公开(公告)号：US20030146421A1

公开(公告)日：2003-08-07

申请号：US10240400

申请日：2002-09-30

Inventor： Yasuhiro Wakizaka ,  Kanji Yuyama

IPC: C09K021/00

CPC classification number: C08L71/126 ,  C08G65/485 ,  C08G2650/60 ,  C08L71/123 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0158 ,  Y10T428/24917

Abstract: This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.

Abstract translation: 本发明提供一种耐火性，绝缘性和粘合性优异且燃烧时不产生有害物质的多层电路板，以及适于获得多层电路基板的固化性组合物。 可固化组合物含有脂环族烯烃聚合物或芳族聚醚聚合物等绝缘树脂，1,3-二烯丙基-5-缩水甘油基异氰脲酸酯等氮型固化剂，磷酸酯酰胺等磷系阻燃剂 ，通过溶液流延法成型成膜。 将如此形成的膜层压在内层板上并固化，得到多层电路基板。

公开(公告)号：US20030108746A1

公开(公告)日：2003-06-12

申请号：US10239723

申请日：2002-12-26

Inventor： Isola Laminate Systems Corp ,  Martin T. Choate ,  Barbara Ormond ,  Michael Nehls ,  Georg Czerny

IPC: B32B027/38

CPC classification number: H05K1/0373 ,  C08K3/016 ,  C08K3/02 ,  C08K5/0066 ,  C08K5/34928 ,  C08K5/523 ,  C08K5/5333 ,  C08K2003/026 ,  C09J7/28 ,  C09J11/06 ,  C09J163/00 ,  C09J2463/00 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2203/122 ,  Y10T428/31511 ,  Y10T428/31529 ,  C08L63/00

Abstract: Fire resistant adhesive resins that include a halogen-free and bromine-free flame retardant ingredient and conductive foils coated with the halogen-free fire resistant adhesive resin coated compositions of this invention as well as printed circuit boards manufactured using the adhesive resin coated conductive foils.

公开(公告)号：US06486235B2

公开(公告)日：2002-11-26

申请号：US09730606

申请日：2000-12-07

Applicant: Nawalage Florence Cooray ,  Koji Tsukamoto ,  Takeshi Ishitsuka

Inventor： Nawalage Florence Cooray ,  Koji Tsukamoto ,  Takeshi Ishitsuka

IPC: B32B1502

CPC classification number: H05K3/4661 ,  H05K1/0373 ,  H05K3/4602 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31515

Abstract: A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.

Abstract translation: 一种卤树脂阻燃绝缘环氧树脂组合物，其包含（1）环氧树脂，（2）环氧树脂固化剂，（3）间苯二酚型磷酸酯，（4）氢氧化铝和（ 5）环氧树脂的固化促进剂。 该组合物在电路板中形成绝缘层之后显示必要的阻燃性能和足够的绝缘性能，经受电镀工艺，并且不会导致形成的绝缘层的渗出。 还公开了包含由环氧树脂组合物形成的绝缘层的阻燃性能的电路板。

公开(公告)号：US20020068173A1

公开(公告)日：2002-06-06

申请号：US09973719

申请日：2001-10-11

Applicant: HITACHI CHEMICAL CO., TLD

Inventor： Nozomu Takano ,  Tomio Fukuda ,  Masato Miyatake

IPC: B32B027/38 ,  C08F008/00

CPC classification number: B32B15/08 ,  C08K9/06 ,  H01L23/145 ,  H01L23/296 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0162 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31663 ,  Y10T428/31721 ,  Y10T428/31862 ,  H01L2924/00

Abstract: An incombustible resin composition in which a silicone oligomer, a metal hydrate and a resin material are contained as essential components, the metal hydrate is 20% by weight or more in the total solids of the resin composition is provided.

Abstract translation: 提供其中含有硅氧烷低聚物，金属水合物和树脂材料作为必要组分的不燃性树脂组合物，其中所述金属水合物的总固体量为树脂组合物的20重量％以上。

公开(公告)号：US06368716B2

公开(公告)日：2002-04-09

申请号：US09909732

申请日：2001-07-20

Applicant: Melvin A. Neiss

Inventor： Melvin A. Neiss

IPC: B32B1710

CPC classification number: H05K3/386 ,  C08L2666/54 ,  C09J125/18 ,  C09J133/068 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0355 ,  Y10T428/31645 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/3175 ,  Y10T428/31797 ,  Y10T428/31913

