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    METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS
    72.
    发明申请
    METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS 有权
    使用筛选和断开过程的光学设备的波长定型包装的方法和装置

    公开(公告)号：US20080191221A1

    公开(公告)日：2008-08-14

    申请号：US12029899

    申请日：2008-02-12

    Applicant: Xiao Charles Yang ,  Dongmin Chen ,  Philip Chen

    Inventor： Xiao Charles Yang ,  Dongmin Chen ,  Philip Chen

    IPC: H01L33/00

    CPC classification number: B81C1/00873 ,  B81B2201/047 ,  H01L24/05 ,  H01L33/483 ,  H01L2224/04042 ,  H01L2224/48463 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

    Abstract translation: 一种多层集成光电路装置。 该器件具有包括其上的至少一个集成电路芯片的第一衬底，其具有单元区域和外围区域。 优选地，外围区域具有接合焊盘区域，其具有一个或多个接合焊盘和围绕一个或多个接合焊盘的每一个的抗静电区域。 该装置具有第二基板，其上具有至少一个或多个偏转装置，其上连接到第一基板。 至少一个或多个接合焊盘暴露在第一衬底上。 该装置具有覆盖第二基板的透明构件，同时形成空腔区域以允许一个或多个偏转装置在空腔区域的一部分内移动以形成夹层结构，该夹层结构包括第一基板的至少一部分， 第二基板和透明部件的一部分。 一个或多个接合焊盘和抗静电区域被暴露，同时一个或多个偏转装置保持在空腔区域的部分内。

    Patterning of mechanical layer in MEMS to reduce stresses at supports
    73.
    发明授权
    Patterning of mechanical layer in MEMS to reduce stresses at supports 失效
    MEMS中机械层的图案化，以减少支撑件的应力

    公开(公告)号：US07405863B2

    公开(公告)日：2008-07-29

    申请号：US11445529

    申请日：2006-06-01

    Applicant: Ming-Hau Tung ,  Wonsuk Chung

    Inventor： Ming-Hau Tung ,  Wonsuk Chung

    IPC: G02B26/00 ,  G02F1/03

    CPC classification number: G02B26/001 ,  B81B2201/047 ,  B81C1/00666 ,  B81C2201/0109

    Abstract: A method of fabricating a MEMS device includes the formation of support posts having horizontal wing portions at the edges of the post. A mechanical layer is deposited over the support posts and portions of the mechanical layer overlying portions of the support post other than the horizontal wing portions are etched away. A resultant MEMS device includes a mechanical layer overlying at least a portion of the horizontal wing portions of the underlying support structures.

    Abstract translation: 制造MEMS器件的方法包括在柱的边缘处形成具有水平翼部的支撑柱。 机械层沉积在支撑柱上，并且除了水平翼部分之外的覆盖支撑柱的部分的机械层的部分被蚀刻掉。 所得到的MEMS器件包括覆盖下面的支撑结构的水平翼部分的至少一部分的机械层。

    Self-packaged optical interference display device having anti-stiction bumps, integral micro-lens, and reflection-absorbing layers
    76.
    发明授权
    Self-packaged optical interference display device having anti-stiction bumps, integral micro-lens, and reflection-absorbing layers 有权
    具有抗静电凸块，整体微透镜和反射吸收层的自包装光学干涉显示装置

    公开(公告)号：US07370185B2

    公开(公告)日：2008-05-06

    申请号：US10428247

    申请日：2003-04-30

    Applicant: Arthur Piehl ,  James R. Przybyla ,  Adam L Ghozeil ,  Eric T. Martin

    Inventor： Arthur Piehl ,  James R. Przybyla ,  Adam L Ghozeil ,  Eric T. Martin

    IPC: G02B26/00 ,  G02F1/03

    CPC classification number: G09G3/3466 ,  B81B3/0008 ,  B81B2201/047 ,  G02B1/11 ,  G02B26/001 ,  G09G2300/06

    Abstract: An electronic device of an embodiment of the invention is disclosed that at least partially displays a pixel of a display image. The device includes a first reflector and a second reflector defining an optical cavity therebetween that is selective of a visible wavelength at an intensity. The device includes a mechanism to allow optical properties of the cavity to be varied such that the visible wavelength and/or the intensity are variably selectable in correspondence with the pixel of the displayable image. The device also includes one or more transparent deposited films, one or more absorbing layers, an integral micro-lens, and/or one or more anti-stiction bumps. The deposited films are over one of the reflectors, for self-packaging of the device. The absorbing layers are over one of the reflectors, to reduce undesired reflections. The integral micro-lens is over one of the reflectors, and the anti-stiction bumps are between the reflectors.

    Abstract translation: 公开了本发明的实施例的电子设备，其至少部分地显示显示图像的像素。 该装置包括第一反射器和第二反射器，其在其间限定光学腔，其具有在强度下的可见波长的选择性。 该装置包括允许空腔的光学特性变化的机构，使得可视波长和/或强度可变地与可显示图像的像素相对应地选择。 该装置还包括一个或多个透明沉积膜，一个或多个吸收层，整体微透镜和/或一个或多个抗静电凸块。 沉积的膜位于一个反射器上，用于器件的自包装。 吸收层在一个反射器上方，以减少不期望的反射。 整体微透镜超过一个反射器，并且抗静电凸块在反射器之间。

    Systems and methods for integration of heterogeneous circuit devices
    77.
    发明授权
    Systems and methods for integration of heterogeneous circuit devices 失效

