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    Electrical overstress pulse protection
    61.
    发明授权
    Electrical overstress pulse protection 失效
    电气过载脉冲保护

    公开(公告)号：US5340641A

    公开(公告)日：1994-08-23

    申请号：US11859

    申请日：1993-02-01

    Applicant: Antai Xu

    Inventor： Antai Xu

    IPC: H01C7/105 ,  H01T4/08 ,  H05K1/02 ,  H05K1/16 ,  B32B9/00

    CPC classification number: H01C7/105 ,  H01T4/08 ,  H05K1/0257 ,  H05K1/167 ,  H05K2201/0738 ,  Y10S428/901 ,  Y10T428/24917

    Abstract: An electrical overstress responsive composite is formed on an electrically insulative substrate, has a pair of electrodes associated with the substrate and defining a gap between the electrodes and over the interposed portion of the substrate, a pattern of closely spaced electrically conductive elements span said gap and are affixed to said substrate, and a dielectric resin overlies said conductive elements and also spans said gap. The dielectric resin may include conductive and/or semiconductive fine particles. The composite presents a high resistance to a low voltage applied across said electrodes and a low resistance to a high voltage applied across said electrodes.

    Abstract translation: 电绝缘响应复合材料形成在电绝缘衬底上，具有与衬底相关联的一对电极，并且在电极之间和衬底的插入部分之间限定间隔，间隔开的导电元件的图案跨越所述间隙，并且 固定在所述基板上，并且电介质树脂覆盖所述导电元件并且还跨越所述间隙。 电介质树脂可以包括导电和/或半导体细颗粒。 复合材料对施加在所述电极上的低电压具有高电阻，并且对跨所述电极施加的高电压具有低电阻。

    Substrates having voltage switchable dielectric materials
    62.
    发明授权
    Substrates having voltage switchable dielectric materials 有权
    基板具有可开关电介质材料

    公开(公告)号：US09226391B2

    公开(公告)日：2015-12-29

    申请号：US12976236

    申请日：2010-12-22

    Applicant: Shurui Shang ,  Robert Fleming

    Inventor： Shurui Shang ,  Robert Fleming

    IPC: H05K1/00 ,  H05K3/00 ,  H05K1/02 ,  H05K1/03

    CPC classification number: H05K1/0271 ,  H05K1/0259 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/068 ,  H05K2201/0738 ,  H05K2201/09136 ,  Y10T29/49124

    Abstract: Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.

    Abstract translation: 各种方面提供将VSDM结合到基底中以产生受ESD保护的基底。 在一些情况下，以导致ESD保护的衬底满足用于各种后续处理或应用的一个或多个规格（例如，厚度，平面度等）的方式结合VSDM。 各种方面提供了设计包含VSDM的衬底（例如，PCB），以及调整衬底的一个或多个方面以设计平衡的，受ESD保护的衬底。 某些实施方案包括将具有VSDM层的基底模制成第一形状。

    Geometric configuration or alignment of protective material in a gap structure for electrical devices
    65.
    发明授权
    Geometric configuration or alignment of protective material in a gap structure for electrical devices 有权
    保护材料在电气设备的间隙结构中的几何配置或对准

    公开(公告)号：US09053844B2

    公开(公告)日：2015-06-09

    申请号：US12878344

    申请日：2010-09-09

    Applicant: Lex Kosowsky ,  Robert Fleming

    Inventor： Lex Kosowsky ,  Robert Fleming

    IPC: H02H9/00 ,  H01C7/10 ,  H02H3/22 ,  H01C7/12 ,  H05K1/02 ,  H05K1/16

    CPC classification number: H01C7/10 ,  H01C7/12 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/167 ,  H05K2201/0738

    Abstract: An electrical device that includes a first electrode and a second electrode that are separated from one another so as to form a gap structure. A layer of protective material spans the gap structure to contact the first electrode and the second electrode. A dimension of the gap structure, corresponding to a separation distance between the first electrode and the second electrode, is varied and includes a minimum separation distance that coincides with a critical path of the layer of protective material between the first electrode and the second electrode.

    Abstract translation: 一种电气装置，包括彼此分离以形成间隙结构的第一电极和第二电极。 一层保护材料跨越间隙结构以接触第一电极和第二电极。 相应于第一电极和第二电极之间的间隔距离的间隙结构的尺寸是变化的并且包括与第一电极和第二电极之间的保护材料层的关键路径一致的最小间隔距离。

    SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION
    67.
    发明申请
    SUBSTRATE DEVICE OR PACKAGE USING EMBEDDED LAYER OF VOLTAGE SWITCHABLE DIELECTRIC MATERIAL IN A VERTICAL SWITCHING CONFIGURATION 有权
    在垂直切换配置中使用电压可切换介质材料的嵌入层的衬底器件或封装

    公开(公告)号：US20120256721A1

    公开(公告)日：2012-10-11

    申请号：US13524776

    申请日：2012-06-15

    Applicant: Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

    Inventor： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

    IPC: H01C7/10

    CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0738 ,  H05K2203/105

    Abstract: A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

    Abstract translation: 衬底器件包括覆盖导电元件或层以提供接地的VSD材料的嵌入层。 连接到要被保护的电路元件的电极延伸到衬底的厚度以与VSD层接触。 当电路元件在正常电压下工作时，VSD层是电介质的，不连接到地。 当在电路元件上发生瞬态电事件时，VSD层立即切换到导通状态，使得第一电极连接到地。

    Wireless communication device using voltage switchable dielectric material
    69.
    发明申请
    Wireless communication device using voltage switchable dielectric material 审中-公开
    使用可切换电介质材料的无线通信设备

    公开(公告)号：US20120195018A1

    公开(公告)日：2012-08-02

    申请号：US11562222

    申请日：2006-11-21

    Applicant: Lex Kosowsky

    Inventor： Lex Kosowsky

    IPC: H05K9/00 ,  B82Y30/00

    CPC classification number: G06K19/07345 ,  G06K19/07318 ,  G06K19/07735 ,  H05K1/0254 ,  H05K1/0373 ,  H05K2201/0738

    Abstract: A wireless communication device, such as an RFID tag, is provided material that is dielectric, unless a voltage is applied that exceeds the materials characteristic voltage level. In the presence of such voltage, the material becomes conductive. The integration of such material into the device may be mechanical and/or electrical.

    Abstract translation: 提供诸如RFID标签的无线通信设备，其是介电材料，除非施加超过材料特性电压电平的电压。 在存在这种电压的情况下，材料变得导电。 将这种材料整合到装置中可以是机械的和/或电的。

    Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
    70.
    发明授权
    Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration 有权
    基板装置或封装，采用垂直开关配置的可切换电介质材料的嵌入层

    公开(公告)号：US08203421B2

    公开(公告)日：2012-06-19

    申请号：US12417589

    申请日：2009-04-02

    Applicant: Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

    Inventor： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

    IPC: H01C7/10

    CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0738 ,  H05K2203/105

    Abstract: A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

    Abstract translation: 衬底器件包括覆盖导电元件或层以提供接地的VSD材料的嵌入层。 连接到要被保护的电路元件的电极延伸到衬底的厚度以与VSD层接触。 当电路元件在正常电压下工作时，VSD层是电介质的，不连接到地。 当在电路元件上发生瞬态电事件时，VSD层立即切换到导通状态，使得第一电极连接到地。

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