Abstract:
A modular interconnection system in the form of a releasable modular interconnect is provided. The releasable modular interconnect may include a substrate with a plurality of releasable contact regions, where each releasable contact region may be positioned to overlay a respective terminal of a power cell. The releasable modular interconnect may also include at least one conductive interconnect member affixed to the substrate, where the conductive interconnect member includes at least a one conductive releasable contact disposed within a releasable contact region of the substrate. The conductive releasable contact may be positioned to form a releasable electrical connection with a terminal of a power cell when a force is applied to the first releasable contact region in a direction toward the terminal of the power cell. Additional and related methods and apparatuses are also provided.
Abstract:
Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.
Abstract:
A solar cell panel is discussed. The solar cell panel includes a plurality of solar cells each including a substrate and an electrode part positioned on a surface of the substrate, an interconnector for electrically connecting at least one of the plurality of solar cells to another of the plurality of solar cells, and a conductive adhesive film including a resin and a plurality of conductive particles dispersed in the resin. The conductive adhesive film is positioned between the electrode part of the at least one of the plurality of solar cells and the interconnector to electrically connect the electrode part of the at least one of the plurality of solar cells to the interconnector. A width of the interconnector is equal to or greater than a width of the conductive adhesive film.
Abstract:
Thin film photovoltaic cells and strings of cells may be electrically joined in series. More specifically, electrical contacts between photovoltaic cells may be formed by positioning the cells between a pair of interconnection substrates, each of which includes a conductive grid. By positioning the cells appropriately between the substrates, an electrical connection is formed between one polarity of a given cell and the opposite polarity of an adjacent cell.
Abstract:
Embodiments of the invention contemplate the formation of a solar cell module comprising an array of interconnected solar cells that are formed using an automated processing sequence that is used to form a novel solar cell interconnect structure. In one embodiment, the module structure described herein includes a patterned adhesive layer that is disposed on a backsheet to receive and bond a plurality of patterned conducting ribbons thereon. The bonded conducting ribbons are then used to interconnect an array of solar cell devices to form a solar cell module that can be electrically connected to external components that can receive the solar cell module's generated electricity.
Abstract:
The invention relates to a deformable display, more in particular a flexible, stretchable, and transparent deformable display based on light-emitting elements such as for example light-emitting diodes (LEDs). The invention also relates to the use and applications of such deformable display, including systems and methods making use of such deformable display. In addition the invention relates to a flexible, stretchable and transparent display being deformable in real-time while maintaining deformability.
Abstract:
Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.
Abstract:
A flexible printed circuit for concentrated photovoltaics includes: a conductive layer to which a power generating element is connected; an insulating layer having an insulating property; and a reinforcing layer for reinforcing the insulating layer, the conductive layer, the insulating layer, and the reinforcing layer being joined together in this order. In the flexible printed circuit, the reinforcing layer is formed of a material identical to that of the conductive layer.
Abstract:
Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.
Abstract:
A photovoltaic module includes: a flexible printed circuit; and a plurality of power generating elements mounted on the flexible printed circuit, wherein the flexible printed circuit includes a turning portion, and strip-shaped portions of the flexible printed circuit which are located on opposite sides of the turning portion are aligned so as to oppose each other.