    公开(公告)号：US07341930B2

    公开(公告)日：2008-03-11

    申请号：US10990711

    申请日：2004-11-17

    Applicant: Jingkuang Chen ,  Yi Su

    Inventor： Jingkuang Chen ,  Yi Su

    IPC: H01L21/00

    CPC classification number: B81C1/00246 ,  B81B2201/047 ,  B81C2203/0735 ,  H01L21/823493 ,  H01L21/823892 ,  H01L21/84 ,  H01L27/0617 ,  H01L27/1203

    Abstract: A heterogeneous device comprises a substrate and a plurality of heterogeneous circuit devices defined in the substrate. In embodiments, a plurality of heterogeneous circuit devices are integrated by successively masking and ion implanting the substrate. The heterogeneous device may further comprise at least one microelectromechanical system-based element and/or at least one photodiode. In embodiments, the heterogeneous circuit devices comprise at least one CMOS transistor and at least one DMOS transistor. In embodiments, the substrate comprises a layer of silicon or a layer of p-type silicon. In other embodiments, the substrate comprises a silicon-on-insulator wafer comprising a single-crystal-silicon layer or a single-crystal-P-silicon layer, a substrate and an insulator layer therebetween.

    DESICCANT IN A MEMS DEVICE
    78.
    发明申请
    DESICCANT IN A MEMS DEVICE 有权
    在MEMS器件中的优点

    公开(公告)号：US20070268581A1

    公开(公告)日：2007-11-22

    申请号：US11750279

    申请日：2007-05-17

    Applicant: Lauren Palmateer

    Inventor： Lauren Palmateer

    IPC: G02B7/18

    CPC classification number: G02B26/001 ,  B81B7/0038 ,  B81B2201/047 ,  B81B2203/053 ,  B81C2203/019 ,  G02B26/0833

    Abstract: A package structure and method for packaging a MEMS device is described. In one embodiment, the MEMS base device can include a substrate having a MEMS device formed thereon, a backplate, an exposed or activated desiccant disposed between the backplate and the transparent substrate, and a cover at least partially encapsulating said desiccant. In another embodiment, a MEMS display device can be manufactured by contacting the substrate and/or backplate with a cover which at least partially encapsulates a desiccant, joining the backplate and the substrate to form a package, and exposing or activating the desiccant.

    Abstract translation: 描述了用于封装MEMS器件的封装结构和方法。 在一个实施例中，MEMS基底器件可以包括其上形成有MEMS器件的衬底，背板，设置在背板和透明衬底之间的暴露或激活的干燥剂，以及至少部分地封装所述干燥剂的盖。 在另一个实施例中，可以通过使衬底和/或背板接触至少部分地包封干燥剂，连接背板和衬底以形成封装以及暴露或激活干燥剂的盖来制造MEMS显示装置。

    Structure of a micro electro mechanical system and the manufacturing method thereof
    79.
    发明授权
    Structure of a micro electro mechanical system and the manufacturing method thereof 有权
    微机电系统的结构及其制造方法

    公开(公告)号：US07291921B2

    公开(公告)日：2007-11-06

    申请号：US10810660

    申请日：2004-03-29

    Applicant: Wen-Jian Lin

    Inventor： Wen-Jian Lin

    IPC: H01L29/40

    CPC classification number: B81C1/00801 ,  B81B2201/047 ,  G02B26/001 ,  G02B26/0841

    Abstract: A structure of a micro electro mechanical system and a manufacturing method are provided, the structure and manufacturing method is adapted for an optical interference display cell. The structure of the optical interference display cell includes a first electrode, a second electrode and posts. The second electrode comprises a conductive layer covered by a material layer and is arranged about parallel with the first electrode. The support is located between the first plate and the second plate and a cavity is formed. In the release etch process of manufacturing the structure, the material layer protects the conductive layer from the damage by an etching reagent. The material layer also protects the conductive layer from the damage from the oxygen and moisture in the air.

    Abstract translation: 提供微电子机械系统的结构和制造方法，其结构和制造方法适用于光学干涉显示单元。 光学干涉显示单元的结构包括第一电极，第二电极和柱。 第二电极包括由材料层覆盖的导电层并且与第一电极大致平行地布置。 支撑件位于第一板和第二板之间，并形成空腔。 在制造结构的释放蚀刻工艺中，材料层保护导电层免受蚀刻试剂的损伤。 材料层还保护导电层免受空气中的氧气和水分的损害。

    Process for producing microelectromechanical components and a housed microelectromechanical component
    80.
    发明授权
    Process for producing microelectromechanical components and a housed microelectromechanical component 失效
    用于生产微电子机械部件和容纳的微机电部件的方法

    公开(公告)号：US07285834B2

    公开(公告)日：2007-10-23

    申请号：US11378962

    申请日：2006-03-18

    Applicant: Jürgen Leib ,  Florian Bieck

    Inventor： Jürgen Leib ,  Florian Bieck

    IPC: H01L27/14 ,  H01L21/00

    CPC classification number: B81C1/00301 ,  B81B2201/047 ,  B81B2207/096

    Abstract: A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at least one microelectromechanical element. The process includes the step of providing at least one conductive passage into the substrate, connecting the first side to the second side, and securing at least one support to the first side of the substrate, with the at least one electrically conductive passage uncovered by thinning the substrate material with the mechanical stability being ensured by the support.

    Abstract translation: 一种方法从基板产生微电子机械部件，该基板具有与第一侧基本相反的第一侧和第二侧，并且至少第一侧具有至少一个微机电元件。 该方法包括以下步骤：将至少一个导电通道提供到衬底中，将第一侧连接到第二侧，以及将至少一个支撑件固定到衬底的第一侧，其中至少一个导电通道被薄化覆盖 具有机械稳定性的基板材料由支撑件确保。

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