(公告)日：2010-07-27

申请号：US11895170

申请日：2007-08-23

Applicant: Vinod P. Veedu ,  Christopher J. Sullivan

Inventor： Vinod P. Veedu ,  Christopher J. Sullivan

IPC: H01B1/22 ,  H01B1/24

CPC classification number: H01B1/22 ,  C09D11/03 ,  C09D11/52 ,  H01B1/24 ,  H05K1/097 ,  H05K2201/026 ,  H05K2201/0272

Abstract: Conductive silver ink is reinforced using carbon nanotubes. Carbon nanomaterials are stabilized and uniformly dispersed in a solvent and mechanically mixed with conductive silver ink. The reinforcement material bridges the gap between separated silver flakes in the conductive silver ink. The carbon nanotubes reinforced conductive silver ink exhibits superior performance over unreinforced silver ink in its mechanical, electrical and thermal properties without significantly greater weight.

Abstract translation: 使用碳纳米管增强导电银墨。 碳纳米材料被稳定化并均匀地分散在溶剂中并与导电银墨机械混合。 增强材料桥接导电银墨中分离的银薄片之间的间隙。 碳纳米管增强的导电银墨在机械，电和热性能方面表现出优于非增强银墨的性能，而没有显着更大的重量。

公开(公告)号：US20100178722A1

公开(公告)日：2010-07-15

申请号：US12686076

申请日：2010-01-12

Applicant: Bassel de Graff ,  William J. Arora ,  Gilman Callsen ,  Roozbeh Ghaffari

Inventor： Bassel de Graff ,  William J. Arora ,  Gilman Callsen ,  Roozbeh Ghaffari

IPC: H01L21/50 ,  H01L31/18

CPC classification number: H01L21/30 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14645 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/0283 ,  H05K2201/026 ,  H05K2201/09263 ,  H05K2201/10106 ,  H01L2924/00

Abstract: System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.

Abstract translation: 提供了提供成像阵列制造工艺方法的系统，装置和方法，其包括制造半导体成像元件阵列，将元件与可拉伸的互连互连，并将具有预应变弹性体印模的阵列转印到次级非平面 表面。