公开(公告)号：US20170368829A1

公开(公告)日：2017-12-28

申请号：US15628947

申请日：2017-06-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Kyosuke Toda ,  Yukuo Yamaguchi ,  Mikiya Umeyama ,  Satoshi Oikawa ,  Hiromasa Amma ,  Takuya Iwano ,  Satoshi Kimura ,  Naoko Tsujiuchi ,  Yasushi Iijima

IPC: B41J2/16 ,  B41J2/175 ,  B41J2/14 ,  B01D35/02

CPC classification number: B41J2/1637 ,  B01D35/02 ,  B29C45/14 ,  B29C45/16 ,  B41J2/14024 ,  B41J2/1404 ,  B41J2/14201 ,  B41J2/17513 ,  B41J2/1752 ,  B41J2/17553 ,  B41J2/17563 ,  B41J2002/14403

Abstract: A filter is compressed between facing surfaces of a first configuration component and a second configuration component, and a molten resin is poured in such a compressed state. Injection molding of the first configuration component and the second configuration component, joining of the configuration components, and sealing of the circumference of the filter are performed by a pair of metal molds.

公开(公告)号：US09853203B2

公开(公告)日：2017-12-26

申请号：US14419378

申请日：2013-07-25

Applicant: KONICA MINOLTA, INC.

Inventor： Shinya Matsuda

IPC: H01L41/18 ,  H01L41/08 ,  H01L41/09 ,  H01L41/319 ,  H01L41/187 ,  B41J2/14 ,  H01L41/053 ,  H01L41/316

CPC classification number: H01L41/18 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2202/03 ,  H01L41/053 ,  H01L41/0815 ,  H01L41/0973 ,  H01L41/1875 ,  H01L41/1876 ,  H01L41/316 ,  H01L41/319

Abstract: A piezoelectric element includes, on a base, an underlying layer for controlling crystallinity of a piezoelectric layer, and the piezoelectric layer. The piezoelectric layer includes a crystal with an ABO3-type structure having at least Pb at A sites. In the underlying layer, an interface-with-the-base side is configured including at least Pb and another substance with a different composition rate from that of the piezoelectric layer at the A sites, and a substance with a different composition ratio from that of the piezoelectric layer at B sites. In a layer above the interface-with-the-base side in the underlying layer, the composition rate of the other substance included at the A sites of the underlying layer progressively changes and also the composition ratio of the substance included at the B sites progressively changes, from the interface-with-the-base side toward the interface-with-the-piezoelectric-layer side to approach the composition of the piezoelectric layer.

公开(公告)号：US09840077B2

公开(公告)日：2017-12-12

申请号：US15614889

申请日：2017-06-06

Applicant: SEIKO EPSON CORPORATION

Inventor： Ichiro Asaoka ,  Koichi Morozumi ,  Masato Shimada ,  Akira Kuriki

IPC: B41J2/14 ,  B41J2/16 ,  H01G4/228 ,  H01G4/40 ,  H01G2/02 ,  H01G4/30 ,  H01G4/12

CPC classification number: H01G4/30 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2002/14241 ,  H01G2/02 ,  H01G4/1245 ,  H01G4/228 ,  H01G4/40

Abstract: An electronic device includes a capacitor that is configured with a first electrode layer, an insulating layer, and a second electrode layer being formed in the order listed herein. At least one end of the capacitor is defined by an end of the second electrode layer. The insulating layer is provided so as to extend to a non-element region that is on the outside of one end of the capacitor. The insulating layer under the non-element region is formed thinner than the insulating layer under the capacitor. A difference between the thickness of the insulating layer under the non-element region and the thickness of the insulating layer under the capacitor is equal to or less than 50 nm.

公开(公告)号：US09833994B2

公开(公告)日：2017-12-05

申请号：US15458765

申请日：2017-03-14

Applicant: Hiroshi Nishimura ,  Giang Vo ,  Connor Matsumori

Inventor： Hiroshi Nishimura ,  Giang Vo ,  Connor Matsumori

IPC: B41J2/14

CPC classification number: B41J2/14274 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2/1433 ,  B41J2/18 ,  B41J2002/14419 ,  B41J2202/12

Abstract: An inkjet head that is able to circulate ink. The inkjet head includes a diaphragm plate, a first restrictor plate, one or more chamber plates, a second restrictor plate, and an orifice plate. The orifice plate forms a plurality of nozzles. The chamber plates form a plurality of chambers corresponding with the nozzles, and also form a return manifold for receiving ink from the chambers when circulating the ink through the inkjet head. The diaphragm plate forms a diaphragm that seals the chambers. The first restrictor plate controls a flow of ink between the chambers and the return manifold to circulate the ink through the inkjet head. The second restrictor plate controls the flow of ink between a supply manifold and the chambers.

