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    Process for manufacturing inorganic article, inorganic article, and circuit substrate
    62.
    发明申请
    Process for manufacturing inorganic article, inorganic article, and circuit substrate 审中-公开
    无机制品，无机制品和电路基板的制造方法

    公开(公告)号：US20040214497A1

    公开(公告)日：2004-10-28

    申请号：US10852110

    申请日：2004-05-25

    Applicant: JAPAN VILENE CO., LTD.

    Inventor： Masaaki Kawabe ,  Takashi Tarao ,  Kouji Kimura

    IPC: D04H001/00 ,  C03B037/08

    CPC classification number: D01D5/0038 ,  C03B37/011 ,  D01F9/08 ,  D04H1/4209 ,  D04H1/4382 ,  H05K1/0366 ,  H05K2201/0293 ,  Y10T428/249924 ,  Y10T428/249928 ,  Y10T442/60

    Abstract: A process for manufacturing an inorganic material-based article comprising the steps of (1) forming a sol solution mainly composed of an inorganic component, (2) producing inorganic material-based gel fine fibers by extruding the resulting sol solution from a nozzle, and at the same time, applying an electrical field to the extruded sol solution to thin the extruded sol solution, and then, collecting inorganic material-based gel fine fibers on a support, (3) drying the collected inorganic material-based gel fine fibers to produce inorganic material-based article containing inorganic material-based dried gel fine fibers, and then, (4) sintering the inorganic material-based article containing inorganic material-based dried gel fine fibers to produce inorganic material-based article containing inorganic material-based sintered fine fibers.

    Abstract translation: 一种无机材料类制品的制造方法，其特征在于，包括以下步骤：（1）形成主要由无机成分构成的溶胶溶液，（2）通过从所述喷嘴挤出得到的溶胶溶液而制造无机材料类凝胶细纤维，以及 同时向挤出的溶胶溶液施加电场以使挤出的溶胶溶液稀薄，然后在载体上收集无机材料基凝胶细纤维，（3）将收集的无机材料基凝胶细纤维干燥至 生产含有无机材料的干凝胶细纤维的无机材料制品，然后（4）烧结含有无机材料的干凝胶细纤维的无机材料制品，以制备含有无机材料的无机材料基制品 烧结细纤维。

    Process for manufacturing inorganic article, inorganic article, and circuit substrate
    65.
    发明申请
    Process for manufacturing inorganic article, inorganic article, and circuit substrate 有权
    无机制品，无机制品和电路基板的制造方法

    公开(公告)号：US20030005723A1

    公开(公告)日：2003-01-09

    申请号：US10163997

    申请日：2002-06-07

    Applicant: JAPAN VILENE CO., LTD.

    Inventor： Masaaki Kawabe ,  Takashi Tarao ,  Kouji Kimura

    IPC: B32B017/12

    CPC classification number: D01D5/0038 ,  C03B37/011 ,  D01F9/08 ,  D04H1/4209 ,  D04H1/4382 ,  H05K1/0366 ,  H05K2201/0293 ,  Y10T428/249924 ,  Y10T428/249928 ,  Y10T442/60

    Abstract: A process for manufacturing an inorganic material-based article comprising the steps of (1) forming a sol solution mainly composed of an inorganic component, (2) producing inorganic material-based gel fine fibers by extruding the resulting sol solution from a nozzle, and at the same time, applying an electrical field to the extruded sol solution to thin the extruded sol solution, and then, collecting inorganic material-based gel fine fibers on a support, (3) drying the collected inorganic material-based gel fine fibers to produce inorganic material-based article containing inorganic material-based dried gel fine fibers, and then, (4) sintering the inorganic material-based article containing inorganic material-based dried gel fine fibers to produce inorganic material-based article containing inorganic material-based sintered fine fibers is disclosed.

    Abstract translation: 一种无机材料类制品的制造方法，其特征在于，包括以下步骤：（1）形成主要由无机成分构成的溶胶溶液，（2）通过从所述喷嘴挤出得到的溶胶溶液而制造无机材料类凝胶细纤维，以及 同时向挤出的溶胶溶液施加电场以使挤出的溶胶溶液稀薄，然后在载体上收集无机材料基凝胶细纤维，（3）将收集的无机材料基凝胶细纤维干燥至 生产含有无机材料的干凝胶细纤维的无机材料制品，然后（4）烧结含有无机材料的干凝胶细纤维的无机材料制品，以制备含有无机材料的无机材料基制品 公开了烧结细纤维。

    Method for reducing coefficient of thermal expansion in chip attach packages
    66.
    发明授权
    Method for reducing coefficient of thermal expansion in chip attach packages 失效
    降低芯片连接封装热膨胀系数的方法

    公开(公告)号：US06387830B1

    公开(公告)日：2002-05-14

    申请号：US09265210

    申请日：1999-03-10

    Applicant: Lawrence Robert Blumberg ,  Robert Maynard Japp ,  William John Rudik ,  John Frank Surowka

    Inventor： Lawrence Robert Blumberg ,  Robert Maynard Japp ,  William John Rudik ,  John Frank Surowka

    IPC: B32B526

    CPC classification number: B32B5/26 ,  B32B5/02 ,  B32B5/28 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/20 ,  B32B2553/00 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T29/4913 ,  Y10T442/2361 ,  Y10T442/2992 ,  Y10T442/3537 ,  Y10T442/3569 ,  Y10T442/3577 ,  Y10T442/3585 ,  Y10T442/3602 ,  Y10T442/3659

    Abstract: A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. The reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0.05% to 0.3%, preferably from about 0.08% to 0.10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The present invention also generally relates to a method for reducing the CTE of circuitized structures, and to methods for making reduced CTE laminate and circuitized structures comprising reduced CTE laminate. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably not B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat. Optionally, the reduced CTE laminate is sandwiched between two layers of metal, preferably copper.

