公开(公告)号：US20110214903A1

公开(公告)日：2011-09-08

申请号：US13128928

申请日：2009-11-19

Applicant: Takahiko Sawada ,  Hiroshi Aoyama

Inventor： Takahiko Sawada ,  Hiroshi Aoyama

IPC: H05K1/02 ,  B32B37/02 ,  B32B37/14 ,  B32B38/10 ,  B23K1/20 ,  B23K31/02

CPC classification number: H05K1/0366 ,  B29C70/202 ,  B29C70/865 ,  B29K2707/04 ,  H05K1/142 ,  H05K3/403 ,  H05K2201/0323 ,  H05K2201/09118 ,  H05K2201/10287

Abstract: There is provided a functional panel that can be joined and disassembled with ease by solving problems with a functional panel including electrical conductors integrally molded therewith, causing occurrence of cracking on the surface thereof, or cracking of a molded unit around the periphery of the electrical conductor, thereby rendering the electrical conductor susceptible to a break when a flexural load, an impact load, and so forth, acts on the functional panel. The functional panel comprises a main body of a panel member, an electrical conductor coated with a semi-cured resin having heat resistance and insulation properties, and a reinforcing fiber having a continuous filament, for fixing the electrical conductor to the main body of the panel member to thereby provide enhancement, and the functional panel is formed by exposing one end, and the other end of the electrical conductor from respective end faces of the panel member formed by integral molding.

Abstract translation: 提供了一种功能面板，其可以通过解决包括与其一体模制的电导体的功能面板的问题而容易地连接和拆卸，从而在其表面上产生开裂或者围绕电导体的周边的模制单元的开裂 从而当弯曲载荷，冲击载荷等作用在功能面板上时，电导体易于断裂。 功能面板包括面板构件的主体，涂覆有具有耐热性和绝缘性的半固化树脂的电导体和具有连续细丝的增强纤维，用于将电导体固定到面板的主体 构件，从而提供增强功能，并且功能面板通过一端形成，并且通过一体成型形成的面板构件的相应端面露出电导体的另一端。

公开(公告)号：US07987589B2

公开(公告)日：2011-08-02

申请号：US12333014

申请日：2008-12-11

Applicant: Han-Pei Huang ,  Cheng-Hung Yu

Inventor： Han-Pei Huang ,  Cheng-Hung Yu

IPC: H05K3/02

CPC classification number: H05K3/4644 ,  B33Y10/00 ,  B33Y80/00 ,  H05K1/0284 ,  H05K3/046 ,  H05K3/06 ,  H05K3/185 ,  H05K3/205 ,  H05K3/386 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit structure is then formed on a surface of the three-dimensional insulating structure. Next, an insulating layer covering the first three-dimensional circuit structure is formed. Thereafter, a second three-dimensional circuit structure is formed on the insulating layer. Subsequently, at least a conductive via penetrating the insulating layer is formed for electrically connecting the second three-dimensional circuit structure and the first three-dimensional circuit structure.

Abstract translation: 本发明提供了一种多层三维电路结构及其制造方法。 制造方法包括以下步骤。 首先，提供三维绝缘结构。 然后在三维绝缘结构的表面上形成第一三维电路结构。 接下来，形成覆盖第一三维电路结构的绝缘层。 此后，在绝缘层上形成第二三维电路结构。 随后，至少形成了穿过绝缘层的导电通孔，用于电连接第二三维电路结构和第一三维电路结构。

公开(公告)号：US07973238B2

公开(公告)日：2011-07-05

申请号：US12628432

申请日：2009-12-01

Applicant: Masahiko Namerikawa ,  Yukihisa Takeuchi ,  Shinsuke Yano ,  Kazuyoshi Shibata ,  Koji Ikeda ,  Masahiro Abe

Inventor： Masahiko Namerikawa ,  Yukihisa Takeuchi ,  Shinsuke Yano ,  Kazuyoshi Shibata ,  Koji Ikeda ,  Masahiro Abe

IPC: H02G3/04

CPC classification number: H05K3/207 ,  C04B35/6342 ,  C04B35/63448 ,  C04B35/6346 ,  C04B2235/6023 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09118 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A ceramic compact having a patterned conductor is obtained by coating the patterned conductor with a slurry and then by hardening the slurry. The slurry is prepared by mixing a thermosetting resin precursor, a ceramic powder, and a medium. In the ceramic compact, an isocyanate- or isothiocyanate-containing gelling agent and a hydroxyl-containing polymer are reacted and hardened to produce a thermosetting resin. The hydroxyl-containing polymer is preferably a butyral resin, an ethylcellulose-based resin, a polyethyleneglycol-based resin, or a polyether-based resin.