Abstract: This invention is directed to an adhesive composition comprising: A. 80-98% by weight, based upon the total amount of adhesive dry solids, of at least one latex copolymer comprising: (1) 20-55% by weight, based upon the weight of the copolymer, of at least one brominated aromatic monomer, (2) 5-15% by weight, based upon the weight of the copolymer, of a monomer selected from the group consisting of glycidyl acrylate, glycidyl methacrylate, and mixtures thereof, and (3) 40-60% by weight, based upon the weight of the copolymer, of at least one non-brominated monofunctional(meth)acrylate monomer; (4) 0-10% by weight, based upon the weight of the copolymer, of a monomer selected from the group consisting of acrylonitrile, methacrylonitrile, and mixtures thereof; B. 0-10% by weight, based upon the total amount of adhesive dry solids, of at least one crosslinking agent; C. 1-10% by weight, based upon the total amount of adhesive dry solids, of at least one antimony oxide; and D. 0-15% by weight, based upon the total amount of adhesive dry solids, of at least one viscosity modifier.

Abstract translation: 本发明涉及一种粘合剂组合物，其包含：A。 80-98重量％，基于粘合剂干固体的总量，至少一种胶乳共聚物，其包含：（1）基于共聚物重量的20-55重量％的至少一种溴化芳族单体 ，（2）基于共聚物重量的5-15重量％的选自丙烯酸缩水甘油酯，甲基丙烯酸缩水甘油酯及其混合物的单体，和（3）40-60重量％的基于 至少一种非溴化单官能（甲基）丙烯酸酯单体;（4）基于共聚物重量的0-10％（重量）的选自丙烯腈， 甲基丙烯腈及其混合物; B。 基于粘合剂干固体的总量为0-10重量％的至少一种交联剂; C。 1-10重量％，基于粘合剂干固体的总量，至少一种氧化锑; 和D. 0-15重量％，基于粘合剂干固体的总量，至少一种粘度调节剂。

公开(公告)号：US06337363B1

公开(公告)日：2002-01-08

申请号：US09670719

申请日：2000-09-28

Applicant: Ming-Shi Lee ,  Ching-Jiuh Kang ,  Kuei-Lan Peng

Inventor： Ming-Shi Lee ,  Ching-Jiuh Kang ,  Kuei-Lan Peng

IPC: C08K336

CPC classification number: C08L63/00 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L2666/16

Abstract: The present invention discloses an epoxy resin composition with a non-halogen, non-phosphorus flame retardant, which comprises (a) 100 parts by weight of an epoxy resin; (b) 40-60 parts by weight of a phenolic novolac hardener; and (c) 5-60 parts by weight of a silica-novolac hybrid resin solution as a flame retardant.

Abstract translation: 本发明公开了一种具有非卤素，非磷阻燃剂的环氧树脂组合物，其包含（a）100重量份的环氧树脂; （b）40-60重量份酚醛清漆硬化剂; 和（c）5-60重量份作为阻燃剂的二氧化硅 - 酚醛清漆杂化树脂溶液。

公开(公告)号：US20010056147A1

公开(公告)日：2001-12-27

申请号：US09909732

申请日：2001-07-20

Inventor： Melvin A. Neiss

IPC: C08K003/18

CPC classification number: H05K3/386 ,  C08L2666/54 ,  C09J125/18 ,  C09J133/068 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0355 ,  Y10T428/31645 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/3175 ,  Y10T428/31797 ,  Y10T428/31913

Abstract: This invention is directed to an adhesive composition comprising: A. 80-98% by weight, based upon the total amount of adhesive dry solids, of at least one latex copolymer comprising: (1) 20-55% by weight, based upon the weight of the copolymer, of at least one brominated aromatic monomer, (2) 5-15% by weight, based upon the weight of the copolymer, of a monomer selected from the group consisting of glycidyl acrylate, glycidyl methacrylate, and mixtures thereof, and (3) 40-60% by weight, based upon the weight of the copolymer, of at least one non-brominated monofunctional(meth)acrylate monomer; (4) 0-10% by weight, based upon the weight of the copolymer, of a monomer selected from the group consisting of acrylonitrile, methacrylonitrile, and mixtures thereof; B. 0-10% by weight, based upon the total amount of adhesive dry solids, of at least one crosslinking agent; C. 1-10% by weight, based upon the total amount of adhesive dry solids, of at least one antimony oxide; and D. 0-15% by weight, based upon the total amount of adhesive dry solids, of at least one viscosity modifier.