    Abstract translation: 提供了一种简单，便宜，可钻，减少的CTE层压板和包括减小的CTE层压板的电路结构。 减少的CTE层压材料包括：约40％至75％，优选约55％至65％的树脂; 约0.05％至0.3％，优选约0.08％至0.10％的固化剂; 约25％至60％，优选约30％至40％的织布; 约1％至15％，优选约5％至10％体积的无纺石英垫。 本发明还通常涉及一种用于减小电路化结构的CTE的方法，以及用于制造减少的CTE层压体和包括减少的CTE层压体的电路化结构的方法。 制造减薄的CTE层压板和层压结构的方法包括以下步骤：提供无纺石英垫; 提供预浸料，优选不B阶固化至不超过完全固化的约40％，优选不超过30％; 将无纺石英垫夹在两层预浸料之间，并将预浸料坯的树脂回流到石英垫中。 任选地，还原的CTE层压体夹在两层金属之间，优选为铜。

    Base webs for printed circuit board production using the foam process and acrylic fibers
    67.
    发明申请
    Base webs for printed circuit board production using the foam process and acrylic fibers 审中-公开
    用于使用泡沫工艺和丙烯酸纤维的印刷电路板生产的底座

    公开(公告)号：US20010050130A1

    公开(公告)日：2001-12-13

    申请号：US09755082

    申请日：2001-01-08

    Applicant: Ahlstrom Glassfibre Oy.

    Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

    IPC: B32B031/00

    CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

    Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

    Abstract translation: 印刷电路板由至少一种包含至少50重量％的丙烯酸纤维的无纺布片材或纤维网层制成，任何平衡物基本上不导电的纤维，填料和粘合剂。 片材或纤维网优选通过泡沫方法制成，并且可以含有60-80％的直链聚丙烯腈纤维和40-20％的原纤化（纸浆）纤维。 纤维网或片材优选通过热压延来压缩，使其具有约0.1-1克/立方厘米的密度; 并且网或片可以具有介于约20-120克/平方米之间的基重。 幅材或片材还可以具有1-40％的基本上不导电的有机或无机粘合剂，或者可以是基本上不含粘合剂的。 使用这些非织造网或片的层制成的印刷电路板是常规的，包括预浸材料，导电电路元件和电子元件，并且与机织玻璃和非织造芳族聚酰胺产品相比具有改进的性能， 包括改进的纤维固结，易于板的构建，以及改善的MD / CD比和稳定性。

    Printed circuit board
    69.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：US06288343B1

    公开(公告)日：2001-09-11

    申请号：US09414818

    申请日：1999-10-08

    Applicant: Jung-Hyun Ahn ,  Jong-Hyun Lee

    Inventor： Jung-Hyun Ahn ,  Jong-Hyun Lee

    IPC: H05K100

    CPC classification number: H05K3/4691 ,  H05K3/361 ,  H05K2201/0293 ,  H05K2201/10136

    Abstract: Disclosed is a printed circuit board including a first layer having a first stacked region, a second stacked region spaced apart from the first stacked region by a selected distance, and a flexible connection part disposed between the first and second stacked regions, and extending to the first stacked region and the second stacked region with selected width and length, the flexible connection part having a conductive pattern layer for signal transmission between the first stacked region and the second stacked region; a pair of second layers disposed apart on an upper surface of each of the first and second stacked regions of the first layer and having a first signal pattern layer on both surfaces of each of the second layers, wherein the first signal pattern layer of the second layer is electrically connected to the conductive pattern of the flexible connection part, a pair of upper metal layers disposed on respective upper surfaces of the second layer, the upper metal layer interposing a first insulating adhesive between the upper metal layer and the second layer, a pair of third layers disposed apart on a lower surface of each of the first and second stacked regions of the first layer and having a second signal pattern layer on both surfaces of each of the third layers, and a pair of lower metal layers disposed on respective lower surfaces of the third layers, the lower metal layer interposing a second insulating adhesive between the lower metal layer and the third layer.

    Abstract translation: 公开了一种印刷电路板，包括具有第一堆叠区域的第一层，与第一堆叠区域间隔一定距离的第二堆叠区域以及设置在第一和第二堆叠区域之间的柔性连接部分，并且延伸到 第一堆叠区域和具有选定宽度和长度的第二堆叠区域，柔性连接部分具有用于在第一堆叠区域和第二堆叠区域之间进行信号传输的导电图案层; 一对第二层，设置在第一层的第一和第二堆叠区域的每一个的上表面上并且在每个第二层的两个表面上具有第一信号图案层，其中第二层的第一信号图案层 层与柔性连接部的导电图案电连接，一对上金属层设置在第二层的相应上表面上，上金属层在第一层和第二层之间插入第一绝缘粘合剂， 一对第三层，分隔在第一层的第一和第二堆叠区域的每一个的下表面上，并且在每个第三层的两个表面上具有第二信号图案层，以及一对下部金属层， 所述第三层的下表面，所述下金属层在所述下金属层和所述第三层之间插入第二绝缘粘合剂。

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