Speed reducer and motor with speed reducer

    公开(公告)号:US12264726B1

    公开(公告)日:2025-04-01

    申请号:US18656526

    申请日:2024-05-06

    Abstract: A speed reducer includes a casing, a crankshaft, and a speed reducer main body. The crankshaft has a rotation support part rotatably supported by the casing and an eccentric part eccentric with respect to the rotation support part. The speed reducer main body has an engagement part engaged with an outer circumferential surface of the eccentric part, decelerates rocking rotation of the eccentric part received by the engagement part, and outputs the decelerated rotation to outside. The crankshaft is provided with a flange part protruding to an outward side in a radial direction from an end part of the rotation support part on the eccentric part side and abutting an end surface of the engagement part in an axial direction. The flange part is formed such that a center thereof coincides with a center of the eccentric part in a direction orthogonal to the axial direction.

    Remote control system
    73.
    发明授权

    公开(公告)号:US12264052B2

    公开(公告)日:2025-04-01

    申请号:US17702747

    申请日:2022-03-23

    Inventor: Akira Uro

    Abstract: A remote control system allows a forklift to be operated remotely in an intuitive and easy way even when an obstacle is present between the forklift and the object. The remote control system includes a guidance route display section that displays on a display unit a guidance route connecting the forklift and the object. The guidance route display section is configured to display a guidance route straightly connecting the forklift and the object if a judgement section judges that an obstacle is not present, or, if the judgement section judges that an obstacle is present, display a guidance route connecting the forklift and the object in a manner of avoiding the obstacle.

    Pixel reading device and pixel reading method

    公开(公告)号:US12262135B2

    公开(公告)日:2025-03-25

    申请号:US18320998

    申请日:2023-05-22

    Abstract: A pixel reading device, which includes a first capacitor, a second capacitor, a voltage generating circuit, and an analog front-end (AFE) circuit, is provided. A first terminal of the first capacitor is coupled to a fingerprint sensing pixel to receive a sensing voltage. A first terminal of the second capacitor is coupled to a second terminal of the first capacitor. The voltage generating circuit provide a compensation voltage to a second terminal of the second capacitor. During a sensing period of the fingerprint sensing pixel, the compensation voltage is at an initial level. During a level reading period of the fingerprint sensing pixel, the compensation voltage is pulled up from the initial level to a compensation level to compensate a common mode component of the sensing voltage. An input terminal of the AFE circuit is coupled to the second terminal of the first capacitor.

    Information processing apparatus and method and non-transitory computer readable medium

    公开(公告)号:US12261710B2

    公开(公告)日:2025-03-25

    申请号:US17700512

    申请日:2022-03-22

    Inventor: Hirooki Oka

    Abstract: An information processing apparatus includes a processor configured to: obtain, during an online meeting, when a participant has left halfway through the online meeting, an absent period of the participant and a remaining time of the online meeting, the absent period being a period of time for which the participant is absent after the participant has left the online meeting, the remaining time being a time from when the participant returns to the online meeting until an end time of the online meeting, the online meeting being a meeting conducted via a communication network; and switch a format of content presentation information to be presented to the participant having left halfway through the online meeting in accordance with a combination of the obtained absent period and the obtained remaining time, the content presentation information being information on content of the online meeting during the absent period of the participant.

    Wire bonding apparatus
    78.
    发明授权

    公开(公告)号:US12261148B2

    公开(公告)日:2025-03-25

    申请号:US18008179

    申请日:2021-06-01

    Applicant: SHINKAWA LTD.

    Inventor: Shigeru Hayata

    Abstract: A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the optical system to be moved along a two-dimensional plane intersecting a direction of reciprocation, the base having the wire bonding unit attached thereto. The wire bonding unit is attached to a first portion of the base, and the optical system XY-stage is attached to a second portion of the base which is separate from the first portion.

    Semiconductor structure including thermal enhanced bonding structure

    公开(公告)号:US12261142B2

    公开(公告)日:2025-03-25

    申请号:US18489016

    申请日:2023-10-18

    Abstract: A structure including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first bonding structure. The first bonding structure includes a first dielectric layer and first conductors embedded in the first dielectric layer. The second semiconductor die includes a second bonding structure. The second bonding structure includes a second dielectric layer and second conductors embedded in the second dielectric layer. The first dielectric layer is in contact with the second dielectric layer, and the first conductors are in contact with the second conductors. Thermal conductivity of the first dielectric layer and the second dielectric layer is greater than thermal conductivity of silicon dioxide.

    Electronic component transfer apparatus, electronic component transfer method, and method of manufacturing a light-emitting diode panel

    公开(公告)号:US12261071B2

    公开(公告)日:2025-03-25

    申请号:US17699168

    申请日:2022-03-20

    Abstract: An electronic component transfer apparatus is configured to transfer an electronic component on a flexible carrier to a target substrate. The electronic component transfer apparatus includes a first frame, a second frame, an abutting component, an actuating mechanism, an energy generating device, an image capture device, and a data processing module. The first frame is configured to carry the flexible carrier. The second frame is configured to carry the target substrate. The abutting component is disposed adjacent to the flexible carrier. The actuating mechanism is configured to actuate the abutting component, so that the abutting end of the abutting component abuts against the flexible carrier. The energy generating device generates an energy beam. The image capture device captures an image through the abutting component. The data processing module receives and computes the image to determine whether to adjust the relative position between the abutting end and the flexible carrier.

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