公开(公告)号：US20220178966A1

公开(公告)日：2022-06-09

申请号：US17677847

申请日：2022-02-22

Applicant: Intel Corporation

Inventor： Pooya Tadayon

IPC: G01R1/067 ,  G01R31/28 ,  G01R1/073

Abstract: An apparatus an apparatus comprising: a substrate having a plane; and an array of at least one conductive probe having a base affixed to the substrate, the at least one conductive probe having a major axis extending from the plane of the substrate and terminating at a tip, wherein the one or more conductive probes comprise at least three points that are non-collinear.

公开(公告)号：US11204555B2

公开(公告)日：2021-12-21

申请号：US15857308

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Pooya Tadayon

IPC: G03F7/20 ,  H01L27/00 ,  G03F7/30 ,  B05C3/04

Abstract: An apparatus, comprising at least one vessel having a bottom and at least one sidewall extending from the bottom, wherein the at least one sidewall encloses an interior of the at least one vessel, a shaft has a proximal end and a distal end, wherein the distal end of the shaft extends into the interior of the at least one vessel, wherein the proximal end of the shaft is coupled to a motor, at least one support structure which extends laterally from the shaft; and a substrate attachment fixture on a distal end of the at least one support structure, wherein the at least one support structure and the substrate attachment fixture are within the interior of the at least one vessel.

公开(公告)号：US20210351108A1

公开(公告)日：2021-11-11

申请号：US17030137

申请日：2020-09-23

Applicant: Intel Corporation

Inventor： Paul Diglio ,  Pooya Tadayon ,  David Shia

IPC: H01L23/473

Abstract: Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.

公开(公告)号：US20210239734A1

公开(公告)日：2021-08-05

申请号：US17174191

申请日：2021-02-11

Applicant: Intel Corporation

Inventor： Joe Walczyk ,  Pooya Tadayon

IPC: G01R1/067 ,  G01R3/00 ,  B81B7/02 ,  H01L23/00 ,  G01R31/26

Abstract: A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.

公开(公告)号：US20210175192A1

公开(公告)日：2021-06-10

申请号：US16703298

申请日：2019-12-04

Applicant: Intel Corporation

Inventor： Brennen K. Mueller ,  Adel Elsherbini ,  Mauro Kobrinsky ,  Johanna Swan ,  Shawna Liff ,  Pooya Tadayon

IPC: H01L23/00

Abstract: An Integrated Circuit (IC) device comprising a first component, the first component comprising a first dielectric and a plurality of adjacent first interconnect structures within the first dielectric. The IC device comprising a second component, the second component comprising a second dielectric and a plurality of adjacent second interconnect structures within the second dielectric. A first of the second interconnect structures is in direct contact with a first of the first interconnect structures at a bond interface between the first and second components. A second of the first interconnect structures is set back a distance from a plane of the bond interface.

公开(公告)号：US20210088554A1

公开(公告)日：2021-03-25

申请号：US17111298

申请日：2020-12-03

Applicant: Intel Corporation

Inventor： Pooya Tadayon ,  Mark Bohr ,  Joe Walczyk

IPC: G01R1/073 ,  H01L23/48 ,  H01L23/32 ,  H01L21/48 ,  H01L21/027 ,  G01R31/28 ,  H01L23/14

Abstract: An electrical-test apparatus is provided, which includes a MEMS array. In an example, the MEMS array comprises a plurality of tester interconnect structures cantilevered from first terminals on a first side of a substrate. The tester interconnect structures may have a first diameter. In an example, the MEMS array comprises a plurality of through-substrate vias that extend through the substrate, the vias having a second diameter larger than the first diameter. In an example, individual ones of the vias electrically couple individual ones of the tester interconnect structures to corresponding ones of second terminals on a second side of the substrate.

