公开(公告)号：US10910322B2

公开(公告)日：2021-02-02

申请号：US16220934

申请日：2018-12-14

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoWang Koo ,  SungWon Cho ,  BongWoo Choi ,  JiWon Lee

IPC: H01L21/00 ,  H01L23/552 ,  H01L21/311 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/66

Abstract: A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.

公开(公告)号：US20200075502A1

公开(公告)日：2020-03-05

申请号：US16116485

申请日：2018-08-29

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： ChangOh Kim ,  KyoungHee Park ,  KyoWang Koo ,  SungWon Cho

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/04 ,  H01L21/56 ,  H01L21/78 ,  H01L25/00 ,  H01L25/065

Abstract: A semiconductor device has a substrate. A lid is disposed over the substrate. An encapsulant is deposited over the substrate. A film mask is disposed over the encapsulant with the lid exposed from the film mask and encapsulant. A conductive layer is formed over the film mask, encapsulant, and lid. The film mask is removed after forming the conductive layer.