Abstract translation: 本发明涉及一种粘合剂组合物，其包含：A.80-98重量％，基于粘合剂干固体的总量，至少一种胶乳共聚物，其包含：（1）20-55重量％，基于 共聚物的至少一种溴化芳族单体的重量，（2）基于共聚物重量的5-15重量％的选自丙烯酸缩水甘油酯，甲基丙烯酸缩水甘油酯及其混合物的单体， 和（3）基于共聚物重量的40-60重量％的至少一种非溴化单官能（甲基）丙烯酸酯单体; （4）0-10重量％，基于共聚物的重量，选自丙烯腈，甲基丙烯腈及其混合物的单体; B. 0-10重量％，基于粘合剂干固体的总量，至少一种交联剂; 基于粘合剂干固体的总量，1-10重量％的至少一种氧化锑; 和基于粘合剂干固体的总量的0-15重量％的至少一种粘度调节剂。

公开(公告)号：US20010049009A1

公开(公告)日：2001-12-06

申请号：US09730606

申请日：2000-12-07

Inventor： Nawalage Florence Cooray ,  Koji Tsukamoto ,  Takeshi Ishitsuka

IPC: B32B003/00 ,  H05K001/00

CPC classification number: H05K3/4661 ,  H05K1/0373 ,  H05K3/4602 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31511 ,  Y10T428/31515

Abstract: A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.

Abstract translation: 一种卤树脂阻燃绝缘环氧树脂组合物，其包含（1）环氧树脂，（2）环氧树脂固化剂，（3）间苯二酚型磷酸酯，（4）氢氧化铝和（ 5）环氧树脂的固化促进剂。 该组合物在电路板中形成绝缘层之后显示必要的阻燃性能和足够的绝缘性能，经受电镀工艺，并且不会导致形成的绝缘层的渗出。 还公开了包含由环氧树脂组合物形成的绝缘层的阻燃性能的电路板。

公开(公告)号：US06280839B1

公开(公告)日：2001-08-28

申请号：US09316205

申请日：1999-05-21

Applicant: Neil Brown ,  Michael Aggleton

Inventor： Neil Brown ,  Michael Aggleton

IPC: B32B516

CPC classification number: B32B27/18 ,  B32B5/28 ,  C01F7/021 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/19 ,  C01P2006/32 ,  C09C1/407 ,  C09K21/02 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2995

Abstract: A nonhygroscopic thermally stable aluminum hydroxide, which is particularly useful for the preparation of thermally stable and fire retardant laminates for printed circuit boards.

Abstract translation: 非吸湿热稳定型氢氧化铝，其特别可用于制备用于印刷电路板的热稳定和阻燃层压材料。

公开(公告)号：US6054509A

公开(公告)日：2000-04-25

申请号：US114278

申请日：1998-07-13

Applicant: Hitoshi Arai ,  Masahiro Yuyama ,  Yoshitsugu Eguchi

Inventor： Hitoshi Arai ,  Masahiro Yuyama ,  Yoshitsugu Eguchi

IPC: C08G59/50 ,  C09J163/00 ,  H05K1/00 ,  H05K3/28 ,  H05K3/38 ,  C08K3/22 ,  C08L63/02 ,  C08L63/04

CPC classification number: H05K3/386 ,  C08G59/5033 ,  C09J163/00 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K3/281

Abstract: Provided by the invention is a thermosetting adhesive composition suitable for use in the preparation of metal foil-laminated base sheets of flexible printed circuit boards and laminated product related thereto such as coverlay films and bonding sheets. The adhesive composition is a uniform blend which comprises: (A) an epoxy resin including a brominated epoxy resin to exhibit flame retardancy; (B) a combination of two or three kinds of different nitrile rubbers distinguishable relative to the iodine value and content of carboxyl groups at the molecular chain ends in a specified weight proportion; (C) a curing agent for the epoxy resin; and (D) a curing accelerator, with optional admixture of (E) an inorganic filler; and/or (F) a vulcanizing agent for the nitrile rubbers.

Abstract translation: 本发明提供一种热固性粘合剂组合物，适用于制备柔性印刷电路板的金属箔层压基片和与其相关的叠层产品，例如覆盖膜和粘合片。 粘合剂组合物是均匀的共混物，其包含：（A）包含溴化环氧树脂的环氧树脂以显示阻燃性; （B）两种或三种不同丁腈橡胶的组合相对于碘值和分子链上的羧基含量以指定的重量比例结束; （C）环氧树脂固化剂; 和（D）固化促进剂，（E）任选的无机填料的混合物; 和/或（F）丁腈橡胶的硫化剂。