Abstract translation: 具有图案化导体的陶瓷压块通过用浆料涂覆图案化的导体，然后通过硬化浆料而获得。 通过混合热固性树脂前体，陶瓷粉末和介质来制备浆料。 在陶瓷压块中，将含异氰酸酯或异硫氰酸酯的胶凝剂和含羟基的聚合物反应并硬化以制备热固性树脂。 含羟基的聚合物优选为丁缩醛树脂，乙基纤维素系树脂，聚乙二醇类树脂或聚醚类树脂。

公开(公告)号：US07952114B2

公开(公告)日：2011-05-31

申请号：US12235822

申请日：2008-09-23

Applicant: Charles Raymond Gingrich, III

Inventor： Charles Raymond Gingrich, III

IPC: H01L33/00

CPC classification number: F21V19/0035 ,  F21K9/00 ,  F21V7/0083 ,  F21V17/005 ,  F21V17/12 ,  F21V17/164 ,  F21V19/045 ,  F21V29/503 ,  F21V29/763 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10 ,  H01R13/2442 ,  H01R33/7685 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/183 ,  H05K2201/09054 ,  H05K2201/09118 ,  H05K2201/10106

Abstract: A light-emitting device assembly which can be used in many applications has a contact carrier, at least one light-emitting device, a heat sink and at least one securing member. The contact carrier has a light-emitting device receiving region and resilient contacts which are provided proximate to the light-emitting device receiving region. The at least one light-emitting device has leads which extend therefrom to mechanically and electrically engage the resilient contacts. The heat sink is thermally coupled to the at least one light-emitting device. The at least one securing member extends through the contact carrier and into the heat sink to releasably retain the contact carrier and the at least one light-emitting device in position relative to each other and relative to the heat sink.

Abstract translation: 可用于许多应用中的发光器件组件具有接触载体，至少一个发光器件，散热器和至少一个固定元件。 接触载体具有靠近发光器件接收区域设置的发光器件接收区域和弹性触点。 所述至少一个发光器件具有从其延伸的引线以机械地和电接合弹性触点。 散热器热耦合到至少一个发光器件。 所述至少一个固定构件延伸穿过所述接触载体并进入所述散热器，以将所述接触载体和所述至少一个发光装置可释放地保持在相对于彼此并相对于所述散热器的位置。

公开(公告)号：US07909482B2

公开(公告)日：2011-03-22

申请号：US11842606

申请日：2007-08-21

Applicant: Thomas J. Veenstra ,  Paul T. Vander Kuyl ,  Matthew S. Weeda ,  Michael L. Lanser ,  Kyle A. Israels ,  Jason R. Mulder ,  Mark W. Vander Pol

Inventor： Thomas J. Veenstra ,  Paul T. Vander Kuyl ,  Matthew S. Weeda ,  Michael L. Lanser ,  Kyle A. Israels ,  Jason R. Mulder ,  Mark W. Vander Pol

IPC: F21V21/00

CPC classification number: B29C45/1671 ,  B29C45/14639 ,  F21K9/00 ,  F21V31/04 ,  F21W2106/00 ,  H01L33/54 ,  H05K1/187 ,  H05K3/202 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/1316 ,  H05K2203/1476 ,  Y10T29/49146

Abstract: An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.

Abstract translation: 诸如LED灯组件的电气装置包括导电电路和连接到电路的一个或多个电气部件。 电气部件和电路至少部分地用热塑性聚合物材料包覆成型以封装部件。 用于覆盖电路和/或电气部件的材料也可用于形成成品部件的壳体或其它结构。

公开(公告)号：US07876577B2

公开(公告)日：2011-01-25

申请号：US11684665

申请日：2007-03-12

Applicant: Ronald Martin Weber ,  Sheldon Lynn Horst

Inventor： Ronald Martin Weber ,  Sheldon Lynn Horst

IPC: H05K7/04

CPC classification number: H05K1/183 ,  H05K1/0284 ,  H05K3/301 ,  H05K3/303 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49002 ,  Y10T29/49137

Abstract: A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the substrate. The anchor is either a raised structure or a recessed structure, and further includes at least one retention member formed integrally with the anchor. At least one electronic component is mounted within the anchor and the at least one retention member secures the component to the substrate. At least one electrical trace is disposed on the substrate and the at least one electrical trace extends into the anchor, contacts the at least one electronic component, and forms an electrical connection between the substrate and the at least one electronic component.

Abstract translation: 提供了一种用于将电气设备彼此连接的系统。 该系统包括水平或非水平衬底和连接到衬底或与衬底一体形成的锚固件。 锚固件是凸起结构或凹形结构，并且还包括与锚固件一体形成的至少一个保持构件。 至少一个电子部件安装在锚固体内，并且至少一个保持构件将部件固定到基底上。 至少一个电迹线设置在衬底上，并且至少一个电迹线延伸到锚中，接触至少一个电子部件，并在衬底和至少一个电子部件之间形成电连接。

公开(公告)号：US07868347B2

公开(公告)日：2011-01-11

申请号：US12404309

申请日：2009-03-15

Applicant: Lijun Cui

Inventor： Lijun Cui

IPC: H01L33/62

CPC classification number: H05K3/202 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/06 ,  H05K2201/09118 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A new SMD (surface mount devices) package design for efficiently removing heat from LED Chip(s) is involved in this invention. Different from the regular SMD package, which electrical isolated materials like Alumina or AlN are used, the substrate material here is metal like Copper, Aluminum and so on. Also, different from regular design, which most time only has one LED chip inside, current design will at least have two or more LED chips (or chip groups) in one package. All chips are electrical connected via metal blocks, traces or wire-bond. This type of structure is generally fabricated via chemical etching and then filled with dielectric material inside to form a strong package. Because the thermal conductivity of the metal is much higher than the ceramics, the package thermal resistance is much lower than the ceramics based package. Also, the cost of the package is much lower than ceramics package. Moreover, emitting area in one package is much larger than the current arts.

