Optical inspection using controlled illumination and collection polarization

    公开(公告)号:US11796783B2

    公开(公告)日:2023-10-24

    申请号:US17506040

    申请日:2021-10-20

    Abstract: An optical inspection system that may include an illumination optics configured to generate an illumination light beam and to illuminate a sample with the illumination light beam; at least one collection optics configured to collect light from the sample; at least one detector configured to detect at least one detected light beam outputted from the at least one collection optics; multiple polarizers that are configured to (a) set a polarization of the illumination light beam by selectively introducing, under a control of the control unit, at least one illumination optics polarization change, and (b) set a polarization of the at least one detected light beam by selectively introducing, under a control of the control unit, at least one collection optics polarization change. The multiple polarizers may include one or more illumination half-wave plates, one or more quarter-wave plates, and one or more inhomogeneous polarizers.

    Die bonding apparatus and manufacturing method for semiconductor device

    公开(公告)号:US11692947B2

    公开(公告)日:2023-07-04

    申请号:US17378049

    申请日:2021-07-16

    Abstract: A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.

    LIGHT SHEET MICROSCOPE
    79.
    发明申请

    公开(公告)号:US20190212536A1

    公开(公告)日:2019-07-11

    申请号:US16325733

    申请日:2017-08-16

    Inventor: Florian Fahrbach

    Abstract: A light sheet microscope includes an illuminator having a beam source which is designed to direct an illumination beam propagating along an illumination axis onto a sample. A light-sheet generator is designed to generate a light-sheet-like illumination light distribution illuminating the sample in a partial area from the illumination beam. A detection unit has a detector which is designed to capture detection light originating from the partial area of the sample illuminated with the illumination light distribution. The illuminator comprises a beam modulator adapted to illuminate the illumination beam along the illumination axis in such a way that light exposure of the partial area of the sample illuminated by the illumination light distribution varies along the illumination axis.

    Inspection system and method for inspecting a sample by using a plurality of spaced apart beams

    公开(公告)号:US10054551B2

    公开(公告)日:2018-08-21

    申请号:US15134278

    申请日:2016-04-20

    CPC classification number: G01N21/8851 G01N2201/063 G01N2201/105

    Abstract: An inspection system that may include an illumination module that may be configured to scan a sample during multiple scan iterations; wherein during each scan iteration the illumination module scans each beam of a plurality of spaced apart beams along a scan line; a mechanical stage that may be configured to move the sample during the multiple scan iterations; a detection module; and a processor; wherein when the inspection system operates in an interlaced mode, the mechanical stage may be configured to move at a first speed thereby preventing a substantial overlap between scan lines obtained during the multiple scan iterations; wherein when the inspection system operates in a non-interlaced mode: the mechanical stage may be configured to move at a second speed that differs from the first speed thereby introducing an overlap between scan lines of different beams that may be obtained during different scan iterations; the detection module may be configured to generate detection signals in response to a detection of radiation emitted from the sample as a result of each scan line; and wherein the processor may be configured to independently process detection signals relating to different scan lines.

Patent Agency Ranking