Patent search ap:"Peter A Gruber" Page 8

71.

发明申请
Techniques For Forming Solder Bump Interconnects 有权
Title translation: 形成焊接凸块互连的技术

公开(公告)号：US20090072392A1

公开(公告)日：2009-03-19

申请号：US11856831

申请日：2007-09-18

Applicant: Bing Dang , Peter A. Gruber , Luc Guerin , Chirag S. Patel

Inventor： Bing Dang , Peter A. Gruber , Luc Guerin , Chirag S. Patel

IPC: H01L23/52 , H01L21/44

CPC classification number: B23K1/0016 , B23K3/0623 , B23K2101/40 , H01L24/11 , H01L2224/11003 , H01L2224/11334 , H01L2224/16225 , H01L2924/00013 , H01L2924/01019 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2224/29099 , H01L2924/00

Abstract: Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer.

Abstract translation: 通过执行几个步骤在晶片的附接点上形成互连。在半导体衬底中形成具有预定形状的多个空腔。然后用互连材料填充这些空腔以形成互连。互连随后连接到晶片的附接点。

72.

发明申请
Methods of Creating Molds of Variable Solder Volumes for Flip Attach 审中-公开
Title translation: 用于翻转附件的可变焊料体积模具的制造方法

公开(公告)号：US20090001248A1

公开(公告)日：2009-01-01

申请号：US11844070

申请日：2007-08-23

Applicant: Matthew J. Farinelli , Steven Cordes , Donna S. Nielsen , Samuel Roy McKnight , Jay S. Chey , Peter A. Gruber , Joanna Rosner

Inventor： Matthew J. Farinelli , Steven Cordes , Donna S. Nielsen , Samuel Roy McKnight , Jay S. Chey , Peter A. Gruber , Joanna Rosner

IPC: B22C9/00

CPC classification number: H05K3/3457 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1308 , H01L2224/13147 , H01L2224/13171 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H05K2203/0113 , H05K2203/0338 , H01L2924/00

Abstract: A solder mold includes a substrate and a plurality of cavities for holding solder to be transferred to an integrated circuit. The plurality of cavities comprises cavities of at least two different volumes.

Abstract translation: 焊模包括基板和多个用于保持待传送到集成电路的焊料的空腔。多个空腔包括至少两个不同体积的空腔。

73.

发明授权
Fill head for injection molding of solder 失效
Title translation: 填充头用于注射成型焊料

公开(公告)号：US07410092B2

公开(公告)日：2008-08-12

申请号：US11409233

申请日：2006-04-21

Applicant: Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

Inventor： Steven A. Cordes , Peter A. Gruber , John U. Knickerbocker , James L. Speidell

IPC: B23K31/02

CPC classification number: B23K3/0638 , B23K1/20 , B23K2101/40 , H01L24/11 , H01L24/742 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00

Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种用于将导电接合材料注射成表面中的多个空腔的系统，方法和装置。该方法包括将填充头与表面对准。模具包括多个空腔。该方法还包括将填充头与表面实质接触。至少第一气体围绕填充头的第一区域引导。所述至少第一气体具有高于位于储存器中的导电接合材料的熔点的温度，从而将导电接合材料保持在熔融状态。导电接合材料从表面压出填料头。导电接合材料被提供到与填充头附近的至少一个空腔同时的多个空腔的至少一个空腔中。

74.

发明授权
Techniques for forming interconnects 有权
Title translation: 形成互连的技术

公开(公告)号：US07348270B1

公开(公告)日：2008-03-25

申请号：US11625449

申请日：2007-01-22

Applicant: David H. Danovitch , Mukta G. Farooq , Peter A. Gruber , John U. Knickerbocker , George R. Proto , Da-Yuan Shih

Inventor： David H. Danovitch , Mukta G. Farooq , Peter A. Gruber , John U. Knickerbocker , George R. Proto , Da-Yuan Shih

IPC: H01L21/44

CPC classification number: H01L24/11 , H01L21/6835 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/111 , H01L2224/13099 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/27334 , H01L2224/73104 , H01L2224/83 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2224/11 , H01L2224/03 , H01L2224/27 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556

Abstract: A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect material to form the interconnects, removing the release agent from the mold, and attaching the interconnects to the attachment points of the wafer. An adhesive layer can optionally be deposited in addition to the release layer. The adhesive layer can be used, for example, to bond the chip to a package.