Abstract translation: 本发明涉及用于有效地从LED芯片去除热量的新的SMD（表面贴装器件）封装设计。 与常规SMD封装不同，使用了诸如氧化铝或AlN的电隔离材料，这里的基板材料是金属如铜，铝等。 此外，与常规设计不同的是，大多数时间内只有一个LED芯片，目前的设计将至少在一个封装中有两个或更多个LED芯片（或芯片组）。 所有芯片通过金属块，迹线或线接电连接。 这种类型的结构通常通过化学蚀刻制造，然后在其内填充介电材料以形成强封装。 由于金属的导热率远高于陶瓷，所以封装的热阻远低于陶瓷封装。 此外，封装的成本远低于陶瓷封装。 此外，一个封装中的发光面积远远大于当前的技术。

公开(公告)号：US20100326236A1

公开(公告)日：2010-12-30

申请号：US12807447

申请日：2010-09-07

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: F16H57/02 ,  B29C45/00

CPC classification number: F16H57/032 ,  B29C45/0001 ,  B29C45/0013 ,  B29C48/00 ,  B29C48/06 ,  B29C48/08 ,  B29C67/24 ,  B29K2995/0005 ,  B29K2995/0013 ,  B29L2031/3055 ,  B29L2031/3456 ,  F16H57/031 ,  F16H2057/02017 ,  G06K19/07749 ,  H01Q1/1271 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T74/2186 ,  Y10T74/2188

Abstract: Automotive housings are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are metals or conductive non-metals or metal plated non-metals. The micron conductive fibers may be metal fiber or metal plated fiber. Further, the metal plated fiber may be formed by plating metal onto a metal fiber or by plating metal onto a non-metal fiber. Any platable fiber may be used as the core for a non-metal fiber. Superconductor metals may also be used as micron conductive fibers and/or as metal plating onto fibers in the present invention.

Abstract translation: 汽车外壳由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末是金属或导电非金属或非金属镀金属。 微米导电纤维可以是金属纤维或金属镀覆的纤维。 此外，金属镀覆的纤维可以通过将金属镀在金属纤维上或通过将金属电镀到非金属纤维上而形成。 可以使用任何可镀纤维作为非金属纤维的芯。 在本发明中，超导体金属也可用作微米导电纤维和/或作为金属镀覆在纤维上。

公开(公告)号：US20100192361A1

公开(公告)日：2010-08-05

申请号：US12798898

申请日：2010-04-13

Applicant: Thomas Aisenbrey

Inventor： Thomas Aisenbrey

IPC: H01M6/00

CPC classification number: H01M2/30 ,  B29C45/0001 ,  B29C45/0013 ,  B29C47/0004 ,  B29K2995/0005 ,  B29K2995/0013 ,  B29L2031/3456 ,  B29L2031/3468 ,  B29L2031/36 ,  G06K19/07749 ,  H01B3/30 ,  H01B3/308 ,  H01B7/02 ,  H01B13/0036 ,  H01M2/00 ,  H01M10/6551 ,  H01Q1/1271 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T29/49108

Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

公开(公告)号：US20100186994A1

公开(公告)日：2010-07-29

申请号：US12669163

申请日：2008-07-16

Applicant: Paul Westmarland ,  Daniel Bamford

Inventor： Paul Westmarland ,  Daniel Bamford

IPC: H05K3/00 ,  H05K1/00

CPC classification number: B29C45/14065 ,  B29C45/0055 ,  B29C45/14639 ,  B29C2045/0058 ,  B29C2045/14122 ,  H05K3/202 ,  H05K2201/09118 ,  H05K2203/0746 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/107 ,  H05K2203/1476 ,  H05K2203/175 ,  Y10T29/49124

Abstract: A method of forming an electrical circuit for an electrical component comprises the steps of; producing an electrical circuit from a planar conductive material, the circuit including tracks and tie bars between tracks; over-moulding the electrical circuit ith plastics material leaving tie bars in apertures; and removing the tie bars after the over-moulding process.

Abstract translation: 一种形成电气部件的电路的方法包括以下步骤： 从平面导电材料制造电路，该电路包括轨道之间的轨道和连杆; 将塑料材料的电路过度模制成孔，留下拉杆; 并且在过度模制过程之后移除连杆。