公开(公告)号：US09821554B2

公开(公告)日：2017-11-21

申请号：US15348634

申请日：2016-11-10

Applicant: SEIKO EPSON CORPORATION

Inventor： Shunya Fukuda

IPC: B41J2/14

CPC classification number: B41J2/14233 ,  B41J2/14201 ,  B41J2/14274 ,  B41J2002/14241 ,  B41J2202/11

Abstract: A liquid ejecting head in which a flow path substrate having a communication hole communicating with a nozzle and a pressure chamber substrate having a space that is a pressure chamber are at least laminated includes: an actuator having an active section that is interposed between electrodes and applies pressure to the pressure chamber. The pressure chamber substrate has a first space positioned in a region corresponding to the active section and a second space positioned nearer to the nozzle than the first space and communicating with the first space among the spaces. The communication hole does not overlap with the first space and overlaps with at least a part of the second space in a lamination direction.

公开(公告)号：US20170305157A1

公开(公告)日：2017-10-26

申请号：US15437190

申请日：2017-02-20

Applicant: TOSHIBA TEC KABUSHIKI KAISHA

Inventor： Meng Fei WONG ,  Ryutaro KUSUNOKI ,  Shuhei YOKOYAMA ,  Ryuichi ARAI

IPC: B41J2/14

CPC classification number: B41J2/14233 ,  B41J2/14201 ,  B41J2002/14459 ,  B41J2002/14491 ,  B41J2202/15

Abstract: According to one embodiment in an ink jet head, the common electrodes for all the actuators, without overlapping with the first wiring pattern formed by individual electrodes, are connected to a second wiring pattern that passes between the outer peripheral portion of piezoelectric bodies, and a third wiring pattern that extends in a direction different from a direction of the second wiring pattern. The first wiring pattern and the third wiring pattern are electrically insulated at intersections thereof.

公开(公告)号：US09789688B2

公开(公告)日：2017-10-17

申请号：US15060211

申请日：2016-03-03

Applicant: SEIKO EPSON CORPORATION

Inventor： Naoya Sato

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1623 ,  B41J2/14 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2/1607 ,  B41J2/161 ,  B41J2/1631 ,  B41J2002/14419 ,  B41J2002/14491 ,  H01L2224/29082 ,  H01L2224/2919

Abstract: A bonding resin that bonds substrates to each other in a state of being spaced with a gap between the substrates is configured by stacking a photosensitive resin and a bonding reinforcement resin which is different from the photosensitive resin, the photosensitive resin is patterned in one substrate, and the bonding reinforcement resin which is stacked on the patterned photosensitive resin has a fillet being a wet-spreading portion or a portion which swells outward from the photosensitive resin.

公开(公告)号：US20170282551A1

公开(公告)日：2017-10-05

申请号：US15632224

申请日：2017-06-23

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/145 ,  B41J25/34

CPC classification number: B41J2/155 ,  B41J2/14 ,  B41J2/1404 ,  B41J2/14129 ,  B41J2/14145 ,  B41J2/14201 ,  B41J2/1433 ,  B41J2/145 ,  B41J2/1603 ,  B41J2/1607 ,  B41J2/1637 ,  B41J25/34 ,  B41J2002/14419 ,  B41J2202/20

Abstract: A print bar may include a mounting structure and a printhead mounted to the mounting structure. The printed may include multiple printhead dies molded into a monolithic body and arranged parallel to one another in the body. The body may have multiple channels therein through which printing fluid may pass directly to the dies.

公开(公告)号：US09773963B2

公开(公告)日：2017-09-26

申请号：US15044181

申请日：2016-02-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kazunobu Irie ,  Futoshi Ohtsuka ,  Takeshi Kita ,  Motoi Hatanaka

IPC: B41J2/045 ,  H01L41/047 ,  H01L41/053 ,  B23K31/02 ,  B41J2/14 ,  B41J2/16 ,  B23K1/00 ,  H01L41/29 ,  H01L41/08 ,  H01L41/083 ,  H01L41/338 ,  H01L41/273

CPC classification number: H01L41/047 ,  B23K1/0016 ,  B23K31/02 ,  B41J2/14201 ,  B41J2/14209 ,  B41J2/14274 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2002/14491 ,  H01L41/0475 ,  H01L41/053 ,  H01L41/08 ,  H01L41/083 ,  H01L41/273 ,  H01L41/29 ,  H01L41/338

Abstract: A connection method includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.

公开(公告)号：US20170259568A1

公开(公告)日：2017-09-14

申请号：US15260218

申请日：2016-09-08

Applicant: STMICROELECTRONICS, INC. ,  STMICROELECTRONICS S.R.L.

Inventor： Simon Dodd ,  Andrea Nicola Colecchia

IPC: B41J2/14 ,  H01L23/00

CPC classification number: H01L24/09 ,  B41J2/14072 ,  B41J2/14201 ,  B41J2/1753 ,  B41J2/17546 ,  B41J2/17553 ,  B41J2002/14491 ,  H01L2224/0401

Abstract: Embodiments of the present disclosure are directed to a microfluidic delivery system that includes a microfluidic semiconductor die coupled to a flexible interconnect substrate to form an assembly. At least one embodiment is directed to a semiconductor die having an active surface that includes a layout that has electrically active bond pads along one side of the active surface of the die. A second side of the active surface of the die includes one or more mechanical pads.