Abstract translation: 用于在晶片的附接点上形成互连的方法包括以下步骤：提供具有预定形状的多个空腔的模具，在空腔的表面上沉积脱模剂，用互连材料填充空腔以形成互连，从模具中除去脱模剂，以及将互连件附接到晶片的附接点。除了剥离层之外，还可任选地沉积粘合剂层。粘合剂层可以用于例如将芯片粘合到包装上。

75.

发明授权
Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold 失效
Title translation: 通过堵塞模具中的通孔的一部分来制造多组分焊料柱的方法

公开(公告)号：US5961032A

公开(公告)日：1999-10-05

申请号：US884977

申请日：1997-06-30

Applicant: James H. Covell, II , Shaji Farooq , Peter A. Gruber , Sudipta K. Ray

Inventor： James H. Covell, II , Shaji Farooq , Peter A. Gruber , Sudipta K. Ray

IPC: B22C9/22 , B23K3/06 , B23K35/02 , H01L21/60 , H01L23/12 , H01L23/50 , H05K3/34 , B23K35/012 , B23K31/002 , B22C9/020

CPC classification number: H05K3/3468 , B22C9/22 , B23K3/0607 , B23K35/0222 , B23K2201/40 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H01L2924/16152 , H01L2924/19105 , H05K2201/0379 , H05K2201/10992 , H05K2203/0113 , H05K2203/0338 , H05K2203/128 , H05K3/3463

Abstract: A method is described for forming solder mounds for attachment to electronic devices. The solder mounds are preferably in the form of columns and comprise a first solder portion and a second solder portion with the two solder portions having different melting points. The solder columns are preferably formed using an injection molding device. The method is directed to the use of a single column mold to form the multi-solder column. In one embodiment, deformable material is used to partially block a portion of the through opening of the mold during a first solder injection process. The deformable material is then removed and the remainder of the through openings of the mold filled with a second molten solder. The multi-solder column is then electrically connected to a substrate by reflowing.

Abstract translation: 描述了用于形成用于附接到电子设备的焊接凸块的方法。焊料块优选为柱状，并且包括第一焊料部分和第二焊料部分，其中两个焊料部分具有不同的熔点。焊料柱优选使用注射成型装置形成。该方法涉及使用单柱模具来形成多焊料柱。在一个实施例中，可变形材料用于在第一次焊接注入过程期间部分地阻挡模具的通孔的一部分。然后去除可变形材料，并且模具的通孔的其余部分填充有第二熔融焊料。然后通过回流将多焊料柱电连接到衬底。

76.

发明授权
Thermal joint 失效
Title translation: 热接头

公开(公告)号：US5291371A

公开(公告)日：1994-03-01

申请号：US515906

申请日：1990-04-27

Applicant: Peter A. Gruber , Arthur R. Zingher

Inventor： Peter A. Gruber , Arthur R. Zingher

IPC: H01L21/52 , F28F13/00 , H01L23/36 , H01L23/373 , H01L23/433 , H05K7/20

CPC classification number: H01L23/433 , F28F13/00 , H01L23/3736 , H01L23/3737 , F28F2013/006 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01077 , H01L2924/01322 , H01L2924/1305

Abstract: A thermal joint for transferring heat from a first object to a second object contains a first relatively thick layer of high bulk thermal conductivity material and a second relatively thin layer of lubricant. In a preferred embodiment an anti-adhesion coating is also present in the joint. The thermal joint completely fills the gap between the first and second objects while enabling relative sliding motion to compensate for any lateral distortion.