公开(公告)号：US20190310287A1

公开(公告)日：2019-10-10

申请号：US16461387

申请日：2016-12-23

Applicant: Intel Corporation

Inventor： Pooya Tadayon ,  David Shia

IPC: G01R1/073 ,  G01R31/28

Abstract: An embodiment includes an apparatus comprising: a substrate including a surface that comprises first, second, and third apertures; and first, second, and third probes comprising proximal ends that are respectively included within and project from the first, second, and third apertures; wherein the first, second, and third probes: (a)(i) intersect a plane that is generally coplanar with the surface, (a)(ii) include distal ends configured to contact electrical contacts of a device under test (DUT), and (a)(iii) are generally linear and each include a major axis that is non-orthogonal to the plane. Other embodiments are described herein.

公开(公告)号：US20190204744A1

公开(公告)日：2019-07-04

申请号：US15857308

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Pooya Tadayon

IPC: G03F7/20

CPC classification number: G03F7/2041

Abstract: An apparatus, comprising at least one vessel having a bottom and at least one sidewall extending from the bottom, wherein the at least one sidewall encloses an interior of the at least one vessel, a shaft has a proximal end and a distal end, wherein the distal end of the shaft extends into the interior of the at least one vessel, wherein the proximal end of the shaft is coupled to a motor, at least one support structure which extends laterally from the shaft; and a substrate attachment fixture on a distal end of the at least one support structure, wherein the at least one support structure and the substrate attachment fixture are within the interior of the at least one vessel.

公开(公告)号：US20190203370A1

公开(公告)日：2019-07-04

申请号：US15857362

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Joe Walczyk ,  Pooya Tadayon ,  Andrew Hoitink ,  Tanner Schulz

IPC: C25D5/02 ,  C25D17/00 ,  H05K3/18 ,  H05K13/00

CPC classification number: C25D5/026 ,  C25D17/00 ,  H05K3/188 ,  H05K13/0015

Abstract: A micronozzle assembly, comprising a reservoir, an array of structures comprising micronozzles, a porous structure positioned between the reservoir and the array, and an electrode within the reservoir, wherein the electrode comprises any of a mesh, a frame along the perimeter of the cavity of the reservoir, or a rod extending into a cavity of the reservoir.

公开(公告)号：US09523713B2

公开(公告)日：2016-12-20

申请号：US13903874

申请日：2013-05-28

Applicant: INTEL CORPORATION

Inventor： Youngseok Oh ,  Joe F. Walczyk ,  Jin Yang ,  Pooya Tadayon ,  Ting Zhong

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06783 ,  G01R1/07307 ,  Y10T29/49124

Abstract: Embodiments of the present disclosure are directed to interconnects that include liquid metal, and associated techniques and configurations. The individual interconnects may electrically couple a contact of a printed circuit board (PCB) to a contact of a device under test (DUT). The interconnect may be disposed in or on the PCB. In various embodiments, the interconnect may include a carrier that defines a well (e.g., an opening in the carrier), and the liquid metal may be disposed in the well. In some embodiments, the contact of the DUT, or a contact of an intermediary device, may extend into the well and directly contact the liquid metal. In other embodiments, a flex circuit may be disposed over the well to seal the well. The flex circuit may include a conductive pad to electrically couple the liquid metal to the contact of the DUT. Other embodiments may be described and claimed.

Abstract translation: 本公开的实施例涉及包括液态金属以及相关技术和配置的互连。 各个互连可以将印刷电路板（PCB）的触点电耦合到被测器件（DUT）的触点。 互连可以设置在PCB中或PCB上。 在各种实施例中，互连可以包括限定阱（例如，载体中的开口）的载体，并且液体金属可以设置在阱中。 在一些实施例中，DUT或中间装置的触点的接触可以延伸到井中并直接接触液态金属。 在其他实施例中，柔性电路可以设置在井上以密封井。 柔性电路可以包括用于将液体金属电耦合到DUT的触点的导电焊盘。 可以描述和要求保护其他实施例。