Abstract translation: 用于将热量从第一物体传递到第二物体的热接头包含第一相对厚的高体积导热材料层和第二相对较薄的润滑剂层。在优选实施例中，接合处也存在抗粘附涂层。热接头完全填充第一和第二物体之间的间隙，同时实现相对滑动以补偿任何横向变形。

77.

发明授权
Apparatus for applying solder to semiconductor chips using decals with aperatures present therein 有权
Title translation: 使用存在于其中的温度的贴花来将焊料施加到半导体芯片的装置

公开(公告)号：US08272120B2

公开(公告)日：2012-09-25

申请号：US13186815

申请日：2011-07-20

Applicant: Peter A. Gruber , Jae-woong Nah

Inventor： Peter A. Gruber , Jae-woong Nah

IPC: B23P19/00

CPC classification number: H01L24/29 , H01L21/486 , H01L23/49827 , H01L24/05 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/743 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05557 , H01L2224/05599 , H01L2224/131 , H01L2224/16237 , H01L2224/16238 , H01L2224/27003 , H01L2224/271 , H01L2224/2732 , H01L2224/29006 , H01L2224/29015 , H01L2224/29076 , H01L2224/29083 , H01L2224/291 , H01L2224/29101 , H01L2224/2929 , H01L2224/29299 , H01L2224/32013 , H01L2224/32059 , H01L2224/3207 , H01L2224/73204 , H01L2224/743 , H01L2224/83101 , H01L2224/83203 , H01L2224/83345 , H01L2224/83365 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , Y10T29/41 , Y10T29/5313 , Y10T29/53178 , H01L2924/01014 , H01L2924/00 , H01L2224/29099 , H01L2224/29199

Abstract: An apparatus for applying solder to semiconductor chips is provided that employs a plurality of apertured decals to define areas for engaging solder on a semiconductor chip. Each of the plurality of decals includes an upper, center and bottom layer having apertures present therethrough. The apparatus fills the apertures with solder. The upper and bottom layers of the apertured decals are removed to provide solder portions projecting from the center layer. The apparatus provides a station for applying an adhesive layer to the exposed surfaces of the center layer having the solder portions projecting therefrom. The apparatus includes a station for contacting the solder and adhesive to the semiconductor chip. The apparatus also includes a separating structure for detaching the portion of the center layer that is in contacting to the semiconductor chip through the solder.

Abstract translation: 提供了一种用于向半导体芯片施加焊料的装置，其采用多个有孔贴花来限定用于接合半导体芯片上的焊料的区域。多个贴花中的每一个包括具有穿过其中的孔的上部，中心和底部层。该装置用焊料填充孔。去除多孔贴花的上层和底层以提供从中心层突出的焊接部分。该装置提供了一种用于将粘合剂层施加到具有从其突出的焊料部分的中心层的暴露表面的工位。该装置包括用于将焊料和粘合剂接触到半导体芯片的工位。该装置还包括分离结构，用于通过焊料分离与半导体芯片接触的部分中心层。

78.

发明授权
Sprocket opening alignment process and apparatus for multilayer solder decal 失效
Title translation: 用于多层焊料贴花的链轮开口对准工艺和装置

公开(公告)号：US08268719B2

公开(公告)日：2012-09-18

申请号：US12983292

申请日：2011-01-01

Applicant: Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih

Inventor： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih

IPC: H01L21/44

CPC classification number: H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05571 , H01L2224/11003 , H01L2224/1111 , H01L2224/1131 , H01L2224/11849 , H01L2224/131 , H01L2924/0002 , H01L2924/14 , Y10T29/49149 , H01L2924/00012 , H01L2924/014 , H01L2224/05552

Abstract: A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process.

Abstract translation: 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。本发明还包括用于执行该过程的装置。